Douglas Hopkins

Sinha, S. S., Cheng, T.-H., Parmar, K., & Hopkins, D. C. (2023). Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates. 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2596–2603. https://doi.org/10.1109/apec43580.2023.10131488

Narwal, R., Rawat, S., Kanale, A., Cheng, T.-H., Agarwal, A., Bhattacharya, S., … Hopkins, D. C. (2023). Analysis and Characterization of Four-quadrant Switches based Commutation Cell. 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023-March, 209–216. https://doi.org/10.1109/apec43580.2023.10131312

Narwal, R., Bhattacharya, S., Baliga, B. J., & Hopkins, D. C. (2023). Bidirectional Three-phase Current Source Converter based Buck-boost AC/DC System using Bidirectional Switches. 2023 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE & EXPO, ITEC. https://doi.org/10.1109/ITEC55900.2023.10186945

Hopkins, D. C., & Sinha, S. S. (2023). Design & Integration of Solid-State Circuit Protection. IEEE Applied Power Electronics Conference. Presented at the IEEE Applied Power Electronics Conference, Orange County Convention Center, Orlando, FL.

Finite Element Analysis and Fatigue Life Prediction of A Laterally Conducting Gan-Based Power Package Under Thermal CyclingASME 2023 Int’l Mechanical Eng. Congress and Exposition. (2023). ASME 2023 Int’l Mechanical Eng. Congress and Exposition. Retrieved from https://event.asme.org/IMECE

Mehrotra, U., & Hopkins, D. C. (2023). Methodologies of Cascading to Realize High Voltage Cascaded Super Cascode Power Switch. IEEE Journal of Emerging and Selected Topics in Power Electronics, 11(6), 5853–5862. https://doi.org/10.1109/JESTPE.2023.3314025

Bhattacharya, S., Narwal, R., Shah, S. S., Baliga, B. J., Agarwal, A., Kanale, A., … Cheng, T.-H. (2023). Power Conversion Systems Enabled by SiC BiDFET Device. IEEE POWER ELECTRONICS MAGAZINE, 10(1), 39–43. https://doi.org/10.1109/MPEL.2023.3237060

Baliga, B. J., Hopkins, D., Bhattacharya, S., Agarwal, A., Cheng, T.-H., Narwal, R., … Han, K. (2023). The BiDFET Device and Its Impact on Converters. IEEE POWER ELECTRONICS MAGAZINE, 10(1), 20–27. https://doi.org/10.1109/MPEL.2023.3237059

Zaghari, P., Sinha, S. S., Ryu, J. E., Franzon, P. D., & Hopkins, D. C. (2023). Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. 2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC). https://doi.org/10.1109/3dic57175.2023.10154901

Kanale, A., Cheng, T.-H., Narwal, R., Agarwal, A., Baliga, B. J., Bhattacharya, S., & Hopkins, D. C. (2022). Design Considerations for Developing 1.2 kV 4H-SiC BiDFET-enabled Power Conversion Systems. Presented at the 2022 IEEE Energy Conversion Congress and Exposition (ECCE). https://doi.org/10.1109/ECCE50734.2022.9947715

Sinha, S. S., Cheng, T.-H., & Hopkins, D. D. C. (2022). Double Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification. IMAPSource Proceedings, 2022(1). https://doi.org/10.4071/001c.74584

Hopkins, D. C. (2022). Heterogeneous Integration of Power Electronics (IPE) and the Road Ahead. 33rd Annual Electronics Packaging Symposium. Presented at the 33rd Annual Electronics Packaging Symposium, Binghamton University, Binghamton, NY.

Ke, H., Mehrotra, U., & Hopkins, D. C. (2021). 3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules. IEEE TRANSACTIONS ON POWER ELECTRONICS, 36(11), 13057–13066. https://doi.org/10.1109/TPEL.2021.3081679

Hopkins, D. C., Yu, W., Mehrotra, U., Cheng, T.-H., Sinha, S. S., Maru, K., & Mescia, N. (2021, March 17). A 40kV/mm Organic Substrate for Low Voltage Power SiP and >10kV Power Modules. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Mehrotra, U., & Hopkins, D. C. (2021). A New Cascaded SuperCascode High Voltage Power Switch. 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2251–2257. https://doi.org/10.1109/apec42165.2021.9487049

Maru, K., & Hopkins, D. C. (2021, March 17). Accessible & Adaptable Approach for Calculating the Thermal Resistance of a Power Package using ParaPower. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Hopkins, D. C., Cheng, T.-H., Mehrotra, U., & Yu, W. (2021, June 14). Advanced Dual-Sided Half-bridge Packaging with Epoxy Insulated Metal Substrates (eIMS). Presented at the IEEE Applied Power Electronics Conference.

