@article{lu_bora_tedder_rubloff_1998, title={Integrated dynamic simulation of rapid thermal chemical vapor deposition of polysilicon}, volume={11}, ISSN={["0894-6507"]}, DOI={10.1109/66.661286}, abstractNote={A physically-based dynamic simulator has been constructed to investigate the time-dependent behavior of equipment, process, sensor, and control systems for rapid thermal chemical vapor deposition (RTCVD) of polysilicon from SiH/sub 4/. The simulator captures the essential physics and chemistry of mass transport, heat transfer, and chemical kinetics of the RTCVD process as embodied in equipment. In order to complete the system-level description, reduced-order models are also employed to represent processes involving high complexity of physics. Integration of individual simulator elements for equipment, process, sensors, and control systems enables the evaluation of not only the deposition rate and film thickness, but also of a broad range of dynamic system properties such as equipment performance, gas flow conditions, wafer temperature variation, wafer optical properties (absorptivity/emissivity), reaction gas composition, total process cycle time, consumables volume, and reactant utilization. This makes the simulator directly applicable to the optimization of process recipes and equipment design, to process control strategy, and to fault classification. This case study of polysilicon RTCVD demonstrates (1) that integrated dynamic simulation is a versatile tool for representing system-level dynamics and (2) that such representation is pivotal in successful applications of modeling and simulation for manufacturing optimization and control.}, number={1}, journal={IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING}, author={Lu, GQ and Bora, M and Tedder, LL and Rubloff, GW}, year={1998}, month={Feb}, pages={63–74} }
 @article{lu_bora_rubloff_1997, title={Polysilicon RTCVD process optimization for environmentally-conscious manufacturing}, volume={10}, ISSN={["0894-6507"]}, DOI={10.1109/66.618212}, abstractNote={In the semiconductor manufacturing industry, optimization of advanced equipment and process designs must include both manufacturing metrics (such as cycle time, consumables cost, and product quality) and environmental consequences (such as reactant utilization and by-product emission). We have investigated the optimization of rapid thermal chemical vapor deposition (RTCVD) of polysilicon from SiH/sub 4/ as a function of process parameters using a physically-based dynamic simulation approach. The simulator captures essential time-dependent behaviors of gas flow, heat transfer, reaction chemistry, and sensor and control systems, and is validated by our experimental data. Significant improvements in SiH/sub 4/ utilization (up to 7/spl times/) and process cycle time (up to 3/spl times/) can be achieved by changes in 1) timing for initiating wafer heating relative to starting process gas flow; 2) process temperature (650-750/spl deg/C); and 3) gas flow rate (100-1000 seem). Enhanced gas utilization efficiency and reduced process cycle time provide benefits for both environmental considerations and manufacturing productivity (throughput). Dynamic simulation proves to be a versatile and powerful technique for identifying optimal process parameters and for assessing tradeoffs between various manufacturing and environmental metrics.}, number={3}, journal={IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING}, author={Lu, GQ and Bora, M and Rubloff, GW}, year={1997}, month={Aug}, pages={390–398} }