Waeil Muhammed Al-Anwar Ashmawi

Works (11)

Updated: July 5th, 2023 16:02

2006 article

The modeling of the shock response of powdered ceramic materials

Rajendran, A. M., Ashmawi, W. M., & Zikry, M. A. (2006, January 27). Computational Mechanics, Vol. 38, pp. 1–13.

By: A. Rajendran  n, W. Ashmawi n & M. Zikry n 

Contributors: A. Rajendran  n, W. Ashmawi n & M. Zikry n 

author keywords: powdered ceramic; alumina; shock response; wave propagation; computational formulation; plate impact; two-cap model; inelastic yielding; shock-dependent plasticity
topics (OpenAlex): High-Velocity Impact and Material Behavior; High-pressure geophysics and materials; Powder Metallurgy Techniques and Materials
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Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2004 article

Modeling of residual stresses for thermally strained GaN/Al2O3 heterostructures

Ashmawi, W. M., Zikry, M. A., Wang, K., & Reeber, R. R. (2004, April 22). Journal of Crystal Growth, Vol. 266, pp. 415–422.

By: W. Ashmawi n, M. Zikry n , K. Wang n & R. Reeber n

Contributors: W. Ashmawi n, M. Zikry n , K. Wang n & R. Reeber n

author keywords: Einstein model; finite element; stresses; thermal mismatch; epitaxial growth; alumina; gallium nitride; transversely-isotropic materials
topics (OpenAlex): GaN-based semiconductor devices and materials; Metal and Thin Film Mechanics; Ga2O3 and related materials
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2003 article

Grain boundary effects and void porosity evolution

Ashmawi, W. M., & Zikry, M. A. (2003, January 10). Mechanics of Materials, Vol. 35, pp. 537–552.

By: W. Ashmawi n & M. Zikry n 

Contributors: W. Ashmawi n & M. Zikry n 

author keywords: grain boundary; porosity; dislocation-density interactions; interfacial mechanisms; void nucleation and growth; pile-ups; GB absorption
topics (OpenAlex): Microstructure and mechanical properties; Metal Forming Simulation Techniques; Metallurgy and Material Forming
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2003 article

Grain-boundary interfaces and void interactions in porous aggregates

Ashmawi, W. M., & Zikry†, M. A. (2003, October 1). The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, Vol. 83, pp. 3917–3944.

By: W. Ashmawi n & M. Zikry† n 

Contributors: W. Ashmawi n & M. Zikry n 

topics (OpenAlex): Drilling and Well Engineering; Metal Forming Simulation Techniques; Geotechnical Engineering and Underground Structures
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2002 article

Single void morphological and grain-boundary effects on overall failure in F.C.C. polycrystalline systems

Ashmawi, W. M., & Zikry, M. A. (2002, December 3). Materials Science and Engineering A, Vol. 343, pp. 126–142.

By: W. Ashmawi n & M. Zikry n 

Contributors: W. Ashmawi n & M. Zikry n 

author keywords: void morphology; microvoid nucleation and growth; porosity; grain-boundary; dislocation-density interactions; pile-ups; ductile failure
topics (OpenAlex): Metal Forming Simulation Techniques; Microstructure and mechanical properties; Corrosion Behavior and Inhibition
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2001 article

Lateral epitaxy and dislocation density reduction in selectively grown GaN structures

Zheleva, T. S., Nam, O.-H., Ashmawi, W. M., Griffin, J. D., & Davis, R. F. (2001, February 1). Journal of Crystal Growth.

By: T. Zheleva n, O. Nam n, W. Ashmawi n, J. Griffin n & R. Davis n

author keywords: epitaxy; selective growth; lateral epitaxial overgrowth; gallium nitride; pendeo-epitaxy; defects; transmission electron microscopy
topics (OpenAlex): GaN-based semiconductor devices and materials; Metal and Thin Film Mechanics; Ga2O3 and related materials
Source: Web Of Science
Added: August 6, 2018

2001 article

Prediction of Grain-Boundary Interfacial Mechanisms in Polycrystalline Materials

Ashmawi, W. M., & Zikry, M. A. (2001, July 16). Journal of Engineering Materials and Technology, Vol. 124, pp. 88–96.

By: W. Ashmawi n & M. Zikry n 

Contributors: W. Ashmawi n & M. Zikry n 

topics (OpenAlex): Microstructure and mechanical properties; Fatigue and fracture mechanics; High Temperature Alloys and Creep
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

2000 article

Effects of grain boundaries and dislocation density evolution on large strain deformation modes in fcc crystalline materials*

Ashmawi, W. M., & Zikry, M. A. (2000, January 1). Journal of Computer-Aided Materials Design, Vol. 7, pp. 55–62.

By: W. Ashmawi* & M. Zikry* 

Contributors: W. Ashmawi* & M. Zikry* 

author keywords: dislocation densities; failure; grain-boundaries; multiple-slip crystal plasticity; pile-ups
topics (OpenAlex): Microstructure and mechanical properties; Fatigue and fracture mechanics; Metallurgy and Material Forming
Sources: Web Of Science, NC State University Libraries, ORCID
Added: August 6, 2018

1999 journal article

Pendeo-epitaxy versus lateral epitaxial overgrowth of GaN: A comparative study via finite element analysis

Physica Status Solidi. A, Applications and Materials Science, 176(1), 545–551.

By: T. Zheleva, W. Ashmawi & K. Jones

Source: NC State University Libraries
Added: August 6, 2018

1999 journal article

Pendeo-epitaxy: A new approach for lateral growth of gallium nitride structures

MRS Internet Journal of Nitride Semiconductor Research, 4S1(G3.38).

By: T. Zheleva, S. Smith, D. Thomson, T. Gehrke, K. Linthicum, P. Rajagopal, E. Carlson, W. Ashmawi, R. Davis

Source: NC State University Libraries
Added: August 6, 2018

1999 article

Thermal mismatch stress relaxation via lateral epitaxy in selectively grown GaN structures

Zheleva, T. S., Ashmawi, W. M., Nam, O.-H., & Davis, R. F. (1999, April 26). Applied Physics Letters.

By: T. Zheleva n, W. Ashmawi n, O. Nam n & R. Davis n

topics (OpenAlex): GaN-based semiconductor devices and materials; Ga2O3 and related materials; Metal and Thin Film Mechanics
Source: Web Of Science
Added: August 6, 2018

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