Sean K. Eichenlaub

Works (1)

Updated: July 5th, 2023 15:55

2006 journal article

Studies on CO2-based slurries and fluorinated silica and alumina particles for chemical mechanical polishing of copper films

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 153(12), G1064–G1071.

By: P. Visintin*, S. Eichenlaub n, L. Portnow*, R. Carbonell*, S. Beaudoin  n, C. Schauer*, J. DeSimone n

topics (OpenAlex): Advanced Surface Polishing Techniques; Force Microscopy Techniques and Applications; Diamond and Carbon-based Materials Research
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