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2021, April 26). Advances in Highly Thermally Conductive Organic Power Packaging. Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Mehrotra, U., & Hopkins, D. C. (2021). Analytical Method to Optimize the Cascaded SuperCascode Power Switch Balancing Network. 2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), pp. 107–111. https://doi.org/10.1109/WiPDA49284.2021.9645114

Mehrotra, U., Ballard, B., & Hopkins, D. C. (2021). Bidirectional Solid-State Circuit Breaker using Super Cascode for MV SST and Energy Storage Systems. IEEE Journal of Emerging and Selected Topics in Power Electronics, 10(4), 1–1. https://doi.org/10.1109/JESTPE.2021.3081684

Kanale, A., Narasimhan, S., Cheng, T.-H., Agarwal, A., Shah, S. S., Baliga, B. J., … Hopkins, D. C. (2021). Comparison of the Capacitances and Switching Losses of 1.2 kV Common-Source and Common- Drain Bidirectional Switch Topologies. 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 112–117. https://doi.org/10.1109/WiPDA49284.2021.9645130

Mehrotra, U., Morgan, A. J., & Hopkins, D. C. (2021). Design and Characterization of 3.3 kV-15 kV rated DBC Power Modules for Developmental Testing of WBG devices. 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2351–2356. https://doi.org/10.1109/apec42165.2021.9487311

Sinha, S. S., & Hopkins, D. C. (2021, March 17). E-Field Reduction Techniques in HV Multi-layered Modules Using New Capacitive Modelling Method. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Mehrotra, U., Morgan, A. J., & Hopkins, D. C. (2021). Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design. International Symposium on Microelectronics, 2021(1), 000260–000264. https://doi.org/10.4071/1085-8024-2021.1.000260

Shah, S. S., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., Agarwal, A., … Hopkins, D. C. (2021, October 10). Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for PV Applications. Presented at the IEEE Energy Conversion Congress and Exposition, Vancouver, Canada.

Shah, S. S., Narwal, R., Bhattacharya, S., Kanale, A., Cheng, T.-H., Mehrotra, U., … Hopkins, D. C. (2021). Optimized AC/DC Dual Active Bridge Converter using Monolithic SiC Bidirectional FET (BiDFET) for Solar PV Applications. 2021 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), pp. 568–575. https://doi.org/10.1109/ECCE47101.2021.9595533

Mehrotra, U., & Hopkins, D. C. (2021, March 17). Scalable Cascaded SuperCascode High Voltage Power Switch. Presented at the FREEDM System Center Annual Research Symposium, Raleigh, NC.

Mehrotra, U., Morgan, A. J., McKeown, M., & Hopkins, D. C. (2021, April 26). Study of Al wire bonds to understand cross-talk and current carrying capacity in WBG Power Module Design. Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Kanale, A., Cheng, T.-H., Shah, S. S., Han, K., Agarwal, A., Baliga, B. J., … Bhattacharya, S. (2021). Switching Characteristics of a 1.2 kV, 50 mΩ SiC Monolithic Bidirectional Field Effect Transistor (BiDFET) with Integrated JBS Diodes. 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 1267–1274. https://doi.org/10.1109/apec42165.2021.9487410

Cheng, T.-H., & Hopkins, D. C. (2021, April 26). Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules. Presented at the IMAPS International Advanced Power Electronics Packaging Symposium (APEPS’21).

Cheng, T.-H., Nishiguchi, K., Fukawa, Y., Baliga, B. J., Bhattacharya, S., & Hopkins, D. C. (2021). Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module. Journal of Microelectronics and Electronic Packaging, 18(3), 123–136. https://doi.org/10.4071/imaps.1427774

Kanale, A., Cheng, T. H., Han, K. J., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2020). 1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop. Materials Science Forum, 1004, 872–881. https://doi.org/10.4028/www.scientific.net/msf.1004.872

Cheng, T.-H., Nishiguchi, K., Fukawa, Y., Baliga, B. J., Bhattacharya, S., & Hopkins, D. C. (2020). Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module. International Symposium on Microelectronics, 2020(1), 000277–000281. https://doi.org/10.4071/2380-4505-2020.1.000277

Hopkins, D. C. (2020, August). Creating a Fast Turn Lab to Package Developmental Power Devices with a Packaging Example. Presented at the NC State Nanofabrication Facility (NNF) Virtual Short Course Webinar – Fabrication of Wide Bandgap Power Devices, Raleigh, NC.

Cheng, T.-H., Mehrotra, U., & Hopkins, D. C. (2020, February 25). Development of 3.3 kV-Capable, Open-Source, Low Cost Packaging Solution for Sic Transistor and Diode Testing. Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Murthy, P., Mehrotra, U., Yu, W., & Hopkins, D. C. (2020, February 25). Dynamic and Thermal IOL Test Systems for 3.3kV-6.5kV Die Development. Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Mehrotra, U., Ballard, B., & Hopkins, D. C. (2020). High Current Medium Voltage Bidirectional Solid State Circuit Breaker using SiC JFET Super Cascode. 2020 IEEE Energy Conversion Congress and Exposition (ECCE). Presented at the 2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI. https://doi.org/10.1109/ecce44975.2020.9236347

Mehrotra, U., Brazzle, A., McKeown, M., & Hopkins, D. C. (2020). Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds. International Symposium on Microelectronics, 2020(1), 000009–000014. https://doi.org/10.4071/2380-4505-2020.1.000009

Han, K., Agarwal, A., Kanale, A., Baliga, B. J., Bhattacharya, S., Cheng, T.-H., … Ransom, J. (2020). Monolithic 4-Terminal 1.2 kV/20 A 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Integrated JBS Diodes. Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). https://doi.org/10.1109/ISPSD46842.2020.9170064

