Douglas C Hopkins

Also known as: Douglas C Hopkins; Douglas C. Hopkins; Douglas Hopkins; D C Hopkins; D. C. Hopkins; DC Hopkins; DCHopkins

https://orcid.org/0000-0001-8915-7212

power electronics, power electronics packaging, pulsed power, SiC, GaN

Works (128)

2021 journal article

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

IEEE TRANSACTIONS ON POWER ELECTRONICS, 11.

By: H. Ke, U. Mehrotra & D. Hopkins

Sources: Web Of Science, ORCID
Added: August 16, 2021

2021 conference paper

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: D. Hopkins, W. Yu, U. Mehrotra, T. Cheng, S. Sinha, K. Maru, N. Mescia

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Phoenix, AZ.

By: U. Mehrotra & D. Hopkins

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC) at Phoenix, AZ on June 14-17, 2021

Sources: Crossref, ORCID, Web Of Science
Added: September 5, 2021

2021 conference paper

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: K. Maru & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

By: D. Hopkins, T. Cheng, U. Mehrotra & W. Yu

Event: IEEE Applied Power Electronics Conference on June 14-17, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 journal article

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.

By: U. Mehrotra, B. Ballard & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2021 conference paper

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: U. Mehrotra, A. Morgan & D. Hopkins

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID, Web Of Science
Added: September 4, 2021

2021 conference paper

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

By: S. Shah, S. Bhattacharya, A. Kanale, T. Cheng, U. Mehrotra, A. Agarwal, B. Baliga, D. Hopkins

Event: IEEE Energy Conversion Congress and Exposition at Vancouver, Canada on October 10-14, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: FREEDM System Center Annual Research Symposium at Raleigh, NC on March 17-18, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: U. Mehrotra, A. Morgan, M. McKeown & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2021 conference paper

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: A. Kanale, T. Cheng, S. Shah, K. Han, A. Agarwal, B. Baliga, D. Hopkins, S. Bhattacharya

Event: 2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID, Web Of Science
Added: September 4, 2021

2021 conference paper

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

By: T. Cheng & D. Hopkins

Event: IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21) on April 26-29, 2021

Source: NC State University Libraries
Added: September 9, 2021

2020 journal article

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

By: T. Cheng, K. Nishiguchi, Y. Fukawa, B. Baliga, S. Bhattacharya & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 speech

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

By: D. Hopkins

Event: NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices at Raleigh, NC on August 3-5, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: T. Cheng, U. Mehrotra & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 11, 2021

2020 conference paper

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: P. Murthy, U. Mehrotra, W. Yu & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

By: U. Mehrotra, B. Ballard & D. Hopkins

Event: 2020 IEEE Energy Conversion Congress and Exposition (ECCE) at Detroit, MI on October 11-15, 2020

Sources: Crossref, ORCID
Added: September 5, 2021

2020 journal article

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

By: U. Mehrotra, A. Brazzle, M. McKeown & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

By: U. Mehrotra, B. Ballard, T. Cheng, B. Baliga, S. Bhattacharya & D. Hopkins

Event: 2020 IEEE Transportation Electrification Conference & Expo (ITEC)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 conference paper

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

By: U. Mehrotra, T. Cheng, A. Kanale, A. Agarwal, K. Han, B. Baliga, S. Bhattacharya, D. Hopkins

Event: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Sources: Crossref, ORCID
Added: September 5, 2021

2020 speech

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

By: S. Sinha & D. Hopkins

Event: FREEDM Systems Center & PREES Lab, NC State University at Raleigh, NC on January 24, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

By: U. Mehrotra, A. Morgan & D. Hopkins

Event: Power America Institute Annual Meeting at Raleigh, NC on February 25-27, 2020

Source: NC State University Libraries
Added: September 9, 2021

2020 conference paper

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

By: D. Hopkins, T. Cheng & U. Mehrotra

Event: Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC) on July 23, 2020

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

By: A. Kanale, T. Cheng, K. Hanl, B. Baliga, S. Bhattacharya & D. Hopkins

Event: International Conference on Silicon Carbide and Related Materials at Kyoto, Japan on September 29 - October 4, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

By: B. Gao, U. Mehrotra & D. Hopkins

Event: 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

Sources: Crossref, ORCID
Added: September 5, 2021

2019 conference paper

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

By: D. Hopkins, T. Cheng, B. Gao & L. Boteler

Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

By: T. Cheng, B. Gao, L. Boteler & D. Hopkins

Event: PCB Carolina at Raleigh, NC on November 13, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.

