2016 journal article

Thermal stress and high temperature effects on power devices in a fault-resilient NPC IGCT-based converter

IEEE Transactions on Power Electronics, 31(4), 2800–2807.

By: A. Rocha, S. Bhattacharya, G. Moghaddam, R. Gould, H. Paula & B. Cardoso

Source: NC State University Libraries
Added: August 6, 2018