Douglas C Hopkins
power electronics, power electronics packaging, pulsed power, SiC, GaN
Works (267)
2025 journal article
Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 15(2), 295–308.
2024 article
A 400W, 250kHz (2kW Peak) Integrated GaN Half Bridge Power Module in a Non-Isolated Buck Converter
2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, pp. 168–174.
2024 article
FET Junction Temperature Monitoring Using Novel On-Chip Solution
2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, pp. 2475–2482.
open access via www.osti.gov (repository)2024 journal article
Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 14(12), 2258–2270.
2023 conference paper
Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2596–2603.
2023 conference paper
Analysis and Characterization of Four-quadrant Switches based Commutation Cell
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023-March, 209–216.
Contributors: R. Narwal n , S. Rawat n, A. Kanale n, T. Cheng n, A. Agarwal n, S. Bhattacharya n , B. Baliga n, n
2023 article
Bidirectional Three-phase Current Source Converter based Buck-boost AC/DC System using Bidirectional Switches
2023 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE & EXPO, ITEC.
Contributors: R. Narwal n , S. Bhattacharya n , B. Baliga n & n
2023 conference paper
Design & Integration of Solid-State Circuit Protection
Design & Integration of Solid-State Circuit Protection. IEEE Applied Power Electronics Conference. Presented at the IEEE Applied Power Electronics Conference, Orange County Convention Center, Orlando, FL.
2023 journal article
Double Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification
IMAPSource Proceedings, 2022(1).
2023 conference paper
Finite Element Analysis and Fatigue Life Prediction of A Laterally Conducting Gan-Based Power Package Under Thermal CyclingASME 2023 Int’l Mechanical Eng. Congress and Exposition
ASME 2023 Int’l Mechanical Eng. Congress and Exposition. https://event.asme.org/IMECE
2023 journal article
Methodologies of Cascading to Realize High Voltage Cascaded Super Cascode Power Switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, 11(6), 5853–5862.
2023 report
PV Inverter Systems Enabled by Monolithically Integrated SiC based Four Quadrant Power Switch (4-QPS) [BiDFET]
2023 journal article
Power Conversion Systems Enabled by SiC BiDFET Device
IEEE POWER ELECTRONICS MAGAZINE, 10(1), 39–43.
Contributors: S. Bhattacharya n , R. Narwal n , S. Shah*, B. Baliga n, A. Agarwal*, A. Kanale n, K. Han*, n , T. Cheng n
2023 journal article
The BiDFET Device and Its Impact on Converters
IEEE POWER ELECTRONICS MAGAZINE, 10(1), 20–27.
Contributors: B. Baliga n, n , S. Bhattacharya n , A. Agarwal*, T. Cheng n, R. Narwal n , A. Kanale n, S. Shah, K. Han*
2023 conference paper
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package
2022 article proceedings
Design Considerations for Developing 1.2 kV 4H-SiC BiDFET-enabled Power Conversion Systems
Presented at the 2022 IEEE Energy Conversion Congress and Exposition (ECCE).
Contributors: A. Kanale n, T. Cheng n, R. Narwal n , A. Agarwal n, B. Baliga n, S. Bhattacharya n , n
2022 conference paper
Heterogeneous Integration of Power Electronics (IPE) and the Road Ahead
33rd Annual Electronics Packaging Symposium. Presented at the 33rd Annual Electronics Packaging Symposium, Binghamton University, Binghamton, NY.
2021 journal article
3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules
IEEE TRANSACTIONS ON POWER ELECTRONICS, 36(11), 13057–13066.
2021 conference paper
A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules
Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
2021 conference paper
A New Cascaded SuperCascode High Voltage Power Switch
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2251–2257.
2021 conference paper
Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower
Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
2021 conference paper
Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS)
Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Presented at the IEEE Applied Power Electronics Conference.
2021 conference paper
Advances in Highly Thermally Conductive Organic Power Packaging
Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
2021 article
Analytical Method to Optimize the Cascaded SuperCascode Power Switch Balancing Network
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 107–111.