By: B. Ballard, U. Mehrotra & D. Hopkins

Event: Power America Annual Meeting at Raleigh, NC on February 12-14, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

By: T. Cheng, B. Gao, K. Nishiguchi & D. Hopkins

Event: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) at Anaheim, CA on October 7-9, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

By: D. Hopkins, B. Ballard & U. Mehrotra

Event: IEEE Applied Power Electronics Conference at Anaheim, CA on March 17-21, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

By: B. Ballard, U. Mehrotra & D. Hopkins

Event: 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA at Raleigh, NC on October 29-31, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: M. Guven, B. Gao & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

By: S. Sinha, B. Ballard & D. Hopkins

Event: Power America Summer Workshop at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 report

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

By: J. Kulick & D. Hopkins

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

High Frequency Self-Oscillating WBG-based Power Conversion

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

By: A. Morgan, B. Gao & D. Hopkins

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).

By: A. Morgan, A. Kanale, K. Han, J. Baliga & D. Hopkins

Event: 2019 IEEE Applied Power Electronics Conference and Exposition (APEC)

Sources: Crossref, ORCID
Added: August 30, 2021

2019 conference paper

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

By: A. Morgan, A. Kanale, K. Han, J. Baliga & D. Hopkins

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: D. Hopkins & B. Ballard

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

By: D. Hopkins

Event: A.R.E.A. Consortium Meeting Universal Instruments at Binghamton, NY on March 27-29, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

By: A. Jorgensen, T. Cheng, D. Hopkins, S. Beczkowski, C. Uhrenfeldt & S. Munk-Nielsen

Event: 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe)

Sources: Crossref, ORCID
Added: September 5, 2021

2019 conference paper

Trends in Power Electronics Packaging

Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

By: D. Hopkins

Event: FREEDM Systems Center Annual Research Symposium at Raleigh, NC on April 10-12, 2019

Source: NC State University Libraries
Added: September 9, 2021

2019 conference paper

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

By: U. Mehrotra & D. Hopkins

Event: Power America Summer Workshop 2019 at Raleigh, NC on August 6-8, 2019

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

By: B. Gao, A. Morgan, Y. Xu, X. Zhao & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 conference paper

6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

By: B. Gao, A. Morgan, Y. Xu, X. Zhao, B. Ballard & D. Hopkins

Event: 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

Sources: Crossref, ORCID
Added: September 5, 2021

2018 conference paper

6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

By: B. Gao, A. Morgan, Y. Xu, X. Zhao & D. Hopkins

Event: PowerAmerica Annual Meeting at Raleigh, NC on February 6-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis

Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

By: T. Chen & D. Hopkins

Event: PowerAmerica Annual Meeting at Raleigh, NC on February 6-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 journal article

Design, package, and hardware verification of a high-voltage current switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 conference paper

Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis

Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

By: C. Golding & D. Hopkins

Event: FREEDM Systems Center Annual Meeting at Raleigh, NC on June 7-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)

Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

By: D. Hopkins

Event: International Symposium on 3D Power Electronics Integration and Manufacturing at College Park, MD on June 25-27, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao, X. Zhao & D. Hopkins

Event: 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2018 conference paper

New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

By: K. Han, A. Kanale, B. Baliga, B. Ballard, A. Morgan & D. Hopkins

Event: 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

Sources: Crossref, ORCID
Added: September 5, 2021

2018 conference paper

Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module

Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

By: M. Guven & D. Hopkins

Event: FREEDM Systems Center Annual Meeting at Raleigh, NC on June 7-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.

