Works (1)

Updated: July 5th, 2023 15:55

2006 journal article

Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 153(12), G1064–G1071.

By: P. Visintin*, S. Eichenlaub n, L. Portnow*, R. Carbonell*, S. Beaudoin n, C. Schauer*, J. DeSimone n

co-author countries: United States of America 🇺🇸
Source: Web Of Science
Added: August 6, 2018

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