Dennis Defevere

Markham, K., Melkun, J. F., Rabbani, M., Winkler, C. R., Little, B., DeFevere, D. C., … Kish, F. (2025, December 22). Compound semiconductor direct wafer bonding by crystal heterogeneous integration. Applied Physics Letters. https://doi.org/10.1063/5.0282936