By: X. Zhao, B. Gao, L. Zhang, D. Hopkins & A. Huang

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 conference paper

Scalable MV/HV Super Cascode Power Module

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

By: B. Gao, A. Morgan & D. Hopkins

Event: FREEDM Systems Center Annual Meeting at Raleigh, NC on June 7-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2018 conference paper

Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications

Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

By: A. Morgan & D. Hopkins

Event: FREEDM Systems Center Annual Meeting at Raleigh, NC on June 7-8, 2018

Source: NC State University Libraries
Added: September 9, 2021

2017 journal article

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

By: A. Morgan, X. Zhao, J. Rouse & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 conference paper

Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality

2017 ieee energy conversion congress and exposition (ecce), 4011–4018.

By: X. Zhao, B. Gao, Y. Jiang, L. Zhang, S. Wang, Y. Xu, K. Nishiguchi, Y. Fukawa, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 journal article

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

By: H. Ke, Y. Jiang, A. Morgan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 journal article

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

By: X. Zhao, K. Jagannadham & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2017 conference paper

Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module

2017 ieee 67th electronic components and technology conference (ectc 2017), 1461–1467.

By: X. Zhao, Y. Jiang, B. Gao, K. Nishiguchi, Y. Fukawa & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 conference paper

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

By: A. Morgan, L. Choobineh, D. Fresne & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 journal article

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

By: X. Zhao, H. Ke, Y. Jiang, A. Morgan, Y. Xu & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: B. Gao & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

By: X. Zhao, Y. Xu & D. Hopkins

Event: 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

Sources: Crossref, ORCID
Added: September 5, 2021

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan, Y. Xu, D. Hopkins, I. Husain & W. Yu

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

2016 ieee energy conversion congress and exposition (ecce).

By: D. Rahman, A. Morgans, Y. Xu, R. Gao, W. Yu, D. Hopkins, I. Husain

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Apec 2016 31st annual ieee applied power electronics conference and exposition, 295–302.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Development of an ultra-high density power chip on bus (PCoB) module

2016 ieee energy conversion congress and exposition (ecce).

By: Y. Xu, I. Husain, H. West, W. Yu & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

FEA-based thermal-mechanical optimization for DBC based power modules

2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

By: Y. Xu & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2016 journal article

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

By: X. Zhao, K. Jagannadham, W. Reainthippayasakul, M. Lanagan & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2015 journal article

A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

International Symposium on Microelectronics, 2015(1), 000359–000364.

By: A. Morgan, A. De, H. Ke, X. Zhao, K. Vechalapu, D. Hopkins, S. Bhattacharya

Sources: Crossref, ORCID
Added: September 5, 2021

2015 conference paper

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

By: A. De, A. Morgan, S. Bhattacharya & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2015 conference paper

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.

By: W. Sung, A. Huang, B. Baliga, I. Ji, H. Ke & D. Hopkins

Event: 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD)

Sources: NC State University Libraries, ORCID, Crossref
Added: August 6, 2018

2014 journal article

Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development

International Symposium on Microelectronics, 2014(1), 000887–000892.

By: H. Ke, A. Morgan, R. Aman & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2014 conference paper

Misconception of thermal spreading angle and misapplication to IGBT power modules

2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.

By: Y. Xu & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 journal article

Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package

International Symposium on Microelectronics, 2013(1), 000758–000763.

By: H. Ke, Y. Xu & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2013 conference paper

Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer

IEEE Transactions on Industry Applications, 49(1), 316–321.

By: K. Bhat, K. Oh & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Development of Printed Power Packaging for a High Voltage SiC Module

International Symposium on Microelectronics, 2012(1), 000955–000960.

By: H. Ke & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2012 journal article

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.

By: D. Hopkins, T. Baltis, J. Pitaress & D. Hazelmyer

Sources: Crossref, ORCID
Added: September 5, 2021

2012 conference paper

Mean time to failure of SnAgCuNi solder joints under DC

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

By: C. Basaran, S. Li, D. Hopkins & W. Yao

Event: 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Sources: Crossref, ORCID
Added: September 5, 2021

2012 conference paper

Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.

