Douglas C Hopkins

3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

IEEE TRANSACTIONS ON POWER ELECTRONICS, ["36"](11), ["13057–13066"].

A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

A New Cascaded SuperCascode High Voltage Power Switch

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), ["2251–2257"].

Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.

Advances in Highly Thermally Conductive Organic Power Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Analytical Method to Optimize the Cascaded SuperCascode Power Switch Balancing Network

2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. ["107–111"].

Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems

IEEE Journal of Emerging and Selected Topics in Power Electronics, ["10"](4), 1–1.

Comparison of the Capacitances and Switching Losses of 1.2 kV Common-Source and Common-Drain Bidirectional Switch Topologies

2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. ["112–117"].

Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), ["2351–2356"].

E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method

Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for Solar PV Applications

2021 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), pp. ["568–575"].

Scalable Cascaded SuperCascode High Voltage Power Switch

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes

2021 IEEE Applied Power Electronics Conference and Exposition (APEC), ["1267–1274"].

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

International Symposium on Microelectronics, 2020(1), 000277–000281.

Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example

Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode

2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.

Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds

International Symposium on Microelectronics, 2020(1), 000009–000014.

Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications

2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).

Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design

Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Ultra-High Density Double-Sided Half Bridge Packaging

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection

2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.

Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.

Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Design and Integration of WBG Solid State Circuit Protection

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

ERCD Power Stage Characterization for MV SSCB Application

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.

Edge Interconnect Packaging of Integrated Circuits for Power Systems

(US Patent No. 10,325,875B2).

High Frequency Self-Oscillating WBG-based Power Conversion

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).

New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Opportunities in Power Applications using Epoxy Resin Composite Dielectrics

Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Power Packaging Assembly Challenges

Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module

2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).

Trends in Power Electronics Packaging

Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module

Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.

6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis

Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Design, Package, and Hardware Verification of a High-Voltage Current Switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis

Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)

Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs

2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module

Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.

Scalable MV/HV Super Cascode Power Module

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications

Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging

Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

International Symposium on Microelectronics, 2017(1), 000312–000317.

Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications

International Symposium on Microelectronics, 2017(1), 000151–000156.

Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality

2017 ieee energy conversion congress and exposition (ecce), 4011–4018.

Grid Modernization – FREEDM Systems Center

Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

Heterogeneous Integration Integrated Power Devices Roadmap

Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors

International Symposium on Microelectronics, 2017(1), 000224–000230.

Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies

International Symposium on Microelectronics, 2017(1), 000353–000359.

Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module

2017 ieee 67th electronic components and technology conference (ectc 2017), 1461–1467.

Numerical and experimental determination of temperature distribution in 3D stacked power devices

Exhibition on packaging and integration of electronic and photonic.

True 3D Power Packaging - Higher Densities Through Orthogonality

Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.

A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)

Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

A folded GaN VRM with high electrical and thermal performance

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond

Presented at the RTP CFO Forum.

Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).

Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules

Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics

Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

2016 ieee energy conversion congress and exposition (ecce).

Design, package, and hardware verification of a high voltage current switch

Apec 2016 31st annual ieee applied power electronics conference and exposition, 2016-May, 295–302.

Development of an ultra-high density power chip on bus (PCoB) module

2016 ieee energy conversion congress and exposition (ecce).

FEA-based thermal-mechanical optimization for DBC based power modules

2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules

Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications

International Symposium on Microelectronics, 2016(1), 000391–000396.

Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

3D Power Electronics Packaging and Additive Manufacturing

Hopkins, D. C. (2015, November). Presented at the 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, Blacksburg, VA.

A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode

International Symposium on Microelectronics, 2015(1), 000359–000364.

Additive Manufacturing (a.k.a. 3D Printing) for Designing Power Electronic Systems

Hopkins, D. C. (2015, October 20). Presented at the Manufacturing Conference 2015 (MFGCON), Raleigh, NC.

Additive Manufacturing In Power Electronics Packaging

Special session presented at the IEEE Applied Power Electronics Conference, Charlotte, NC.

