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2018 conference paper
6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.
2018 journal article
Design, package, and hardware verification of a high-voltage current switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.
2018 conference paper
Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.
2017 conference paper
Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality
2017 ieee energy conversion congress and exposition (ecce), 4011–4018.
2017 conference paper
Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module
2017 ieee 67th electronic components and technology conference (ectc 2017), 1461–1467.
2017 conference paper
Numerical and experimental determination of temperature distribution in 3D stacked power devices
Exhibition on packaging and integration of electronic and photonic.
2016 conference paper
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.
2016 conference paper
Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules
2016 ieee energy conversion congress and exposition (ecce).
2016 conference paper
Design, package, and hardware verification of a high voltage current switch
Apec 2016 31st annual ieee applied power electronics conference and exposition, 295–302.
2016 conference paper
Development of an ultra-high density power chip on bus (PCoB) module
2016 ieee energy conversion congress and exposition (ecce).
2016 conference paper
FEA-based thermal-mechanical optimization for DBC based power modules
2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).
2015 conference paper
Design considerations of packaging a high voltage current switch
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.
2015 conference paper
The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor
Proceedings of the international symposium on power semiconductor, 257–260.
2014 conference paper
Misconception of thermal spreading angle and misapplication to IGBT power modules
2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.
2013 conference paper
Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer
IEEE Transactions on Industry Applications, 49(1), 316–321.