2021 journal article
Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems
IEEE Journal of Emerging and Selected Topics in Power Electronics, 10(4), 1–1.
2021 conference paper
Comparison of the Capacitances and Switching Losses of 1.2 kV Common-Source and Common- Drain Bidirectional Switch Topologies
2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 112–117.
2021 conference paper
Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356.
2021 conference paper
E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method
Sinha, S. S., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
2021 journal article
Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design
International Symposium on Microelectronics, 2021(1), 000260–000264.
2021 conference paper
Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications
Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.
2021 article
Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for Solar PV Applications
2021 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), pp. 568–575.
Contributors: S. Shah n, R. Narwal n , S. Bhattacharya n , A. Kanale n, T. Cheng n, U. Mehrotra n, A. Agarwal n, B. Baliga n, n
2021 conference paper
Scalable Cascaded SuperCascode High Voltage Power Switch
Mehrotra, U., & Hopkins, D. C. (2021, March 17). Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.
2021 conference paper
Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
2021 conference paper
Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1267–1274.
2021 conference paper
Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).
2021 journal article
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Journal of Microelectronics and Electronic Packaging, 18(3), 123–136.
2020 journal article
1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop
Materials Science Forum, 1004, 872–881.
2020 journal article
Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module
International Symposium on Microelectronics, 2020(1), 000277–000281.
2020 speech
Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example
Hopkins, D. C. (2020, August). Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.
2020 conference paper
Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing
Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.
2020 conference paper
Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development
Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.
2020 conference paper
High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode
2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI.
2020 journal article
Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds
International Symposium on Microelectronics, 2020(1), 000009–000014.
2020 article proceedings
Monolithic 4-Terminal 1.2 kV/20 A 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Integrated JBS Diodes
Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).
2020 conference paper
Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications
2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC).
2020 conference paper
Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).
2020 speech
ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design
Sinha, S. S., & Hopkins, D. C. (2020, January). Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.
2020 conference paper
Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices
Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Presented at the Power America Institute Annual Meeting, Raleigh, NC.
2020 conference paper
Ultra-High Density Double-Sided Half Bridge Packaging
Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).
2019 conference paper
1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop
Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.
2019 conference paper
A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
2019 conference paper
Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging
Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.
2019 conference paper
Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging
Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Presented at the PCB Carolina, Raleigh, NC.
2019 conference paper
Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching
Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Presented at the Power America Annual Meeting, Raleigh, NC.
2019 conference paper
Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch
Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.
2019 conference paper
Design and Integration of WBG Solid State Circuit Protection
Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.
2019 conference paper
Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors
Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.
2019 conference paper
Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications
Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.
2019 conference paper
ERCD Power Stage Characterization for MV SSCB Application
Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). Presented at the Power America Summer Workshop, Raleigh, NC.
2019 report
Edge Interconnect Packaging of Integrated Circuits for Power Systems
(US Patent No. 10,325,875B2).
2019 conference paper
High Frequency Self-Oscillating WBG-based Power Conversion
Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
2019 conference paper
New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency
2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC).
2019 conference paper
New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency
Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
2019 conference paper
Opportunities in Power Applications using Epoxy Resin Composite Dielectrics
Hopkins, D., & Ballard, B. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.
2019 conference paper
Power Packaging Assembly Challenges
Hopkins, D. C. (2019, March 27). Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.
2019 conference paper
Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module
2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe).
2019 conference paper
Trends in Power Electronics Packaging
Hopkins, D. C. (2019, April 10). Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.
2019 conference paper
WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module
Mehrotra, U., & Hopkins, D. (2019, August 6). Presented at the Power America Summer Workshop 2019, Raleigh, NC.
2018 conference paper
6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293.
2018 conference paper
6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability
2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
2018 conference paper
6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM)
Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.
2018 conference paper
Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis
Chen, T., & Hopkins, D. C. (2018, February 6). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.
2018 conference paper
Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis
Golding, C., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.
2018 conference paper
Heterogeneous Integration Roadmap Update-integrated power electronics (IPE)
Hopkins, D. C. (2018, June 25). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.
2018 conference paper
Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate
2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
2018 conference paper
New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs
2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
2018 conference paper
Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module
Guven, M., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.
