1999 article

High frequency loss and electromagnetic field distribution for striplines and microstrips [MCM packages]

Lo, H. L., Kauffman, J. F., & Franzon, P. D. (1999, January 1). IEEE Transactions on Advanced Packaging, Vol. 22, pp. 16–25.

By: H. Lo, J. Kauffman n & P. Franzon n

author keywords: finite element method; measured equation of invariance; microstrip; multichip module; package design; propagation mode; triplate strip
topics (OpenAlex): Electromagnetic Compatibility and Noise Suppression; Electromagnetic Simulation and Numerical Methods; Electromagnetic Scattering and Analysis
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2026) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.