Douglas Hopkins

Gao, B., Morgan, A. J., Xu, Y., Zhao, X., & Hopkins, D. C. (2018). 6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications. In Thirty-third annual ieee applied power electronics conference and exposition (apec 2018) (pp. 1288–1293).

De, A. K., Morgan, A. J., Iyer, V. M., Ke, H. T., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2018). Design, package, and hardware verification of a high-voltage current switch. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.

Zhao, X., Gao, B., Zhang, L. Q., Hopkins, D. C., & Huang, A. Q. (2018). Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package. In Thirty-third annual ieee applied power electronics conference and exposition (apec 2018) (pp. 1266–1271).

Zhao, X., Gao, B., Jiang, Y. F., Zhang, L. Q., Wang, S. Z., Xu, Y., … Hopkins, D. C. (2017). Flexible epoxy resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality. In 2017 ieee energy conversion congress and exposition (ecce) (pp. 4011–4018).

Zhao, X., Jiang, Y. F., Gao, B., Nishiguchi, K., Fukawa, Y., & Hopkins, D. C. (2017). Novel polymer substrate-based 1.2 kV/40 a double-sided intelligent power module. In 2017 ieee 67th electronic components and technology conference (ectc 2017) (pp. 1461–1467).

Morgan, A., Choobineh, L., Fresne, D., & Hopkins, D. C. (2017). Numerical and experimental determination of temperature distribution in 3D stacked power devices. In Exhibition on packaging and integration of electronic and photonic.

Morgan, A. J., Xu, Y., Hopkins, D. C., Husain, I., & Yu, W. S. (2016). Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module. In Apec 2016 31st annual ieee applied power electronics conference and exposition (pp. 2141–2146).

Rahman, D., Morgans, A. J., Xu, Y., Gao, R., Yu, W. S., Hopkins, D. C., & Husain, I. (2016). Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules. In 2016 ieee energy conversion congress and exposition (ecce).

De, A., Morgan, A., Iyer, V. M., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2016). Design, package, and hardware verification of a high voltage current switch. In Apec 2016 31st annual ieee applied power electronics conference and exposition (pp. 295–302).

Xu, Y., Husain, I., West, H., Yu, W. S., & Hopkins, D. (2016). Development of an ultra-high density power chip on bus (PCoB) module. In 2016 ieee energy conversion congress and exposition (ecce).

Xu, Y., & Hopkins, D. (2016). FEA-based thermal-mechanical optimization for DBC based power modules.

De, A., Morgan, A., Bhattacharya, S., & Hopkins, D. C. (2015). Design considerations of packaging a high voltage current switch.

Sung, W. J., Huang, A. Q., Baliga, B. J., Ji, I., Ke, H. T., & Hopkins, D. C. (2015). The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor. In Proceedings of the international symposium on power semiconductor (pp. 257–260).

Xu, Y., & Hopkins, D. C. (2014). Misconception of thermal spreading angle and misapplication to IGBT power modules. In 2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec) (pp. 545–551).

Bhat, K. P., Oh, K. W., & Hopkins, D. C. (2013). Feasibility of a MEMS sensor for gas detection in HV oil-insulated transformer (Vol. 49, pp. 316–321).