1998 journal article
Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints
JOURNAL OF ELECTRONIC MATERIALS, 27(8), 941–947.
1997 article
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints
Hacke, P. L., Sprecher, A. F., & Conrad, H. (1997, July). JOURNAL OF ELECTRONIC MATERIALS, Vol. 26, pp. 774–782.
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