2018 conference paper
Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package
Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271.
2018 conference paper
Scalable MV/HV Super Cascode Power Module
Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.
2018 conference paper
Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications
Morgan, A., & Hopkins, D. C. (2018, June 7). Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.
2017 conference paper
3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging
Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.
2017 conference paper
Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics
Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.
2017 journal article
Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules
International Symposium on Microelectronics, 2017(1), 000312–000317.
2017 journal article
Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications
International Symposium on Microelectronics, 2017(1), 000151–000156.
2017 journal article
Design, Package, and Hardware Verification of a High-Voltage Current Switch
IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450.
Contributors: A. De *, A. Morgan n, V. Mahadeva Iyer n , H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , n
2017 article proceedings
Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality
2017 speech
Grid Modernization – FREEDM Systems Center
Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.
2017 conference paper
Heterogeneous Integration Integrated Power Devices Roadmap
Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.
2017 journal article
Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors
International Symposium on Microelectronics, 2017(1), 000224–000230.
2017 journal article
Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies
International Symposium on Microelectronics, 2017(1), 000353–000359.
2017 article
Novel Polymer Substrate-Based 1.2 kV/40 A Double-Sided Intelligent Power Module
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), pp. 1461–1467.
2017 conference paper
Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems.
2017 conference paper
True 3D Power Packaging - Higher Densities Through Orthogonality
Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.
2016 journal article
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient
A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158.
2016 conference paper
A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES)
Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.
2016 conference paper
A folded GaN VRM with high electrical and thermal performance
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
2016 speech
Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond
Presented at the RTP CFO Forum.
2016 conference paper
Advanced multi-physics simulation for high performance power electronic packaging design
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM).
2016 conference paper
Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules
Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.
2016 conference paper
Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics
Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.
2016 conference paper
Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module
Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146.
2016 conference paper
Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules
2016 ieee energy conversion congress and exposition (ecce).
2016 conference paper
Design, package, and hardware verification of a high voltage current switch
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2016-May, 295–302.
Contributors: A. De n, A. Morgan n, V. Iyer n, H. Ke n, X. Zhao n, K. Vechalapu n, S. Bhattacharya n , n
2016 conference paper
Development of an ultra-high density power chip on bus (PCoB) module
2016 ieee energy conversion congress and exposition (ecce).
2016 conference paper
FEA-based thermal-mechanical optimization for DBC based power modules
2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).
2016 speech
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules
Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.
2016 journal article
Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications
International Symposium on Microelectronics, 2016(1), 000391–000396.
2016 conference paper
Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing
Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.
2015 conference paper
3D Packaging for High Density And High Performance GaN-Based Circuits
2015 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), Charlotte, NC.
2015 conference paper
3D Power Electronics Packaging and Additive Manufacturing
Hopkins, D. C. (2015, November). Presented at the 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, Blacksburg, VA.
2015 journal article
A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode
International Symposium on Microelectronics, 2015(1), 000359–000364.
2015 conference paper
Additive Manufacturing (a.k.a. 3D Printing) for Designing Power Electronic Systems
Hopkins, D. C. (2015, October 20). Presented at the Manufacturing Conference 2015 (MFGCON), Raleigh, NC.
2015 conference paper
Additive Manufacturing In Power Electronics Packaging
Special session presented at the IEEE Applied Power Electronics Conference, Charlotte, NC.
2015 conference paper
Design considerations of packaging a high voltage current switch
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.
2015 conference paper
Physical Rf Circuit Techniques And The Implications On Future Power Module Design
Morgan, A. J., Hopkins, D. C., & McKeown, M. (2015, May). Presented at the International Microelectronics Assembly & Packaging Society, Northeast Symposium.
2015 conference paper
The Evolution and Future Development of Power Electronics as an Essential Element of Power Generation/Delivery, Energy Efficiency, and Industrial Automation
Lawrence, R., & Hopkins, D. C. (2015, December 12). Presented at the North Carolina IEEE Power Electronic Society (PELS) Chapter Seminar, Raleigh, NC.
2015 conference paper
The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor
2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260.
