Kyungjin Min

Min, K., Lamb, H. H., & Hauser, JR. (2001). Time-dependent Si etch behavior and its effect on oxide/Si selectivity in CF4+D-2 electron cyclotron resonance plasma etching. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 19(3), 695–700. https://doi.org/10.1116/1.1371318

Chambers, J. J., Min, K., & Parsons, G. N. (1998). Endpoint uniformity sensing and analysis in silicon dioxide plasma etching using in situ mass spectrometry. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 16(6), 2996–3002. https://doi.org/10.1116/1.590332

Yao, M. J., & Min, K. J. (1998). Repair-unit location models for power failures. IEEE TRANSACTIONS ON ENGINEERING MANAGEMENT, 45(1), 57–65. https://doi.org/10.1109/17.658661