Mehrotra, U., Ballard, B., Cheng, T.-H., Baliga, B. J., Bhattacharya, S., & Hopkins, D. C. (2020). Optimized Highly Efficient SSCB Using Organic Substrate Packaging for Electric Vehicle Applications. 2020 IEEE Transportation Electrification Conference & Expo (ITEC). Presented at the 2020 IEEE Transportation Electrification Conference & Expo (ITEC). https://doi.org/10.1109/itec48692.2020.9161539

Mehrotra, U., Cheng, T.-H., Kanale, A., Agarwal, A., Han, K., Baliga, B. J., … Hopkins, D. C. (2020). Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate. 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). Presented at the 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD). https://doi.org/10.1109/ispsd46842.2020.9170116

Sinha, S. S., & Hopkins, D. C. (2020, January). ParaPower – Leveraging Finite Difference Simulator for Quick Thermal Design. Webinar presented at the FREEDM Systems Center & PREES Lab, NC State University, Raleigh, NC.

Mehrotra, U., Morgan, A., & Hopkins, D. C. (2020, February 25). Traditional DBC-Based Power Modules for Test in Developing 3.3kV-15kV WBG Devices. Presented at the Power America Institute Annual Meeting, Raleigh, NC.

Hopkins, D. C., Cheng, T.-H., & Mehrotra, U. (2020, July 23). Ultra-High Density Double-Sided Half Bridge Packaging. Invited paper presented at the Power Sources Manufacturers Association (PSMA) Webinar Series / Applied Power Electronics Conference (APEC).

Kanale, A., Cheng, T.-H., Hanl, K., Baliga, B. J., Bhattacharya, S., & Hopkins, D. (2019, September 29). 1.2 kV, 10 A, 4H-SiC Bi-Directional Field Effect Transistor (BiDFET) with Low On-State Voltage Drop. Presented at the International Conference on Silicon Carbide and Related Materials, Kyoto, Japan.

Gao, B., Mehrotra, U., & Hopkins, D. C. (2019). A High-Bandwidth Resistive Current Sensing Technology for Breakers and Desaturation Protection. 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). https://doi.org/10.1109/wipda46397.2019.8998767

Hopkins, D. C., Cheng, T.-H., Gao, B., & Boteler, L. (2019, October 7). Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging. Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Cheng, T.-H., Gao, B., Boteler, L., & Hopkins, D. (2019, November 13). Advances in Organic Substrate Approaches for High Voltage Power Electronics Packaging. Presented at the PCB Carolina, Raleigh, NC.

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, February 12). Bi–Directional Solid-State Circuit Breaker for MV Applications Based on SuperCascode Switching. Presented at the Power America Annual Meeting, Raleigh, NC.

Cheng, T.-H., Gao, B., Nishiguchi, K., & Hopkins, D. (2019, October 7). Characterization of a Topside Cooled Epoxy-Resin Composite Dielectric (ERCD) Package for Bi-Directional Power Switch. Presented at the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, CA.

Hopkins, D. C., Ballard, B., & Mehrotra, U. (2019, March 17). Design and Integration of WBG Solid State Circuit Protection. Tutorial presented at the IEEE Applied Power Electronics Conference, Anaheim, CA.

Ballard, B., Mehrotra, U., & Hopkins, D. C. (2019, October 29). Designing for Switching Stresses in a Circuit Breaker Application using SiC Semiconductors. Tutorial presented at the 7th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA, Raleigh, NC.

Guven, M., Gao, B., & Hopkins, D. C. (2019, August 6). Development of a High Frequency LLC Resonant Converter for Investigation of MLCCs for EV applications. Presented at the Power America Summer Workshop, Raleigh, NC.

Sinha, S. S., Ballard, B., & Hopkins, D. C. (2019, August 6). ERCD Power Stage Characterization for MV SSCB Application. Presented at the Power America Summer Workshop, Raleigh, NC.

Kulick, J. M., & Hopkins, D. (2019). Edge Interconnect Packaging of Integrated Circuits for Power Systems (US Patent No. 10,325,875B2).

Morgan, A., Gao, B., & Hopkins, D. C. (2019, April 10). High Frequency Self-Oscillating WBG-based Power Conversion. Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Morgan, A. J., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019). New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency. 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2019 IEEE Applied Power Electronics Conference and Exposition (APEC). https://doi.org/10.1109/APEC.2019.8722197

Morgan, A., Kanale, A., Han, K., Baliga, J., & Hopkins, D. C. (2019, April 10). New Dynamic Power MOSFET Model to Determine Maximum Device Operating Frequency. Presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Hopkins, D., & Ballard, B. (2019, August 6). Opportunities in Power Applications using Epoxy Resin Composite Dielectrics. Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Hopkins, D. C. (2019, March 27). Power Packaging Assembly Challenges. Invited keynote presented at the A.R.E.A. Consortium Meeting Universal Instruments, Binghamton, NY.

Jorgensen, A. B., Cheng, T.-H., Hopkins, D., Beczkowski, S., Uhrenfeldt, C., & Munk-Nielsen, S. (2019). Thermal Characteristics and Simulation of an Integrated GaN eHEMT Power Module. 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). Presented at the 2019 21st European Conference on Power Electronics and Applications (EPE '19 ECCE Europe). https://doi.org/10.23919/epe.2019.8915012

Hopkins, D. C. (2019, April 10). Trends in Power Electronics Packaging. Tutorial presented at the FREEDM Systems Center Annual Research Symposium, Raleigh, NC.

