2006 journal article
Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 153(12), G1064–G1071.
By: P. Visintin*, S. Eichenlaub n, L. Portnow*, R. Carbonell*, S. Beaudoin n, C. Schauer*, J. DeSimone n
