@article{hacke_fahmy_conrad_1998, title={Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints}, volume={27}, ISSN={["0361-5235"]}, DOI={10.1007/s11664-998-0125-0}, number={8}, journal={JOURNAL OF ELECTRONIC MATERIALS}, author={Hacke, PL and Fahmy, Y and Conrad, H}, year={1998}, month={Aug}, pages={941–947} }
 @article{hacke_sprecher_conrad_1997, title={Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints}, volume={26}, ISSN={["0361-5235"]}, DOI={10.1007/s11664-997-0251-0}, number={7}, journal={JOURNAL OF ELECTRONIC MATERIALS}, author={Hacke, PL and Sprecher, AF and Conrad, H}, year={1997}, month={Jul}, pages={774–782} }