Design considerations of packaging a high voltage current switch

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

Physical Rf Circuit Techniques And The Implications On Future Power Module Design

Morgan, A. J., Hopkins, D. C., & McKeown, M. (2015, May). Presented at the International Microelectronics Assembly & Packaging Society, Northeast Symposium.

The Evolution and Future Development of Power Electronics as an Essential Element of Power Generation/Delivery, Energy Efficiency, and Industrial Automation

Lawrence, R., & Hopkins, D. C. (2015, December 12). Presented at the North Carolina IEEE Power Electronic Society (PELS) Chapter Seminar, Raleigh, NC.

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.

3D Printing in the Micro- & Power-Electronics Packaging World

3D Printing in the Micro- & Power-Electronics Packaging World. Presented at the Carolina PCB, Raleigh, NC.

Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development

International Symposium on Microelectronics, 2014(1), 000887–000892.

Misconception of thermal spreading angle and misapplication to IGBT power modules

2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.

Printed Interfacial Interconnects in High Power Module

Special Session presented at the IEEE Applied Power Electronics Conference, Ft. Worth, TX.

Thermal-mechanical design and optimization for DBC based power modules

[NSF FREEDM System Center Annual Industrial Review].

Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package

International Symposium on Microelectronics, 2013(1), 000758–000763.

Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer

IEEE Transactions on Industry Applications, 49(1), 316–321.

Understanding Impact of New Additive Manufacturing Techniques on Power Electronics Design

Hopkins, D. C. (2013, March 18). Special session presented at the IEEE Applied Power Electronics Conference, Long Beach, California.

Development of Printed Power Packaging for a High Voltage SiC Module

International Symposium on Microelectronics, 2012(1), 000955–000960.

Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.

Mean time to failure of SnAgCuNi solder joints under DC

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Point Source Thermal Management in Dense Power Modules and Systems

Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Printable Packaging for High Power, High Temperature Power Module

Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.

High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker

International Symposium on Microelectronics, 2011(1), 000608–000618.

High current and thermal transient design of a SiC SSPC for aircraft application

2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).

A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment

2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.

Augmenting Bucholz Relay Using Embedded Mems Gas Sensor

Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.

Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Development of a SiC SSPC Module with Advanced High Temperature Packaging

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.

Solid-State Protection: Dual-use for Microgrids

Presented at the Advanced Energy Conference, New York, NY.

A 6.5kV IGBT Development Module for Renewable Energy Systems

Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks

IEEE Transactions on Power Delivery, 24(3), 1234–1239.

Assessment of Critical Issues for High Temperature, High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Electromigration Time to Failure of SnAgCuNi Solder Joints

Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.

Electromigration time to failure of SnAgCuNi solder joints

Journal of Applied Physics, 106(1), 013707.

Investigation of High Electrical Gradients in High Voltage Power Modules

Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Investigation of SiC Power Module Requirement for Smart Grid Applications

Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Stress Management in a High Temperature Multilayered Composite Structure

Presented at the High Temperature Electronics Conference (HiTEC 2008), Albuquerque, New Mexico.

A Review of Electromigration Under Time Varying Current Stressing

Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.

Harsh Environment Thermal Management Using Aluminum-Based Packaging

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

IMC Effects in Solder from High Thermal Gradients Management

Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).

Solder Interconnect Electromigration Due to Time Varying Current Stressing

Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.

The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC

Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters

Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.

Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

International Journal of Damage Mechanics, 15(1), 41–67.

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation

High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.

Flip chip solder joint failure modes

Advanced Packaging, 14(10), 14–19.

Implementing Digital Power Control In Automotive Alternators

Presented at the Digital Power Forum, Boston MA.

Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing

Proceedings Electronic Components and Technology, 2005. ECTC '05. Presented at the 2005 55th Electronic Components and Technology Conference.

Damage mechanics of microelectronics solder joints under high current densities

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.

Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation

Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 41(18-19), 4939–4958.

Deformation of solder joint under current stressing and numerical simulation––II

International Journal of Solids and Structures, 41(18-19), 4959–4973.

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Journal of Electronic Packaging, 127(2), 157–163.

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

International Journal of Damage Mechanics, 13(4), 335–345.

