2006 journal article

Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films

Journal of the Electrochemical Society, 153(12), G1064–1071.

By: P. Visintin, S. Eichenlaub, L. Portnow, R. Carbonell, S. Beaudoin, C. Schauer, J. DeSimone

Source: NC State University Libraries
Added: August 6, 2018