2025 journal article

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 15(2), 295–308.

By: P. Zaghari, S. Sinha, D. Hopkins*  & J. Ryu

topics (OpenAlex): 3D IC and TSV technologies; Semiconductor Lasers and Optical Devices; Electronic Packaging and Soldering Technologies
Source: ORCID
Added: January 8, 2025