2017 journal article

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

By: X. Zhao, K. Jagannadham & D. Hopkins

Source: Crossref
Added: January 25, 2020