Works (2)
Updated: July 5th, 2023 15:46
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
TL;DR:
This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
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