By: K. Bhat, Y. Guo, Y. Xu, T. Baltis, D. Hazelmyer & D. Hopkins

Event: 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 at Orlando, FL on February 5-9, 2012

Sources: Crossref, ORCID
Added: September 5, 2021

2011 journal article

High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

International Symposium on Microelectronics, 2011(1), 000608–000618.

By: T. Baltis, D. Hopkins, J. Pitaressi & D. Hazelmyer

Sources: Crossref, ORCID
Added: September 5, 2021

2011 conference paper

High current and thermal transient design of a SiC SSPC for aircraft application

2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.

By: Y. Guo, K. Bhat, A. Aravamudhan, D. Hopkins & D. Hazelmyer

Event: 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011

Sources: Crossref, ORCID
Added: September 5, 2021

2011 chapter

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).

By: D. Hopkins

Ed(s): M. Rashid

Sources: Crossref, ORCID
Added: September 5, 2021

2010 conference paper

A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment

2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.

By: K. Bhat, K. Oh & D. Hopkins

Event: 2010 IEEE Industry Applications Society Annual Meeting

Sources: Crossref, ORCID
Added: September 5, 2021

2010 journal article

Development of a SiC SSPC Module with Advanced High Temperature Packaging

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.

By: D. Hopkins, Y. Guo, H. Dwyer & J. Scofield

Sources: Crossref, ORCID
Added: September 5, 2021

2009 journal article

A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks

IEEE Transactions on Power Delivery, 24(3), 1234–1239.

By: A. Hosny, D. Hopkins, Z. Gay & M. Safiuddin

Sources: Crossref, ORCID
Added: September 5, 2021

2009 journal article

Electromigration time to failure of SnAgCuNi solder joints

Journal of Applied Physics, 106(1), 013707.

By: C. Basaran, S. Li, D. Hopkins & D. Veychard

Sources: Crossref, ORCID
Added: September 5, 2021

2007 chapter

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).

By: D. Hopkins

Ed(s): M. Rashid

Sources: Crossref, ORCID
Added: September 5, 2021

2006 journal article

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

International Journal of Damage Mechanics, 15(1), 41–67.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2006 conference paper

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.

By: M. Abdulhamid, C. Basaran & D. Hopkins

Event: ASME 2006 International Mechanical Engineering Congress and Exposition

Sources: Crossref, ORCID
Added: September 5, 2021

2006 conference paper

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.

By: D. Hopkins, D. Kellerman, R. Wunderlich, C. Basaran & J. Gomez

Event: Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. at Dallas, TX on March 19-23, 2006

Sources: Crossref, ORCID
Added: September 5, 2021

2005 conference paper

Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing

Proceedings Electronic Components and Technology, 2005. ECTC '05. Presented at the 2005 55th Electronic Components and Technology Conference.

By: H. Ye, C. Basaran, D. Hopkins & M. Lin

Event: 2005 55th Electronic Components and Technology Conference

Sources: Crossref, ORCID
Added: September 5, 2021

2004 conference paper

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

By: H. Ye, C. Basaran, D. Hopkins, D. Frear & J. Lin

Event: 2004 54th Electronic Components and Technology Conference at Las Vegas, NV on June 4, 2004

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

By: C. Basaran, H. Ye, D. Hopkins, D. Frear & J. Lin

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2004 journal article

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

By: H. Ye, D. Hopkins & C. Basaran

Sources: Crossref, ORCID
Added: September 4, 2021

2003 journal article

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

By: D. Hopkins & J. Moronski

Event: APEC 2002 - Applied Power Electronics Conference and Exposition at Dallas, TX on March 10-14, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 conference paper

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

By: H. Ye, C. Basaran, D. Hopkins & A. Cartwright

Event: ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems at San Diego, CA on May 30 - June 1, 2002

Sources: Crossref, ORCID
Added: September 5, 2021

2003 journal article

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

By: H. Ye, C. Basaran & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: D. Hopkins, S. Mathuna, A. Alderman & J. Flannery

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: A. Craig, D. Hopkins & J. Driscoll

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

By: D. Hopkins & J. Bowers

Event: 16th Annual Applied Power Electronics Conference - APEC 2001 at Anaheim, CA on March 4-8, 2001