2014 speech
3D Printing in the Micro- & Power-Electronics Packaging World
3D Printing in the Micro- & Power-Electronics Packaging World. Presented at the Carolina PCB, Raleigh, NC.
2014 conference paper
Introduction to 3D Printed Power Electronics & Wide Bandgap Power Semiconductor Packaging
Introduction to 3D Printed Power Electronics & Wide Bandgap Power Semiconductor Packaging. 47th Symposium on Microelectronics (IMAPS 2014). Presented at the 47th Symposium on Microelectronics (IMAPS 2014), San Diego, CA. http://w.gmsystems.com/uploads/3/1/4/3/3143302/imaps2014.pdf
2014 journal article
Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development
International Symposium on Microelectronics, 2014(1), 000887–000892.
2014 conference paper
Misconception of thermal spreading angle and misapplication to IGBT power modules
2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551.
2014 conference paper
Printed Interfacial Interconnects in High Power Module
Special Session presented at the IEEE Applied Power Electronics Conference, Ft. Worth, TX.
2014 report
Thermal-mechanical design and optimization for DBC based power modules
[NSF FREEDM System Center Annual Industrial Review].
2013 journal article
Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package
International Symposium on Microelectronics, 2013(1), 000758–000763.
2013 journal article
Feasibility of a MEMS Sensor for Gas Detection in HV Oil-Insulated Transformer
IEEE Transactions on Industry Applications, 49(1), 316–321.
2013 conference paper
Understanding Impact of New Additive Manufacturing Techniques on Power Electronics Design
Hopkins, D. C. (2013, March 18). Special session presented at the IEEE Applied Power Electronics Conference, Long Beach, California.
2012 conference paper
Advanced Bus Bar System Design
IEEE Energy Conversion Congress and Exposition, ECCE. Presented at the IEEE Energy Conversion Congress and Exposition, ECCE, Raleigh, N.C.
2012 conference paper
Bus Bars – Slap Them Together and They Ought to Work
27th Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 27th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL.
2012 journal article
Development of Printed Power Packaging for a High Voltage SiC Module
International Symposium on Microelectronics, 2012(1), 000955–000960.
2012 journal article
Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372.
2012 conference paper
Mean time to failure of SnAgCuNi solder joints under DC
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
2012 conference paper
Point Source Thermal Management in Dense Power Modules and Systems
Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.
2012 conference paper
Printable Packaging for High Power, High Temperature Power Module
Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.
2012 conference paper
Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module
2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL.
2011 conference paper
Ground Rules for Designing Power Electronics into Evolving MicroGrid Applications
26th Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 26th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Fort Worth, TX.
2011 journal article
High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker
International Symposium on Microelectronics, 2011(1), 000608–000618.
2011 conference paper
High current and thermal transient design of a SiC SSPC for aircraft application
2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011.
2011 chapter
Packaging and Smart Power Systems
In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286).
Ed(s): M. Rashid
2010 conference paper
A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment
2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting.
2010 conference paper
Augmenting Bucholz Relay Using Embedded Mems Gas Sensor
Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.
2010 conference paper
Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
2010 journal article
Development of a SiC SSPC Module with Advanced High Temperature Packaging
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315.
2010 conference paper
Power Electronics in a Smart-Grid Distribution System
25th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 25th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA.
2010 conference paper
Solid-State Protection: Dual-use for Microgrids
Presented at the Advanced Energy Conference, New York, NY.
2009 conference paper
A 6.5kV IGBT Development Module for Renewable Energy Systems
Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
2009 journal article
A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks
IEEE Transactions on Power Delivery, 24(3), 1234–1239.
2009 conference paper
Advanced Packaging for Power and Energy
42nd Symposium on Microelectronics (IMAPS 2009). Presented at the 42nd Symposium on Microelectronics (IMAPS 2009), San Jose, CA.
2009 conference paper
Assessment of Critical Issues for High Temperature, High Voltage Power Modules
Presented at the FREEDM Systems Center Conference, Raleigh, NC.
2009 conference paper
Electromigration Time to Failure of SnAgCuNi Solder Joints
Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.
