2000 conference paper
Deformation mechanisms in tin and tin-based electronic solder alloys
Creep and fracture of engineering materials and structures: Proceedings of the ... International Conference held at the ..., 2000, 171(1), 655–662.
2000 journal article
High temperature deformation characteristics of tin-based solder alloys: Application to electronic packaging
Transactions of the Indian Institute of Metals, 53(3), 369–379.
1999 journal article
Ball indentation studies on the effect of aging on mechanical behavior of alloy 625
Materials Science & Engineering. A, Structural Materials: Properties, Microstructure and Processing, 264(1-2), 159–166.