2016 journal article

Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers

Journal of Electronic Materials, 45(11), 5877–5884.

co-author countries: United States of America πŸ‡ΊπŸ‡Έ

Contributors: K. Jagannadham  n

author keywords: Adhesion; porous polymer; modulus; thermal conductivity
Source: ORCID
Added: January 8, 2020