Hao Hua

Works (2)

Updated: July 5th, 2023 15:59

2005 article

Demystifying 3D ICs: The Pros and Cons of Going Vertical

Davis, W. R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., … Franzon, P. D. (2005, June 1). IEEE Design & Test of Computers, Vol. 22, pp. 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, J. Xu  n, H. Hua n, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; VLSI and FPGA Design Techniques; Semiconductor materials and devices
TL;DR: A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2002 article

Direct formation of self-assembled nanoporous aluminium oxide on SiO2and Si substrates

Cai, A., Zhang, H., Hua, H., & Zhang, Z. (2002, September 11). Nanotechnology.

By: A. Cai n, H. Zhang n, H. Hua n & Z. Zhang*

topics (OpenAlex): Anodic Oxide Films and Nanostructures; Corrosion Behavior and Inhibition; Semiconductor materials and devices
Source: Web Of Science
Added: August 6, 2018

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