2012 journal article

A transient electrothermal analysis of three-dimensional integrated circuits

IEEE Transactions on Components Packaging and Manufacturing Technology, 2(4), 660–667.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega, R. Manohar, S. Dooley, N. Kriplani, W. Davis, P. Franzon, M. Steer

Source: NC State University Libraries
Added: August 6, 2018