2009 journal article
Electromigration time to failure of SnAgCuNi solder joints
Journal of Applied Physics, 106(1), 013707.
2009 conference paper
Integrated Packaging Techniques
24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Washington, D.C.
2009 conference paper
Investigation of High Electrical Gradients in High Voltage Power Modules
Presented at the FREEDM Systems Center Conference, Raleigh, NC.
2009 conference paper
Investigation of SiC Power Module Requirement for Smart Grid Applications
Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
2008 conference paper
Advanced Energy Packaging Techniques
23rd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 23rd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Austin, TX.
2008 conference paper
Advanced Power Packaging for Higher Temperatures and Harsh Environments
41st International Symposium on Microelectronics. Presented at the 41st International Symposium on Microelectronics, Rhode Island Convention Center, Providence, R.I.
2008 conference paper
Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
2008 conference paper
Stress Management in a High Temperature Multilayered Composite Structure
Presented at the High Temperature Electronics Conference (HiTEC 2008), Albuquerque, New Mexico.
2007 conference paper
A Review of Electromigration Under Time Varying Current Stressing
Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.
2007 conference paper
Advanced Power Packaging for High Reliability and Higher Temperatures
40th International Symposium on Microelectronics. Presented at the 40th International Symposium on Microelectronics, San Jose, CA.
2007 conference paper
Harsh Environment Thermal Management Using Aluminum-Based Packaging
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
2007 conference paper
IMC Effects in Solder from High Thermal Gradients Management
Presented at the International Electronics Packaging Symposium, Niskayuna, NY.
2007 conference paper
Introduction to Power Packaging Techniques
22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
2007 chapter
Packaging and Smart Power Systems
In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158).
Ed(s): M. Rashid
2007 conference paper
Solder Interconnect Electromigration Due to Time Varying Current Stressing
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.
2007 conference paper
The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC
Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.
2006 conference paper
Advanced Power Electronics Packaging High-Current High Temperature Applications
21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA.
2006 conference paper
Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters
Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.
2006 conference paper
Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition.
2006 conference paper
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation
High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX.
2005 journal article
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
International Journal of Damage Mechanics, 15(1), 41–67.
2005 journal article
Flip chip solder joint failure modes
Advanced Packaging, 14(10), 14–19.
2005 conference paper
Implementing Digital Power Control In Automotive Alternators
Presented at the Digital Power Forum, Boston MA.
2005 conference paper
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
Proceedings Electronic Components and Technology, 2005. ECTC '05. Presented at the 2005 55th Electronic Components and Technology Conference.
2004 conference paper
Damage mechanics of microelectronics solder joints under high current densities
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV.
2004 conference paper
Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation
Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––I
International Journal of Solids and Structures, 41(18-19), 4939–4958.
2004 journal article
Deformation of solder joint under current stressing and numerical simulation––II
International Journal of Solids and Structures, 41(18-19), 4959–4973.
2004 journal article
Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
Journal of Electronic Packaging, 127(2), 157–163.
2004 journal article
Mechanical Implications of High Current Densities in Flip-chip Solder Joints
International Journal of Damage Mechanics, 13(4), 335–345.
2004 journal article
Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing
International Journal of Solids and Structures, 41(9-10), 2743–2755.
2004 conference paper
Power Packaging Techniques and High Current Applications
19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
2003 journal article
Damage mechanics of microelectronics solder joints under high current densities
International Journal of Solids and Structures, 40(15), 4021–4032.
2003 journal article
Flip Chip and BGA Solder Joint Reliability
Advanced Packaging, 12(5), 17–19.
2003 journal article
Measurement of Electrical Current Density Effects in Solder Joints
Advancing Microelectronics, 30(5).
2003 journal article
Measurement of high electrical current density effects in solder joints
Microelectronics Reliability, 43(12), 2021–2029.
2003 journal article
Measuring Joint Reliability: Applying the Moire Interferometry Technique
Advanced Microelectronics Magazine, 12(5), 17–20.
2003 journal article
Mechanical degradation of microelectronics solder joints under current stressing
International Journal of Solids and Structures, 40(26), 7269–7284.
