2021 conference paper

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021