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

By: H. Ye, C. Basaran & D. Hopkins

Event: ASME 2002 International Mechanical Engineering Congress and Exposition

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

By: J. Jacobsen & D. Hopkins

Event: APEC 2000 - Applied Power Electronics Conference at New Orleans, LA on February 6-10, 2000

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

By: J. Bowers, D. Hopkins & W. Sarjeant

Event: APEC 97 - Applied Power Electronics Conference at Atlanta, GA on February 27, 1997

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

By: J. Bowers, D. Hopkins & W. Sarjeant

Event: APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition at Anaheim, CA on February 15-19, 1998

Sources: Crossref, ORCID
Added: September 5, 2021

2002 conference paper

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

By: D. Hopkins & D. Root

Event: 1994 Power Electronics Specialist Conference - PESC'94 at Taipei, Taiwan on June 20-25, 1994

Sources: Crossref, ORCID
Added: September 5, 2021

1994 conference paper

A mathematical approach to minimize the total mass of a space based power system by using multivariable non-linear optimization

Intersociety Energy Conversion Engineering Conference. Presented at the Intersociety Energy Conversion Engineering Conference, Monterey, CA.

By: D. Hopkins & M. Sarkar

Event: Intersociety Energy Conversion Engineering Conference at Monterey, CA on August 7-12, 1994

Sources: Crossref, ORCID
Added: September 5, 2021

1993 journal article

Dynamic equalization during charging of serial energy storage elements

IEEE Transactions on Industry Applications, 29(2), 363–368.

By: D. Hopkins, C. Mosling & S. Hung

Sources: Crossref, ORCID
Added: September 5, 2021

1993 journal article

Extension of battery life via charge equalization control

IEEE Transactions on Industrial Electronics, 40(1), 96–104.

By: S. Hung, D. Hopkins & C. Mosling

Sources: Crossref, ORCID
Added: September 5, 2021

1991 conference paper

The use of equalizing converters for serial charging of long battery strings

[Proceedings] APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition. Presented at the APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition, Dallas, TX.

By: D. Hopkins, C. Mosling & S. Hung

Event: APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition at Dallas, TX on March 10-15, 1991

Sources: Crossref, ORCID
Added: September 5, 2021

1989 journal article

Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters

IEEE Transactions on Power Electronics, 4(1), 136–146.

By: M. Jovanovic, D. Hopkins & F. Lee

Sources: Crossref, ORCID
Added: September 5, 2021

1989 journal article

Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter

IEEE Transactions on Power Electronics, 4(1), 147–154.

By: D. Hopkins, M. Jovanovic, F. Lee & F. Stephenson

Sources: Crossref, ORCID
Added: September 5, 2021

1989 journal article

Plated copper on ceramic substrates for power hybrid circuits

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(4), 530–536.

By: R. Johnson, R. Weeks, D. Hopkins, J. Muir & J. Williams

Sources: Crossref, ORCID
Added: September 5, 2021

1989 conference paper

Thick-film power hybridization of switchmode power circuits

Proceedings, Fourth Annual IEEE Applied Power Electronics Conference and Exposition. Presented at the Fourth Annual IEEE Applied Power Electronics Conference and Exposition, Baltimore, MD.

By: D. Hopkins

Event: Fourth Annual IEEE Applied Power Electronics Conference and Exposition at Baltimore, MD on March 13-17, 1989

Sources: Crossref, ORCID
Added: September 5, 2021

1987 conference paper

Two-megahertz off-line hybridized quasi-resonant converter

1987 IEEE Applied Power Electronics conference and Exposition. Presented at the IEEE Applied Power Conference and Exposition, San Diego, CA.

By: D. Hopkins, M. Jovanovicm, F. Lee & F. Stephenson

Event: IEEE Applied Power Conference and Exposition at San Diego, CA on March 2-6, 1987

Sources: Crossref, ORCID
Added: September 5, 2021

1981 journal article

Characteristic Input Harmonics of DC-DC Converters and their Effect on Input Filter Design

IEEE Transactions on Industrial Electronics and Control Instrumentation, IECI-28(2), 73–82.