Mehrotra, U., & Hopkins, D. (2019, August 6). WBG Solid State Circuit Protection using 10kV/200 A Super Cascode power module. Presented at the Power America Summer Workshop 2019, Raleigh, NC.

Gao, B., Morgan, A. J., Xu, Y., Zhao, X., & Hopkins, D. C. (2018). 6.0kV, 100A, 175kHz super cascode power module for medium voltage, high power applications. Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1288–1293. https://doi.org/10.1109/apec.2018.8341182

Gao, B., Morgan, A., Xu, Y., Zhao, X., Ballard, B., & Hopkins, D. C. (2018). 6.5kV SiC JFET-based Super Cascode Power Module with High Avalanche Energy Handling Capability. 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). https://doi.org/10.1109/wipda.2018.8569146

Gao, B., Morgan, A., Xu, Y., Zhao, X., & Hopkins, D. C. (2018, February 6). 6.5kV, 100A, 175kHz Super Cascode Power Module (SCPM). Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

Chen, T., & Hopkins, D. C. (2018, February 6). Comparing Power Packaging Through A Thermal Resistance Circle Based on Finite Element Analysis. Presented at the PowerAmerica Annual Meeting, Raleigh, NC.

De, A., Morgan, A. J., Mahadeva Iyer, V., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2018). Design, Package, and Hardware Verification of a High-Voltage Current Switch. IEEE Journal of Emerging and Selected Topics in Power Electronics, 6(1), 441–450. https://doi.org/10.1109/jestpe.2017.2727051

Golding, C., & Hopkins, D. C. (2018, June 7). Development of De-encapsulation Process for WBG Semiconductor Packaging Rework and Failure Analysis. Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Hopkins, D. C. (2018, June 25). Heterogeneous Integration Roadmap Update-integrated power electronics (IPE). Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing, College Park, MD.

Gao, B., Zhao, X., & Hopkins, D. C. (2018). Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate. 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). https://doi.org/10.1109/3dpeim.2018.8525238

Han, K., Kanale, A., Baliga, B. J., Ballard, B., Morgan, A., & Hopkins, D. C. (2018). New Short Circuit Failure Mechanism for 1.2kV 4H-SiC MOSFETs and JBSFETs. 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). Presented at the 2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA). https://doi.org/10.1109/wipda.2018.8569178

Guven, M., & Hopkins, D. C. (2018, June 7). Parasitic Integration for 500kHz ZVS DC-DC Converter Using New Polymer Material in IMS Module. Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Zhao, X., Gao, B., Zhang, L. Q., Hopkins, D. C., & Huang, A. Q. (2018). Performance optimization of A 1.2kV SiC high density half bridge power module in 3D package. Thirty-third annual ieee applied power electronics conference and exposition (apec 2018), 1266–1271. https://doi.org/10.1109/apec.2018.8341179

Gao, B., Morgan, A., & Hopkins, D. C. (2018, June 7). Scalable MV/HV Super Cascode Power Module. Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Morgan, A., & Hopkins, D. C. (2018, June 7). Self-Oscillating WBG-based VHF Power Conversion for FREEDM Applications. Presented at the FREEDM Systems Center Annual Meeting, Raleigh, NC.

Hopkins, D. C. (2017). 3D Printing Power Supply in Package Power Supply on Chip versus Discrete Packaging. Panel Discussion presented at the IEEE Applied Power Electronics Conference, Tampa, FL.

Hopkins, D. C., Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., Jiang, Y., … Fukawa, Y. (2017, August 29). Characterization of Novel Materials for Thin Flexible Power Substrates for High-Density Power Electronics. Keynote presented at the ASME International Technical Conference And Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

Morgan, A., Zhao, X., Rouse, J., & Hopkins, D. (2017). Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules. International Symposium on Microelectronics, 2017(1), 000312–000317. https://doi.org/10.4071/isom-2017-wa54_099

Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., & Hopkins, D. C. (2017). Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics Applications. International Symposium on Microelectronics, 2017(1), 000151–000156. https://doi.org/10.4071/isom-2017-tp55_094

Zhao, X., Gao, B., Jiang, Y., Zhang, L., Wang, S., Xu, Y., … Hopkins, D. C. (2017). Flexible epoxy-resin substrate based 1.2 kV SiC half bridge module with ultra-low parasitics and high functionality. https://doi.org/10.1109/ecce.2017.8096700

Hopkins, D. C. (2017). Grid Modernization – FREEDM Systems Center. Presented at the Interagency Advanced Power Group-Electronics Systems Working Group, Tallahassee, FL.

Hopkins, D. C. (2017). Heterogeneous Integration Integrated Power Devices Roadmap. Presented at the Electronics Packaging Symposium and Workshop, Niskayuna, NY.

