Douglas Hopkins

6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications

In Thirty-third annual ieee applied power electronics conference and exposition (apec 2018) (pp. 1288–1293).

Design, package, and hardware verification of a high-voltage current switch

IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package

In Thirty-third annual ieee applied power electronics conference and exposition (apec 2018) (pp. 1266–1271).

Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality

In 2017 ieee energy conversion congress and exposition (ecce) (pp. 4011–4018).

Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module

In 2017 ieee 67th electronic components and technology conference (ectc 2017) (pp. 1461–1467).

Numerical and experimental determination of temperature distribution in 3D stacked power devices

In Exhibition on packaging and integration of electronic and photonic.

Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module

In Apec 2016 31st annual ieee applied power electronics conference and exposition (pp. 2141–2146).

Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules

In 2016 ieee energy conversion congress and exposition (ecce).

Design, package, and hardware verification of a high voltage current switch

In Apec 2016 31st annual ieee applied power electronics conference and exposition (pp. 295–302).

Development of an ultra-high density power chip on bus (PCoB) module

In 2016 ieee energy conversion congress and exposition (ecce).

FEA-based thermal-mechanical optimization for DBC based power modules

In 2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

Design considerations of packaging a high voltage current switch

In International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor

In Proceedings of the international symposium on power semiconductor (pp. 257–260).

Misconception of thermal spreading angle and misapplication to IGBT power modules

In 2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec) (pp. 545–551).

Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer

In IEEE Transactions on Industry Applications (Vol. 49, pp. 316–321).