@article{zhang_wilson_bashirullah_luo_xu_franzon_2007, title={Voltage-mode driver preemphasis technique for on-chip global buses}, volume={15}, ISSN={["1557-9999"]}, DOI={10.1109/TVLSI.2007.893588}, abstractNote={This paper demonstrates that driver preemphasis technique can be used for on-chip global buses to increase signal channel bandwidth. Compared to conventional repeater insertion techniques, driver preemphasis saves repeater layout complexity and reduces power consumption by 12%-39% for data activity factors above 0.1. A driver circuit architecture using voltage-mode preemphasis technique was tested in 0.18-mum CMOS technology for 10-mm long interconnects at 2 Gb/s}, number={2}, journal={IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS}, author={Zhang, Liang and Wilson, John M. and Bashirullah, Rizwan and Luo, Lei and Xu, Jian and Franzon, Paul D.}, year={2007}, month={Feb}, pages={231–236} }
 @misc{integrated circuit devices having on-chip adaptive bandwidth buses and related methods_2006, volume={7,110,420}, publisher={Washington, DC: U.S. Patent and Trademark Office}, year={2006} }
 @article{kendir_liu_wang_sivaprakasam_bashirullah_humayun_weiland_2005, title={An optimal design methodology for inductive power link with class-E amplifier}, volume={52}, ISSN={["1558-0806"]}, DOI={10.1109/TCSI.2005.846208}, abstractNote={This paper presents a design methodology of a highly efficient power link based on Class-E driven, inductively coupled coil pair. An optimal power link design for retinal prosthesis and/or other implants must take into consideration the allowable safety limits of magnetic fields, which in turn govern the inductances of the primary and secondary coils. In retinal prosthesis, the optimal coil inductances have to deal with the constraints of the coil sizes, the tradeoffs between the losses, H-field limitation and dc supply voltage required by the Class-E driver. Our design procedure starts with the formation of equivalent circuits, followed by the analysis of the loss of the rectifier and coils and the H-field for induced voltage and current. Both linear and nonlinear models for the analysis are presented. Based on the procedure, an experimental power link is implemented with an overall efficiency of 67% at the optimal distance of 7 mm between the coils. In addition to the coil design methodology, we are also presenting a closed-loop control of Class-E amplifier for any duty cycle and any value of the systemQ.}, number={5}, journal={IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS}, author={Kendir, GA and Liu, WT and Wang, GX and Sivaprakasam, M and Bashirullah, R and Humayun, MS and Weiland, JD}, year={2005}, month={May}, pages={857–866} }
 @article{jiang_liu_ortiz_bashirullah_mortazawi_2003, title={A K a-band power amplifier based on a low-profile slotted-waveguide power-combining/dividing circuit}, volume={51}, ISSN={["1557-9670"]}, DOI={10.1109/TMTT.2002.806927}, abstractNote={In this paper, a Ka-band power amplifier based on a resonant slotted-waveguide-to-microstrip power-dividing/combining circuit is presented. The advantages of this structure are its low profile, ease of fabrication, as well as its potential for high power-combining efficiency. In addition, efficient heat sinking of monolithic microwave integrated circuit (MMIC) devices is achieved. A slotted-waveguide power amplifier using eight MMIC amplifiers was designed and fabricated. The measured power-combining efficiency at 33 GHz is 72%. In addition, simulation results predicting the performance degradation of the slotted-waveguide power amplifier due to multiple device failure are presented.}, number={1}, journal={IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES}, author={Jiang, X and Liu, L and Ortiz, SC and Bashirullah, R and Mortazawi, A}, year={2003}, month={Jan}, pages={144–147} }