Ke, H., Jiang, Y., Morgan, A. J., & Hopkins, D. C. (2017). Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power Semiconductors. International Symposium on Microelectronics, 2017(1), 000224–000230. https://doi.org/10.4071/isom-2017-wa32_092

Zhao, X., Jagannadham, K., & Hopkins, D. C. (2017). Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked Dies. International Symposium on Microelectronics, 2017(1), 000353–000359. https://doi.org/10.4071/isom-2017-wp22_095

Zhao, X., Jiang, Y., Gao, B., Nishiguchi, K., Fukawa, Y., & Hopkins, D. C. (2017). Novel Polymer Substrate-Based 1.2 kV/40 A Double-Sided Intelligent Power Module. 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), pp. 1461–1467. https://doi.org/10.1109/ectc.2017.285

Morgan, A., Choobineh, L., Fresne, D., & Hopkins, D. C. (2017). Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Presented at the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. https://doi.org/10.1115/ipack2017-74222

Hopkins, D. C., & Ke, H. (2017). True 3D Power Packaging - Higher Densities Through Orthogonality. Presented at the ASME International Technical Conference and Exhibition on Packaging Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA.

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016). A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2016(HiTEC), 000149–000158. https://doi.org/10.4071/2016-hitec-149

Hopkins, D. C., Xu, Y., Ke, H., & Morgan, A. (2016). A New Power Module Design Resource – Laboratory for Packaging Research in Electronic Energy Systems (PREES). Poster presented at the Electronics Packaging Symp & Heterogeneous Integration Workshop, Binghamton, NY.

Gao, B., & Hopkins, D. C. (2016). A folded GaN VRM with high electrical and thermal performance. 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). https://doi.org/10.1109/3dpeim.2016.7570564

Hopkins, D. C. (2016). Additive Manufacturing – 3D Printing of Electronic Energy Systems and Beyond. Presented at the RTP CFO Forum.

Zhao, X., Xu, Y., & Hopkins, D. C. (2016). Advanced multi-physics simulation for high performance power electronic packaging design. 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). Presented at the 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). https://doi.org/10.1109/3dpeim.2016.8048203

Xu, Y., & Hopkins, D. C. (2016). Application of 3D Printing for Rapid Prototyping of Advanced Power Electronic Modules. Presented at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM 2016), Raleigh, NC.

Zhao, X., Gao, B., & Hopkins, D. C. (2016). Characterization of Ultra-Thin Flexible Ceramics for High-Density, 3D-Stackable Substrates for Wearable Power Electronics. Presented at the Electronics Packaging Symposium & Heterogeneous Integration Workshop, Binghamton, NY.

Morgan, A. J., Xu, Y., Hopkins, D. C., Husain, I., & Yu, W. S. (2016). Decomposition and electro-physical model creation of the CREE 1200V, 50A 3-Ph SiC module. Apec 2016 31st annual ieee applied power electronics conference and exposition, 2141–2146. https://doi.org/10.1109/apec.2016.7468163

Rahman, D., Morgans, A. J., Xu, Y., Gao, R., Yu, W. S., Hopkins, D. C., & Husain, I. (2016). Design methodology for a planarized high power density EV/HEV traction drive using SiC power modules. 2016 ieee energy conversion congress and exposition (ecce). https://doi.org/10.1109/ecce.2016.7855018

De, A., Morgan, A., Iyer, V. M., Ke, H., Zhao, X., Vechalapu, K., … Hopkins, D. C. (2016). Design, package, and hardware verification of a high voltage current switch. Apec 2016 31st annual ieee applied power electronics conference and exposition, 2016-May, 295–302. https://doi.org/10.1109/apec.2016.7467887

Xu, Y., Husain, I., West, H., Yu, W. S., & Hopkins, D. C. (2016). Development of an ultra-high density power chip on bus (PCoB) module. 2016 ieee energy conversion congress and exposition (ecce). https://doi.org/10.1109/ecce.2016.7855040

Xu, Y., & Hopkins, D. (2016). FEA-based thermal-mechanical optimization for DBC based power modules. 2016 International Symposium on 3d Power Electronics Integration and Manufacturing (3d-PEIM).

Hopkins, D. C. (2016). Misconception of Thermal Spreading Angle and Misapplication to PCB & Power Modules. Seminar presented at the Carolina PCB, McKimmon Center, Raleigh, NC.

Zhao, X., Jagannadham, K., Reainthippayasakul, W., Lanagan, M. T., & Hopkins, D. C. (2016). Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications. International Symposium on Microelectronics, 2016(1), 000391–000396. https://doi.org/10.4071/isom-2016-tha13

Zhao, X., Ke, H., Jiang, Y., Morgan, A., Xu, Y., & Hopkins, D. C. (2016, October 10). Ultra Low Leakage Module for 12kV-225 ̊C SiC Semiconductor Testing. Presented at the 49th International Symposium on Microelectronics, Pasadena, CA.

Hopkins, D. C. (2015). 3D Packaging for High Density And High Performance GaN-Based Circuits. 2015 IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), Charlotte, NC.

Hopkins, D. C. (2015, November). 3D Power Electronics Packaging and Additive Manufacturing. Presented at the 3rd IEEE Workshop on Wide Bandgap Power Devices and Applications, Blacksburg, VA.

Morgan, A., De, A., Ke, H., Zhao, X., Vechalapu, K., Hopkins, D. C., & Bhattacharya, S. (2015). A Robust, Composite Packaging Approach for a High Voltage 6.5kV IGBT and Series Diode. International Symposium on Microelectronics, 2015(1), 000359–000364. https://doi.org/10.4071/isom-2015-wp17

Hopkins, D. C. (2015, October 20). Additive Manufacturing (a.k.a. 3D Printing) for Designing Power Electronic Systems. Presented at the Manufacturing Conference 2015 (MFGCON), Raleigh, NC.

