Candice Camille Scheffing

Scheffing, C. C., Jagannadham, K., Yim, M.-S., Bourham, M. A., Farmer, J. C., Haslam, J. J., … Yang, N. Y. (2006). Properties of titanium-nitride for high-level waste packaging enhancement. NUCLEAR TECHNOLOGY, 156(2), 213–221. https://doi.org/10.13182/NT156-213