Works (2)
Updated: July 5th, 2023 15:46
2012 article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
Harris, T. R., Priyadarshi, S., Melamed, S., Ortega, C., Manohar, R., Dooley, S. R., … al. (2012, January 12). IEEE Transactions on Components Packaging and Manufacturing Technology, p. 1.
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Electromagnetic Compatibility and Noise Suppression
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 article
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring
Melamed, S., Thorolfsson, T., Harris, T. R., Priyadarshi, S., Franzon, P., Steer, M. B., & Davis, W. R. (2012, April 20). IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 31, pp. 676–689.
topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; Silicon Carbide Semiconductor Technologies
TL;DR:
This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018