 @article{bashirullah_liu_cavin_2003, title={Current-mode signaling in deep submicrometer global interconnects}, volume={11}, ISSN={["1557-9999"]}, DOI={10.1109/TVLSI.2003.812366}, abstractNote={This paper addresses propagation delay and power dissipation for current mode signaling in deep submicrometer global interconnects. Based on the effective lumped element resistance and capacitance approximation of distributed RC lines, simple yet accurate closed-form expressions of delay and power dissipation are presented. A new closed-form solution of delay under step input excitation is first developed, exhibiting an accuracy that is within 5% of SPICE simulations for a wide range of parameters. The usefulness of this solution is that resistive load termination for current mode signaling is accurately modeled. This model is then extended to a generalized delay formulation for ramp inputs with arbitrary rise time. Using these expressions, the optimum-line width that minimizes the total delay for current mode circuits is found. Additionally, a new power-dissipation model for current-mode signaling is developed to understand the design tradeoffs between current and voltage sensing. Based on the results and derived formulations, a comparison between voltage and current mode repeater insertion for long global deep submicrometer interconnects is presented.}, number={3}, journal={IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS}, author={Bashirullah, R and Liu, WT and Cavin, RK}, year={2003}, month={Jun}, pages={406–417} }
 @article{liu_sivaprakasam_singh_bashirullah_wang_2003, title={Electronic visual prosthesis}, volume={27}, ISSN={["1525-1594"]}, DOI={10.1046/j.1525-1594.2003.07306.x}, abstractNote={Abstract:  Retinitis pigmentosa (RP) and age‐related macular degeneration (AMD) are incurable diseases that result in profound vision loss due to degeneration of the light sensing photoreceptors. However, the discovery that direct electrical stimulation of the retinal neurons creates visual sensation has inspired prosthetic devices aimed to restore useful vision in RP/AMD patients. The approach to one such electronic visual prosthesis is described in this article. The prosthesis consists of an external unit and an internal unit. The communication link has three components—power and data transfer from the external to the internal unit, and data transfer from the internal to the external unit. A novel method of integrating power transfer and back telemetry is described here. The goal is to design a stimulator chip with a small area with low power consumption. This chip, capable of stimulating 60 dedicated electrodes, is fabricated using AMI 1.2 µm process technology and the results are presented. Improvements in the design to increase the number of outputs to 1,000 have been discussed. The new circuit is aimed at increasing the circuit density, reducing power per stimulus, and meeting the requirements more closely than the previous designs. The results of the designed  chip  are presented.}, number={11}, journal={ARTIFICIAL ORGANS}, author={Liu, WT and Sivaprakasam, M and Singh, PR and Bashirullah, RS and Wang, GX}, year={2003}, month={Nov}, pages={986–995} }
 @article{bashirullah_liu_2002, title={Raised cosine approximation signalling technique for reduced simultaneous switching noise}, volume={38}, ISSN={["1350-911X"]}, DOI={10.1049/el:20020852}, abstractNote={A new technique for reducing noise crosstalk due to inductive effects in high-speed switching environments is presented. A signalling scheme based on raised cosine approximation (RCA) pulses is used to achieve gradual buffer turn on without any speed penalties. A new current-mode RCA line driver is proposed and incorporated in a 16 bit 1 Gbit/s off-chip transmitter. Simulation results based on TSMC 0.25 /spl mu/m show ground bounce noise reduction greater than 40%.}, number={21}, journal={ELECTRONICS LETTERS}, author={Bashirullah, R and Liu, W}, year={2002}, month={Oct}, pages={1256–1258} }
 @article{bashirullah_mortazawi_2000, title={A slotted-waveguide power amplifier for spatial power-combining applications}, volume={48}, ISSN={["0018-9480"]}, DOI={10.1109/22.848497}, abstractNote={A power-amplifier array based on a slotted-waveguide power divider is presented for quasi-optical applications. The advantages of this structure are its low profile and ease of fabrication. Furthermore, efficient heat sinking of power devices is achieved. An X-band version of the power amplifier using eight MESFET's was designed and fabricated. An output power of 14 W was obtained. At 10 GHz, the amplifier gain and power-combining efficiency were 6.7 dB and 88%, respectively. The 3-dB bandwidth for the circuit was approximately 5%. This technique has the potential to meet the increasing demand for solid-state power amplifiers used in millimeter-wave communications and radar systems.}, number={7}, journal={IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES}, author={Bashirullah, R and Mortazawi, A}, year={2000}, month={Jul}, pages={1142–1147} }