By: R. Steigerwald & D. Hopkins

Sources: Crossref, ORCID
Added: September 5, 2021

1969 conference paper

Plated copper on ceramic for power hybrid applications

Proceedings., 39th Electronic Components Conference. Presented at the 39th Electronic Components Conference, Houston, TX.

By: R. Weeks, R. Johnson, D. Hopkins, J. Muir & J. Williams

Event: 39th Electronic Components Conference at Houston, TX on May 22-23, 1969

Sources: Crossref, ORCID
Added: September 5, 2021

Employment

2011 - present

North Carolina State University Raleigh, North Carolina, US
Professor Electrical and Computer Engineering

2008 - 2014

Dense Power, LLC Vestal, NY, US
President & CTO Corporate

1997 - 2011

University at Buffalo Buffalo, NY, US
Professor (Research) Electrical

Education

Virginia Tech Blacksburg, Virginia, US
PhD Electrical Engineering

Funding History

Funding history based on the linked ORCID record.

award March 1, 2021
Module Design Using Advanced Power Packaging Technology for Near Term Commercialization
Power America Institute
contract January 1, 2020 - March 1, 2021
Fabrication of a High-Power Capacitor Tester (HPCT) for Advanced Capacitor Testing
PREES Fabrication Service Center
award January 1, 2020
HENKEL Material Testing Services
PREES Fabrication Service Center
award July 1, 2019 - June 1, 2020
Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing
U.S. Department of Energy
contract January 1, 2019 - December 1, 2021
PV Inverter Systems Enabled by Monolithically Integrated SiC based Four Quadrant Power Switch (4-QPS)
U.S. Department of Energy
contract March 1, 2018 - September 1, 2021
Highly Robust Integrated Power Electronics Packaging Technology
U.S. Department of Defense
award February 1 - December 1, 2018
Modeling and Packaging Design of a High Power Density 150A Silicon Carbide Inverter
U.S. Department of Energy
award December 1, 2016 - October 1, 2017
WBG Gate Oxide Characterization Project
U.S. Department of Energy
award June 1, 2016 - December 1, 2017
Demonstration of a Medium Voltage Power Module for High Density Conversion
U.S. Department of Energy
grant January 1 - December 1, 2016
Flexible Ceramic Substrate (FCS) Based Power
Texas Instruments
contract July 1, 2015 - September 1, 2016
Development and Testing of Silicon Carbide Gate Turn-Off Thyristor Based High Power Solid State Circuit Breaker (SSCB) for DC Power Distribution System
ABB Research, North America
contract June 1, 2015 - May 1, 2016
SiC Inverter for Electric Vehicle Traction Drive
U.S. Department of Energy
contract May 1, 2014 - November 1, 2020
Power America Institute
U.S. Department of Energy
award September 1, 2013 - August 1, 2016
Post Silicon Devices Test Packaging
National Science Foundation
grant January 6 - September 30, 2011
Intelligent, Fault Tolerant, and Robust Power Management for Aircraft Applications
United States Department of the Navy
award January 1, 2011 - December 1, 2013
Multi-Institutional Curriculum Development and Delivery to Create the New Smart Grid Workforce
U.S. Department of Energy
contract January 1, 2011 - June 1, 2012
Intelligent, Fault Tolerant, and Robust SSPC for Aircraft Applications
U.S. Navy
contract August 1, 2010 - July 1, 2013
Workforce Training for the Electric Power Sector
U.S. Department of Energy
grant June 25, 2008 - June 25, 2010
High Reliability SiC Power Switch Module Packaging
United States Department of the Air Force
contract June 1, 2008 - December 1, 2010
High Reliability SiC Power Switch Module Packaging
Air Force Research Laboratory
grant February 16, 2007 - February 16, 2008
High Reliability SiC Power Switch Module Packaging
United States Department of the Air Force
grant December 18, 2003 - June 15, 2004
SiC Power Converter
United States Department of the Navy
contract
Power Electronics SME Support of 2a EDG Diode Failure RCE
Duke Energy