Hopkins, D. C., & Ke, H. (2015). Additive Manufacturing In Power Electronics Packaging. Special session presented at the IEEE Applied Power Electronics Conference, Charlotte, NC.

De, A., Morgan, A., Bhattacharya, S., & Hopkins, D. C. (2015). Design considerations of packaging a high voltage current switch. International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, vol 3.

Morgan, A. J., Hopkins, D. C., & McKeown, M. (2015, May). Physical Rf Circuit Techniques And The Implications On Future Power Module Design. Presented at the International Microelectronics Assembly & Packaging Society, Northeast Symposium.

Lawrence, R., & Hopkins, D. C. (2015, December 12). The Evolution and Future Development of Power Electronics as an Essential Element of Power Generation/Delivery, Energy Efficiency, and Industrial Automation. Presented at the North Carolina IEEE Power Electronic Society (PELS) Chapter Seminar, Raleigh, NC.

Sung, W., Huang, A. Q., Baliga, B. J., Ji, I., Ke, H., & Hopkins, D. C. (2015). The first demonstration of symmetric blocking SiC gate turn-off (GTO) thyristor. 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 257–260. https://doi.org/10.1109/ispsd.2015.7123438

Ke, H., Morgan, A., Aman, R., & Hopkins, D. C. (2014). 3D Printing in the Micro- & Power-Electronics Packaging World. Presented at the Carolina PCB, Raleigh, NC.

Hopkins, D. C. (2014). Introduction to 3D Printed Power Electronics & Wide Bandgap Power Semiconductor Packaging. 47th Symposium on Microelectronics (IMAPS 2014). Presented at the 47th Symposium on Microelectronics (IMAPS 2014), San Diego, CA. Retrieved from http://w.gmsystems.com/uploads/3/1/4/3/3143302/imaps2014.pdf

Ke, H., Morgan, A., Aman, R., & Hopkins, D. C. (2014). Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development. International Symposium on Microelectronics, 2014(1), 000887–000892. https://doi.org/10.4071/isom-thp52

Xu, Y., & Hopkins, D. C. (2014). Misconception of thermal spreading angle and misapplication to IGBT power modules. 2014 twenty-ninth annual ieee applied power electronics conference and exposition (apec), 545–551. https://doi.org/10.1109/apec.2014.6803362

Hopkins, D. C., Xu, Y., & Ke, H. (2014). Printed Interfacial Interconnects in High Power Module. Special Session presented at the IEEE Applied Power Electronics Conference, Ft. Worth, TX.

Xu, Y., & Hopkins, D. C. (2014). Thermal-mechanical design and optimization for DBC based power modules [NSF FREEDM System Center Annual Industrial Review].

Ke, H., Xu, Y., & Hopkins, D. C. (2013). Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module Package. International Symposium on Microelectronics, 2013(1), 000758–000763. https://doi.org/10.4071/isom-2013-wp62

Bhat, K. P., Oh, K. W., & Hopkins, D. C. (2013). Feasibility of a MEMS Sensor for Gas Detection in HV Oil-Insulated Transformer. IEEE Transactions on Industry Applications, 49(1), 316–321. https://doi.org/10.1109/tia.2012.2229681

Hopkins, D. C. (2013, March 18). Understanding Impact of New Additive Manufacturing Techniques on Power Electronics Design. Special session presented at the IEEE Applied Power Electronics Conference, Long Beach, California.

Hopkins, D. C. (2012). Advanced Bus Bar System Design. IEEE Energy Conversion Congress and Exposition, ECCE. Presented at the IEEE Energy Conversion Congress and Exposition, ECCE, Raleigh, N.C.

Hopkins, D. C. (2012). Bus Bars – Slap Them Together and They Ought to Work. 27th Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 27th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Orlando, FL.

Ke, H., & Hopkins, D. C. (2012). Development of Printed Power Packaging for a High Voltage SiC Module. International Symposium on Microelectronics, 2012(1), 000955–000960. https://doi.org/10.4071/isom-2012-wp55

Hopkins, D. C., Baltis, T., Pitaress, J. M., & Hazelmyer, D. R. (2012). Extreme Thermal Transient Stress Analysis with Pre-Stress in a Metal Matrix Composite Power Package. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2012(HITEC), 000361–000372. https://doi.org/10.4071/hitec-2012-tha25

Basaran, C., Li, S., Hopkins, D. C., & Yao, W. (2012). Mean time to failure of SnAgCuNi solder joints under DC. 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Presented at the 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). https://doi.org/10.1109/itherm.2012.6231474

Hopkins, D. C. (2012). Point Source Thermal Management in Dense Power Modules and Systems. Special session presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Hopkins, D. C. (2012). Printable Packaging for High Power, High Temperature Power Module. Presented at the IEEE Applied Power Electronics Conference, Orlando, FL.

Bhat, K. P., Guo, Y.-B., Xu, Y., Baltis, T., Hazelmyer, D. R., & Hopkins, D. C. (2012). Results for an Al/AlN composite 350°C SiC solid-state circuit breaker module. 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012, Orlando, FL. https://doi.org/10.1109/apec.2012.6166172

Hopkins, D. C. (2011). Ground Rules for Designing Power Electronics into Evolving MicroGrid Applications. 26th Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 26th Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Fort Worth, TX.

