Works (2)

Updated: July 5th, 2023 15:46

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar*, S. Dooley*, N. Kriplani n, W. Davis n ...

co-author countries: United States of America 🇺🇸
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n, M. Steer n, W. Davis n

co-author countries: Japan 🇯🇵 United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

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