Toby Schaffer

Schaffer, T., Glaser, A., & Franzon, P. D. (2004, February). Chip-package co-implementation of a triple DES processor. IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 194–202. https://doi.org/10.1109/TADVP.2004.824944

Moyer, G. C., Clements, M., Liu, W. T., Schaffer, T., & Cavin, R. K. (1997). The delay vernier pattern generation technique. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 32(4), 551–562. https://doi.org/10.1109/4.563677