2003 journal article
Numerical simulation of stress evolution during electromigration in IC interconnect lines
IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681.
2003 conference paper
Partitioning digitally programmable power-control for applications to ballasts
APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX.
2003 conference paper
Plated copper on ceramic for power hybrid applications
Proceedings., 39th Electronic Components Conference. Presented at the 39th Electronic Components Conference, Houston, TX.
2003 conference paper
Power Packaging Techniques with Emphasis on High Current Applications
18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Miami Beach, FL.
2003 conference paper
Reliability of solder joints under electrical stressing - strain evolution of solder joints
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA.
2003 journal article
Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing
Applied Physics Letters, 82(7), 1045–1047.
2003 conference paper
Thick-film power hybridization of switchmode power circuits
Proceedings, Fourth Annual IEEE Applied Power Electronics Conference and Exposition. Presented at the Fourth Annual IEEE Applied Power Electronics Conference and Exposition, Baltimore, MD.
2002 conference paper
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
52nd Electronic Components and Technology Conference 2002 (Cat No 02CH37345) ECTC-02. Presented at the Proceedings of 52nd Electronic Components and Technology Conference.
2002 conference paper
A framework for developing power electronics packaging
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
2002 conference paper
A high speed pulser thyristor
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
2002 conference paper
Characterization of advanced materials for high voltage/high temperature power electronics packaging
APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA.
2002 conference paper
Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement
SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.
2002 conference paper
Measurement and Effects of High Electrical Current Stress in Solder Joints
Proceedings of the 35th International Symposium on Microelectronics, 427–432.
2002 conference paper
Mechanical Implications of High Current Densities in Flip Chip Solder Joints
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition.
2002 conference paper
Optimally selecting packaging technologies and circuit partitions based on cost and performance
APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA.
2002 conference paper
Packaging issues for next generation high voltage, high temperature power electronic modules
Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA.
2002 conference paper
Power Packaging Techniques for Low and Higher Voltage Systems
17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Dallas, Tx.
2002 conference paper
Power packaging of a 12 kV, 240°C passive electronic module
APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA.
2002 conference paper
Synthesis of a new class of converters that utilize energy recirculation
Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan.
2002 conference paper
The use of equalizing converters for serial charging of long battery strings
[Proceedings] APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition. Presented at the APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition, Dallas, TX.
2001 chapter
Packaging and Smart Power Systems
In M. H. Rashid (Ed.), Power electronics handbook. San Diego, CA: Academic Press.
Ed(s): M. Rashid
2001 conference paper
Power Packaging Techniques for Low and Higher Voltage Systems
16th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 16th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.
2000 conference paper
Packaging Factors for Next Generation High Voltage, High Temperature Power Electrons Modules
Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2000, July). Presented at the High Temperature Electronics Conference, Albuquerque, New Mexico.
1999 conference paper
Power Electronics Packaging
14th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 14th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Dallas, TX.
1998 conference paper
A Four-Dimensional Road-Mapping Framework for Power Packaging Technology
Proceedings of the 1998 IMAPS International Symposium on Microelectronics. Presented at the 1998 International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Diego, CA.
1998 journal article
Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package
International Journal on Microelectronics Reliability.
1998 journal article
Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness
International Journal of Microcircuits and Electronic Packaging.
1997 journal article
Power Electronics Packaging
Advancing Microelectronics Magazine, 24(1), 10.
1997 conference paper
Power Electronics Packaging - A Circuit Design Approach
12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Atlanta, GA.
1997 conference paper
Thermal Impedance and Stress in a Power Package Due to Variations in Layer Thickness
SPIE Proceedings Series, 3235, 72–77. SPIE: Bellingham, Washington.
1996 report
High Temperature Capacitors
[Final report]. Custom Electronics Inc.
1996 report
Investigation of a Power Package Incorporating a Direct Attached Ceramic/AlSiC Structure
[Final report]. BrushWellman Incorporated.
1996 conference paper
System Design Considerations for using a Direct–Attached–Ceramic MMC Power Package
Proceedings of 32nd International Power Conversion Conference, 683–690.