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

International Journal of Solids and Structures, 41(9-10), 2743–2755.

Damage mechanics of microelectronics solder joints under high current densities

International Journal of Solids and Structures, 40(15), 4021–4032.

Flip Chip and BGA Solder Joint Reliability

Advanced Packaging, 12(5), 17–19.

Measurement of Electrical Current Density Effects in Solder Joints

Advancing Microelectronics, 30(5).

Measurement of high electrical current density effects in solder joints

Microelectronics Reliability, 43(12), 2021–2029.

Measuring Joint Reliability: Applying the Moire Interferometry Technique

Advanced Microelectronics Magazine, 12(5), 17–20.

Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures, 40(26), 7269–7284.

Numerical simulation of stress evolution during electromigration in IC interconnect lines

IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.

Partitioning digitally programmable power-control for applications to ballasts

APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Applied Physics Letters, 82(7), 1045–1047.

A framework for developing power electronics packaging

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

A high speed pulser thyristor

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.

Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement

SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

Measurement and Effects of High Electrical Current Stress in Solder Joints

Proceedings of the 35th International Symposium on Microelectronics, 427–432.

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.

Optimally selecting packaging technologies and circuit partitions based on cost and performance

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.

Packaging issues for next generation high voltage, high temperature power electronic modules

Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.

Power packaging of a 12 kV, 240°C passive electronic module

APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.

Synthesis of a new class of converters that utilize energy recirculation

Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.

Packaging and Smart Power Systems

In M. H. Rashid (Ed.), Power electronics handbook. San Diego, CA: Academic Press.

Packaging Factors for Next Generation High Voltage, High Temperature Power Electrons Modules

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2000, July). Presented at the High Temperature Electronics Conference, Albuquerque, New Mexico.

A Four-Dimensional Road-Mapping Framework for Power Packaging Technology

Proceedings of the 1998 IMAPS International Symposium on Microelectronics. Presented at the 1998 International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Diego, CA.

Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package

International Journal on Microelectronics Reliability.

Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness

International Journal of Microcircuits and Electronic Packaging.

Power Electronics Packaging

Advancing Microelectronics Magazine, 24(1), 10.

Thermal Impedance and Stress in a Power Package Due to Variations in Layer Thickness

SPIE Proceedings Series, 3235, 72–77. SPIE: Bellingham, Washington.

High Temperature Capacitors

[Final report]. Custom Electronics Inc.

Investigation of a Power Package Incorporating a Direct Attached Ceramic/AlSiC Structure

[Final report]. BrushWellman Incorporated.

System Design Considerations for using a Direct–Attached–Ceramic MMC Power Package

Proceedings of 32nd International Power Conversion Conference, 683–690.

Assessment of the Power Conversion Thrust Area

[Final report]. Lawrence Livermore National Laboratory.

Cost Estimate for the ARM Electronic Circuit Cards

[Final report]. Lawrence Livermore National Laboratory.

A mathematical approach to minimize the total mass of a space based power system by using multivariable non-linear optimization

Intersociety Energy Conversion Engineering Conference. Presented at the Intersociety Energy Conversion Engineering Conference, Monterey, CA.

Development of a Three Dimensional Power Circuit Package for Aircraft Applications

1994 Proceedings: International Symposium on Microelectronics, 124–128.

Optimizing Conductor Thickness in Power Hybrid Circuits

International Journal of Microcircuits and Electronic Packaging, (3rd Quarter), 293–301.

Determining Conductor Thickness in Power Circuits that Operate at Long Wavelength Frequencies

Proceedings of the 1993 ISHM Intternational Symposium on Microelectronics, 656–661.

Dynamic equalization during charging of serial energy storage elements

IEEE Transactions on Industry Applications, 29(2), 363–368.

Effect of Metallization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure

International Journal of Microcircuits and Electronic Packaging, (2nd Quarter), 189–193.

Extension of battery life via charge equalization control

IEEE Transactions on Industrial Electronics, 40(1), 96–104.

High Density Shunt Regulator Development

[Final report]. Martin Marietta Corporation.