2018 conference paper

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

By: B. Gao, A. Morgan, Y. Xu, X. Zhao & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 journal article

Design, package, and hardware verification of a high-voltage current switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2018 conference paper

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.

By: X. Zhao, B. Gao, L. Zhang, D. Hopkins & A. Huang

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 conference paper

Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality

2017 ieee energy conversion congress and exposition (ecce), 4011–4018.

By: X. Zhao, B. Gao, Y. Jiang, L. Zhang, S. Wang, Y. Xu, K. Nishiguchi, Y. Fukawa, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 conference paper

Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module

2017 ieee 67th electronic components and technology conference (ectc 2017), 1461–1467.

By: X. Zhao, Y. Jiang, B. Gao, K. Nishiguchi, Y. Fukawa & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2017 conference paper

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

By: A. Morgan, L. Choobineh, D. Fresne & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

By: A. Morgan, Y. Xu, D. Hopkins, I. Husain & W. Yu

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

2016 ieee energy conversion congress and exposition (ecce).

By: D. Rahman, A. Morgans, Y. Xu, R. Gao, W. Yu, D. Hopkins, I. Husain

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Design, package, and hardware verification of a high voltage current switch

Apec 2016 31st annual ieee applied power electronics conference and exposition, 295–302.

By: A. De, A. Morgan, V. Iyer, H. Ke, X. Zhao, K. Vechalapu, S. Bhattacharya, D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

Development of an ultra-high density power chip on bus (PCoB) module

2016 ieee energy conversion congress and exposition (ecce).

By: Y. Xu, I. Husain, H. West, W. Yu & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2016 conference paper

FEA-based thermal-mechanical optimization for DBC based power modules

2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

By: Y. Xu & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2015 conference paper

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

By: A. De, A. Morgan, S. Bhattacharya & D. Hopkins

Source: NC State University Libraries
Added: August 6, 2018

2015 conference paper

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

Proceedings of the international symposium on power semiconductor, 257–260.

By: W. Sung, A. Huang, B. Baliga, I. Ji, H. Ke & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2014 conference paper

Misconception of thermal spreading angle and misapplication to IGBT power modules

2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.

By: Y. Xu & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer

IEEE Transactions on Industry Applications, 49(1), 316–321.

By: K. Bhat, K. Oh & D. Hopkins

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

Employment

2011 - present

North Carolina State University Raleigh, North Carolina, US
Professor Electrical and Computer Engineering

Education

Virginia Tech Blacksburg, Virginia, US
PhD Electrical Engineering

Funding History

Funding history based on the linked ORCID record.

grant January 6 - September 30, 2011
Intelligent, Fault Tolerant, and Robust Power Management for Aircraft Applications
United States Department of the Navy
grant June 25, 2008 - June 25, 2010
High Reliability SiC Power Switch Module Packaging
United States Department of the Air Force
grant February 16, 2007 - February 16, 2008
High Reliability SiC Power Switch Module Packaging
United States Department of the Air Force
grant December 18, 2003 - June 15, 2004
SiC Power Converter
United States Department of the Navy