Hao Hua

Works (2)

Updated: July 5th, 2023 15:59

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, M. Xu*, H. Hua*, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

TL;DR: A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2002 journal article

Direct formation of self-assembled nanoporous aluminium oxide on SiO2 and Si substrates

NANOTECHNOLOGY, 13(5), 627–630.

By: A. Cai n, H. Zhang n, H. Hua n & Z. Zhang*

Source: Web Of Science
Added: August 6, 2018

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