2020 article

Design and Test of Copper Printed RF Cavities

2020 IEEE 21ST INTERNATIONAL CONFERENCE ON VACUUM ELECTRONICS (IVEC 2020), pp. 149–150.

By: C. Nantista*, D. Gamzina, C. Ledford n, T. Horn , P. Carriere & P. Frigola*

author keywords: RF cavities; additive manufacturing; oxygen free high-conductivity copper; design for additive manufacturing
Source: Web Of Science
Added: October 26, 2021