High frequency loss and electromagnetic field distribution for striplines and microstrips [MCM packages]
Lo, H. L., Kauffman, J. F., & Franzon, P. D. (1999, January 1). IEEE Transactions on Advanced Packaging, Vol. 22, pp. 16–25.
author keywords: finite element method; measured equation of invariance; microstrip; multichip module; package design; propagation mode; triplate strip
topics (OpenAlex): Electromagnetic Compatibility and Noise Suppression; Electromagnetic Simulation and Numerical Methods; Electromagnetic Scattering and Analysis
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries