2019 journal article
Analysis and Experimental Quantification of 1.2-kV 4H-SiC Split-Gate Octagonal MOSFET
IEEE ELECTRON DEVICE LETTERS, 40(7), 1163β1166.
A1.2-kV rated 4H-SiC split-gate octagonal cell MOSFET (SG-OCTFET) is proposed and successfully fabricated in a 6-in foundry for the first time. The measured results quantify the benefits of the SG-OCTFET structure: improvement in high-frequency figures of merit (HF-FOM) (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> Γ C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gd</sub> ) by 1.8Γ, HF-FOM (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</sub> Γ Q <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gd</sub> ) by 1.6Γ, and FOM (C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">iss</sub> /C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gd</sub> ) by 1.6Γ compared with the optimized compact OCTFET design due to the reduced gate-to-drain overlap area. An important conclusion of this letter is that unlike commercially available 1.2-kV SiC power MOSFETs with linear cell topology, the 1.2-kV SG-OCTFET design can outperform commercially available 600-V Si super-junction devices.