Baltis, T., Hopkins, D. C., Pitaressi, J. M., & Hazelmyer, D. R. (2011). High Thermal-Transient Packaging for a SiC-Based Solid State Circuit Breaker. International Symposium on Microelectronics, 2011(1), 000608–000618. https://doi.org/10.4071/isom-2011-wa5-paper2

Guo, Y.-B., Bhat, K. P., Aravamudhan, A., Hopkins, D. C., & Hazelmyer, D. R. (2011). High current and thermal transient design of a SiC SSPC for aircraft application. 2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC). Presented at the 2011 IEEE Applied Power Electronics Conference and Exposition - APEC 2011. https://doi.org/10.1109/apec.2011.5744759

Hopkins, D. C. (2011). Packaging and Smart Power Systems. In M. H. Rashid (Ed.), Power Electronics Handbook (3rd ed., pp. 1275–1286). https://doi.org/10.1016/b978-0-12-382036-5.00044-6

Bhat, K. P., Oh, K. W., & Hopkins, D. C. (2010). A MEMS Sensor for Gas Detection in High Voltage Oil Filled Equipment. 2010 IEEE Industry Applications Society Annual Meeting. Presented at the 2010 IEEE Industry Applications Society Annual Meeting. https://doi.org/10.1109/ias.2010.5615297

Bhat, K. P., & Hopkins, D. C. (2010). Augmenting Bucholz Relay Using Embedded Mems Gas Sensor. Presented at the 2010 IEEE PES Transmission and Distribution Conference, New Orleans, LA.

Hopkins, D. C., Guo, Y. B., Aravamudhan, A., & Scofield, J. D. (2010). Development and Testing of a 350 ̊C SiC MCPM with Cast Metal Matrix Composites. Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Hopkins, D. C., Guo, Y.-B., Dwyer, H. E., & Scofield, J. D. (2010). Development of a SiC SSPC Module with Advanced High Temperature Packaging. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2010(HITEC), 000310–000315. https://doi.org/10.4071/hitec-dhopkins-wp25

Hopkins, D. C. (2010). Power Electronics in a Smart-Grid Distribution System. 25th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 25th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Palm Springs, CA.

Hopkins, D. C. (2010). Solid-State Protection: Dual-use for Microgrids. Presented at the Advanced Energy Conference, New York, NY.

Wang, G., Du, Y., Guo, Y., Hopkins, D. C., Bhattacharya, S., & Huang, A. (2009). A 6.5kV IGBT Development Module for Renewable Energy Systems. Presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Hosny, A. A., Hopkins, D. C., Gay, Z. B., & Safiuddin, M. (2009). A Dynamic Model for a Gas-Liquid Corona Discharge Using Neural Networks. IEEE Transactions on Power Delivery, 24(3), 1234–1239. https://doi.org/10.1109/tpwrd.2008.2005880

Hopkins, D. C. (2009). Advanced Packaging for Power and Energy. 42nd Symposium on Microelectronics (IMAPS 2009). Presented at the 42nd Symposium on Microelectronics (IMAPS 2009), San Jose, CA.

Hopkins, D. C., Guo, Y. B., & Jao, P. F. (2009). Assessment of Critical Issues for High Temperature, High Voltage Power Modules. Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Basaran, C., Li, S., Hopkins, D. C., & Veychard, D. (2009). Electromigration Time to Failure of SnAgCuNi Solder Joints. Presented at the American Society of Mechanical Engineers (ASME) 2009 InterPack Conference, San Francisco, CA.

Basaran, C., Li, S., Hopkins, D. C., & Veychard, D. (2009). Electromigration time to failure of SnAgCuNi solder joints. Journal of Applied Physics, 106(1), 013707. https://doi.org/10.1063/1.3159012

Hopkins, D. C. (2009). Integrated Packaging Techniques. 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 24th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Washington, D.C.

Guo, Y. B., Jao, P. F., & Hopkins, D. C. (2009). Investigation of High Electrical Gradients in High Voltage Power Modules. Presented at the FREEDM Systems Center Conference, Raleigh, NC.

Guo, Y., Jao, P. F., Wang, G., Du, Y., Bhattacharya, S., & Hopkins, D. C. (2009). Investigation of SiC Power Module Requirement for Smart Grid Applications. Poster presented at the 42th International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Hopkins, D. C. (2008). Advanced Energy Packaging Techniques. 23rd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 23rd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Austin, TX.

Hopkins, D. C. (2008). Advanced Power Packaging for Higher Temperatures and Harsh Environments. 41st International Symposium on Microelectronics. Presented at the 41st International Symposium on Microelectronics, Rhode Island Convention Center, Providence, R.I.

Abdulhamid, M., Hopkins, D. C., & Basaran, C. (2008). Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints. Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Hopkins, D. C., & Kellerman, D. W. (2008). Stress Management in a High Temperature Multilayered Composite Structure. Presented at the High Temperature Electronics Conference (HiTEC 2008), Albuquerque, New Mexico.

Enser, K. E., Hopkins, D. C., & Basaran, C. (2007, April 19). A Review of Electromigration Under Time Varying Current Stressing. Presented at the Society of Automotive Engineers (SAE) International Symposium, Toronto, Canada.