1995 report
Assessment of the Power Conversion Thrust Area
[Final report]. Lawrence Livermore National Laboratory.
1995 report
Cost Estimate for the ARM Electronic Circuit Cards
[Final report]. Lawrence Livermore National Laboratory.
1994 conference paper
A mathematical approach to minimize the total mass of a space based power system by using multivariable non-linear optimization
Intersociety Energy Conversion Engineering Conference. Presented at the Intersociety Energy Conversion Engineering Conference, Monterey, CA.
1994 conference paper
Development of a Three Dimensional Power Circuit Package for Aircraft Applications
1994 Proceedings: International Symposium on Microelectronics, 124–128.
1994 journal article
Optimizing Conductor Thickness in Power Hybrid Circuits
International Journal of Microcircuits and Electronic Packaging, (3rd Quarter), 293–301.
1993 conference paper
Determining Conductor Thickness in Power Circuits that Operate at Long Wavelength Frequencies
Proceedings of the 1993 ISHM Intternational Symposium on Microelectronics, 656–661.
1993 journal article
Dynamic equalization during charging of serial energy storage elements
IEEE Transactions on Industry Applications, 29(2), 363–368.
1993 journal article
Effect of Metallization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure
International Journal of Microcircuits and Electronic Packaging, (2nd Quarter), 189–193.
1993 journal article
Extension of battery life via charge equalization control
IEEE Transactions on Industrial Electronics, 40(1), 96–104.
1993 report
High Density Shunt Regulator Development
[Final report]. Martin Marietta Corporation.
1993 report
Investigation of High Frequency Resonant Effects in Batteries
[Final report]. NASA Lewis Research Center.
1993 report
Systems Engineering of Shared Resources: Decision Support System for the Concept Definition Phases
In NASA-OAI Collaborative Aerospace Research and Fellowship Program at Lewis Research Center (pp. 25–26) [Final report]. Lewis Research Center.
1993 report
Systems Engineering of Shared Resources: Decision Support for the Concept Design Phase – Modeling Development
[Interim Report].
1992 report
Materials Support for the Investigation of Charge Equalization in Serial Batteries
(Final Report for NASA Contract No. NAG8-123; pp. VII–1 – VII-21).
1992 conference paper
Numerical Modeling and Experimental Comparison of Copper Bonded AlN, Al2O3 and BeO Power Hybrid Structures
Proceedings of the 1992 International Electronics Packaging Conference. Presented at the 1992 International Electronics Packaging Conference, Austin, TX.
1992 report
Power Measurement in Converters
[Final Report]. NASA Lewis Research Center.
1992 conference paper
Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN, Al2O3 and BeO Assemblies
Proceedings of the 1992 ISHM International Symposium on Microelectronics, 577–583.
1991 report
Optimum Operating Temperature for a Minimum Mass Space Power System
[Final Report]. NASA Lewis Research Center.
1990 report
Current Limiting Remote Power Control Module
(Final Report No. NGT-01-002-009). NASA Marshal Space Flight Center.
1989 journal article
Designing Hybrid Power Supplies
Powertechnics Magazine, 5(6), 31–34.
1989 journal article
Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters
IEEE Transactions on Power Electronics, 4(1), 136–146.
1989 report
High Density Power Transformer
Unisys Corporation.
1989 report
High-Performance, High-Frequency, Distributed, Computer Power Supply Technology
Digital Equipment Corporation.
1989 journal article
Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter
IEEE Transactions on Power Electronics, 4(1), 147–154.
1989 journal article
Plated copper on ceramic substrates for power hybrid circuits
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(4), 530–536.
1989 conference paper
Power-Hybrid Design of a High-Frequency ZCS-QRC
Proceedings of the Fourth Annual High Frequency Power Conversion Conference, 304–317.
1989 report
Testing of High Power Devices
(Final Report No. LABCOM-ETDL, DAAL03-86-D-001, DO 1576). U.S. Army.
1989 conference paper
The Effects of Power Hybridization on Power Electronic Circuits
ISHM International Symposium on Microelectronics Proceedings, 647–654.
