Hanyang Yang

Works (6)

Updated: July 5th, 2023 16:03

2007 journal article

Why is stereoregular polyacrylonitrile obtained by polymerization in urea canals isotactic?

MACROMOLECULAR THEORY AND SIMULATIONS, 16(9), 797–809.

By: H. Yang n, A. El-Shafei n , F. Schilling & A. Tonelli n

Contributors: H. Yang n, A. El-Shafei n , F. Schilling & A. Tonelli n

author keywords: cycloclextrin channels; inclusion compounds; isotactic polyacrylonitrile (PAN); molecular modeling; syndiotactic polyacrylonitrile (PAN); urea channels
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Sources: Web Of Science, ORCID
Added: August 6, 2018

2000 journal article

Intrinsic limitations on ultimate device performance and reliability at (i) semiconductor-dielectric interfaces and (ii) internal interfaces in stacked dielectrics

Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures, 18(4), 2179–2186.

By: G. Lucovsky, H. Yang, H. Niimi, M. Thorpe & J. Phillips

Source: NC State University Libraries
Added: August 6, 2018

2000 article

Plasma processed ultra-thin SiO2 interfaces far advanced silicon NMOS and PMOS devices: applications to Si-oxide Si oxynitride, Si-oxide Si nitride and Si-oxide transition metal oxide stacked gate dielectrics

Lucovsky, G., Yang, H. Y., Wu, Y., & Niimi, H. (2000, October 17). THIN SOLID FILMS, Vol. 374, pp. 217–227.

By: G. Lucovsky n, H. Yang n, Y. Wu n & H. Niimi n

author keywords: stacked gate dielectrics; semiconductor dielectric interfaces; silicon oxynitride alloys; transition metal oxides; CMOS devices; plasma-assisted oxidation; nitridation and deposition
Source: Web Of Science
Added: August 6, 2018

2000 article

Separate and independent reductions in direct tunneling in oxide/nitride stacks with monolayer interface nitridation associated with the (i) interface nitridation and (ii) increased physical thickness

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, Vol. 18, pp. 1163–1168.

By: G. Lucovsky n, Y. Wu n, H. Niimi n, H. Yang n, J. Keister  n & J. Rowe n

Source: Web Of Science
Added: August 6, 2018

1999 article

Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints

Conrad, H., Guo, Z., Fahmy, Y., & Yang, D. (1999, September). JOURNAL OF ELECTRONIC MATERIALS, Vol. 28, pp. 1062–1070.

By: H. Conrad n, Z. Guo  n, Y. Fahmy n & D. Yang n

author keywords: solder joints; low cycle fatigue; microstructure; deformation kinetics
UN Sustainable Development Goals Color Wheel
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15. Life on Land (OpenAlex)
Source: Web Of Science
Added: August 6, 2018

1998 journal article

Tunneling currents through ultrathin oxide/nitride dual layer gate dielectrics for advanced microelectronic devices

JOURNAL OF APPLIED PHYSICS, 83(4), 2327–2337.

By: H. Yang n, H. Niimi n & G. Lucovsky n

Source: Web Of Science
Added: August 6, 2018

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