2021 journal article
A Wearable Ultrasonic Neurostimulator-Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC
IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS, 15(4), 705–718.
By: C. Seok, O. Adelegan, A. Biliroglu, F. Yamaner & O. Oralkan