1989 conference paper
The Microelectronics Program at Auburn University
ISHM International Symposium on Microelectronics Proceedings, 367–375.
1989 journal article
Thick-Film Technique Helps Hybridized, 2 MHz ZC-QR Converter Achieve 78% Efficiency
Power Conversion & Intelligent Motion, 15(7), 57–66.
1988 conference paper
Determination of Conductor Thickness and Width for Power-Hybrid Circuits
Proceedings of the Sixth Annual Power Electronics Seminar, 71–83.
1988 thesis
Development of a High-Density, Off-Line, Quasi-Resonant Converter Using Hybrid Techniques
(Ph.D. Dissertation). Virginia Polytechnic Institute and State University.
1988 report
High-Performance, High-Frequency, Distributed, Computer Power Supply Technology
Digital Equipment Corporation.
1988 conference paper
Off-Line ZCS-QRC Thick-Film Hybrid Circuit
Proceedings of the Sixth Annual Power Electronics Seminar, 71–83.
1988 conference paper
Printing of Thick Thick-Film Conductors for Power Hybrid Circuits
ISHM International Symposium on Microelectronics Proceedings, 95–101.
1987 conference paper
Design Aspects for High-Frequency Off-Line Quasi-Resonant Converter
Proceedings of the Second Annual High Frequency Power Conversion Conference, 83–97.
1987 report
High-Performance, High-Frequency, Distributed, Computer Power Supply Technology
Digital Equipment Corporation.
1987 conference paper
Two-megahertz off-line hybridized quasi-resonant converter
1987 IEEE Applied Power Electronics conference and Exposition. Presented at the IEEE Applied Power Conference and Exposition, San Diego, CA.
1986 conference paper
One-Megahertz, Off-Line Converter Hybridization
Proceedings of the Fourth Annual Power Electronics Seminar, 134–148.
1985 report
Evaluation of Semiconductor Devices for Electric and Hybrid Vehicles (EHV) AC-Drive Applications,
(No. JPL9950-1038). Department of Energy and Jet Propulsion Laboratory.
1985 report
Very High Frequency Quasi-Resonant Converters for Use in High Density Power Supplies for Military Applications
Texas Instruments Inc.
1984 conference paper
Status of Power Devices, IC's and Support Chips
Proceedings of the Second Annual Power Electronics Seminar, 2–9.
1983 conference paper
Status of Semiconductor Power Switching Devices
Proceedings of the First Annual Power Electronics Seminar, 82–91.
1981 journal article
Characteristic Input Harmonics of DC-DC Converters and their Effect on Input Filter Design
IEEE Transactions on Industrial Electronics and Control Instrumentation, IECI-28(2), 73–82.
conference paper
Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement
Ye, H., Basaran, C., & Hopkins, D. C. IMAPS International Conference on Advanced Packaging Systems. Presented at the IMAPS International Conference on Advanced Packaging Systems, Reno, NV.
conference paper
Introduction to 3D Power Electronics & Post-Silicon Device Packaging
Hopkins, D. C. Introduction to 3D Power Electronics & Post-Silicon Device Packaging. 46th Symposium on Microelectronics (IMAPS 2013). Presented at the 46th Symposium on Microelectronics (IMAPS 2013), Orlando, FL. https://meridian.allenpress.com/imaps-am/article-pdf/40/4/1/2068365/amim-40-4.pdf
conference paper
Pb Phase Growth in Eutectic Pb/Sn Flip Chip Solder Joint under Current Stressing”
Ye, H., Basaran, C., & Hopkins, D. C. Pb Phase Growth in Eutectic Pb/Sn Flip Chip Solder Joint under Current Stressing.” Proceedings of 2003 Mechanics and Materials Conference. Presented at the 2003 Mechanics and Materials Conference, Scottsdale, AZ.
Employment
Updated: May 18th, 2021 14:52
2011 - present
2008 - 2014
1997 - 2011
Education
Updated: February 8th, 2021 17:23
Funding History
Funding history based on the linked ORCID record. Updated: July 28th, 2023 10:38