2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE Trans CPMT, P(99), 1.

By: T. Harris, S. Priyadarshi, S. Melamed, C. Ortega, R. Manohar, S. Dooley, N. Kriplani, W. Davis ...

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

Sources: NC State University Libraries, ORCID
Added: August 6, 2018