2022 journal article

SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY.

By: T. Liu, H. Zhang, S. Isukapati, E. Ashik, A. Morgan, B. Lee, W. Sung, A. Fayed, M. White, A. Agarwal

Source: Web Of Science
Added: March 14, 2022