Douglas C Hopkins

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

IEEE TRANSACTIONS ON POWER ELECTRONICS, 11.

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), Phoenix, AZ.

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, 1–1.

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2021 IEEE Applied Power Electronics Conference and Exposition (APEC).

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

High Frequency Self-Oscillating WBG-based Power Conversion

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

Trends in Power Electronics Packaging

Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis

Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Design, package, and hardware verification of a high-voltage current switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis

Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)

Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module

Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.

Scalable MV/HV Super Cascode Power Module

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications

Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality

2017 ieee energy conversion congress and exposition (ecce), 4011–4018.

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module

2017 ieee 67th electronic components and technology conference (ectc 2017), 1461–1467.

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

2016 ieee energy conversion congress and exposition (ecce).

Design, package, and hardware verification of a high voltage current switch

Apec 2016 31st annual ieee applied power electronics conference and exposition, 295–302.

Development of an ultra-high density power chip on bus (PCoB) module

2016 ieee energy conversion congress and exposition (ecce).

FEA-based thermal-mechanical optimization for DBC based power modules

2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

International Symposium on Microelectronics, 2015(1), 000359–000364.

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.

Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development

International Symposium on Microelectronics, 2014(1), 000887–000892.

Misconception of thermal spreading angle and misapplication to IGBT power modules

2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.

Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package

International Symposium on Microelectronics, 2013(1), 000758–000763.

Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer

IEEE Transactions on Industry Applications, 49(1), 316–321.

Development of Printed Power Packaging for a High Voltage SiC Module

International Symposium on Microelectronics, 2012(1), 000955–000960.

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.

Mean time to failure of SnAgCuNi solder joints under DC

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.

High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

International Symposium on Microelectronics, 2011(1), 000608–000618.

High current and thermal transient design of a SiC SSPC for aircraft application

2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).

A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment

2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.

Development of a SiC SSPC Module with Advanced High Temperature Packaging

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.

A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks

IEEE Transactions on Power Delivery, 24(3), 1234–1239.

Electromigration time to failure of SnAgCuNi solder joints

Journal of Applied Physics, 106(1), 013707.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

International Journal of Damage Mechanics, 15(1), 41–67.

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.

Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing

Proceedings Electronic Components and Technology, 2005. ECTC '05. Presented at the 2005 55th Electronic Components and Technology Conference.

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

A mathematical approach to minimize the total mass of a space based power system by using multivariable non-linear optimization

Intersociety Energy Conversion Engineering Conference. Presented at the Intersociety Energy Conversion Engineering Conference, Monterey, CA.

Dynamic equalization during charging of serial energy storage elements

IEEE Transactions on Industry Applications, 29(2), 363–368.

Extension of battery life via charge equalization control

IEEE Transactions on Industrial Electronics, 40(1), 96–104.

The use of equalizing converters for serial charging of long battery strings

[Proceedings] APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition. Presented at the APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition, Dallas, TX.

Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters

IEEE Transactions on Power Electronics, 4(1), 136–146.

Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter

IEEE Transactions on Power Electronics, 4(1), 147–154.

Plated copper on ceramic substrates for power hybrid circuits

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(4), 530–536.

Thick-film power hybridization of switchmode power circuits

Proceedings, Fourth Annual IEEE Applied Power Electronics Conference and Exposition. Presented at the Fourth Annual IEEE Applied Power Electronics Conference and Exposition, Baltimore, MD.

Two-megahertz off-line hybridized quasi-resonant converter

1987 IEEE Applied Power Electronics conference and Exposition. Presented at the IEEE Applied Power Conference and Exposition, San Diego, CA.

Characteristic Input Harmonics of DC-DC Converters and their Effect on Input Filter Design

IEEE Transactions on Industrial Electronics and Control Instrumentation, IECI-28(2), 73–82.

Plated copper on ceramic for power hybrid applications

Proceedings., 39th Electronic Components Conference. Presented at the 39th Electronic Components Conference, Houston, TX.