@article{hacke_fahmy_conrad_1998, title={Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints}, volume={27}, DOI={10.1007/s11664-998-0125-0}, number={8}, journal={Journal of Electronic Materials}, author={Hacke, P. L. and Fahmy, Y. and Conrad, H.}, year={1998}, pages={941–947} }
 @article{hacke_sprecher_conrad_1997, title={Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints}, volume={26}, DOI={10.1007/s11664-997-0251-0}, number={7}, journal={Journal of Electronic Materials}, author={Hacke, P. L. and Sprecher, A. F. and Conrad, H.}, year={1997}, pages={774–782} }