Hopkins, D. C. (2007). Advanced Power Packaging for High Reliability and Higher Temperatures. 40th International Symposium on Microelectronics. Presented at the 40th International Symposium on Microelectronics, San Jose, CA.

McKay, T., Hopkins, D. C., Basaran, C., & Abdulhamid, M. F. (2007). Harsh Environment Thermal Management Using Aluminum-Based Packaging. Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Abdulhamid, M. F., Hopkins, D. C., & Basaran, C. (2007). IMC Effects in Solder from High Thermal Gradients Management. Presented at the International Electronics Packaging Symposium, Niskayuna, NY.

Hopkins, D. C. (2007). Introduction to Power Packaging Techniques. 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 22nd Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

Hopkins, D. C. (2007). Packaging and Smart Power Systems. In M. H. Rashid (Ed.), Power Electronics Handbook (2nd ed., pp. 1147–1158). https://doi.org/10.1016/b978-012088479-7/50060-2

Enser, K. E., Hopkins, D. C., & Basaran, C. (2007). Solder Interconnect Electromigration Due to Time Varying Current Stressing. Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, San Jose, California, USA, 10. Washington, D.C.: IMAPS.

McKay, T., Hopkins, D. C., & Basaran, C. (2007). The effect of layer thickness variation on the thermo-mechanical properties of direct aluminum bonded substrates on AlSiC. Proceedings of the 2007 International Symposium on Microelectronics : November 11-15, 2007, San Jose Convention Center, san Jose, California, USA. Presented at the 40th International Microelectronics and Packaging Society (IMAPS) International Symposium on Microelectronics, San Jose, CA.

Hopkins, D. C. (2006). Advanced Power Electronics Packaging High-Current High Temperature Applications. 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 21st Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), New Orleans, LA.

Hopkins, D. C., Kellerman, D. W., Basaran, C., & Gomez, J. (2006). Aluminum-Based High-Temperature (>200°C) Packaging for SiC Power Converters. Proceedings 2006 International Symposium on Microelectronics : October 8-12, 2006 : San Diego Convention Center, San Diego, Calif., 734–741. Washington, D.C.: IMAPS.

Ye, H., Basaran, C., & Hopkins, D. C. (2006). Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under                 Electric Current Stresses. International Journal of Damage Mechanics, 15(1), 41–67. https://doi.org/10.1177/1056789506054311

Abdulhamid, M. F., Basaran, C., & Hopkins, D. C. (2006). Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2006 International Mechanical Engineering Congress and Exposition. https://doi.org/10.1115/imece2006-13119

Hopkins, D. C., Kellerman, D. W., Wunderlich, R. A., Basaran, C., & Gomez, J. (2006). High-temperature, high-density packaging of a 60kW converter for >200/spl deg/C embedded operation. Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06. Presented at the Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06., Dallas, TX. https://doi.org/10.1109/apec.2006.1620641

Basaran, C., Ye, H., Hopkins, D. C., Frear, D., & Lin, J. K. (2005). Flip chip solder joint failure modes. Advanced Packaging, 14(10), 14–19.

Thondapu, C., Hopkins, D. C., & Holguin, G. (2005). Implementing Digital Power Control In Automotive Alternators. Presented at the Digital Power Forum, Boston MA.

Ye, H., Basaran, C., Hopkins, D. C., & Lin, M. (2005). Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing. Proceedings Electronic Components and Technology, 2005. ECTC '05. Presented at the 2005 55th Electronic Components and Technology Conference. https://doi.org/10.1109/ectc.2005.1441975

Ye, H., Basaran, C., Hopkins, D. C., Frear, D., & Lin, J.-K. (2004). Damage mechanics of microelectronics solder joints under high current densities. 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). Presented at the 2004 54th Electronic Components and Technology Conference, Las Vegas, NV. https://doi.org/10.1109/ectc.2004.1319460

Basaran, C., Ye, H., & Hopkins, D. C. (2004). Deformation of Solder Joints Under Current Stressing: Experimental Measurement and Numerical Simulation. Presented at the 21st International Congress of Theoretical and Applied Mechanics, Warsaw, Poland.

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––I. International Journal of Solids and Structures, 41(18-19), 4939–4958. https://doi.org/10.1016/j.ijsolstr.2004.04.002

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Deformation of solder joint under current stressing and numerical simulation––II. International Journal of Solids and Structures, 41(18-19), 4959–4973. https://doi.org/10.1016/j.ijsolstr.2004.04.003

Basaran, C., Ye, H., Hopkins, D. C., Frear, D., & Lin, J. K. (2004). Failure Modes of Flip Chip Solder Joints Under High Electric Current Density. Journal of Electronic Packaging, 127(2), 157–163. https://doi.org/10.1115/1.1898338

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Mechanical Implications of High Current Densities in Flip-chip Solder Joints. International Journal of Damage Mechanics, 13(4), 335–345. https://doi.org/10.1177/1056789504044282

Ye, H., Basaran, C., & Hopkins, D. C. (2004). Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing. International Journal of Solids and Structures, 41(9-10), 2743–2755. https://doi.org/10.1016/j.ijsolstr.2003.12.001

Hopkins, D. C. (2004). Power Packaging Techniques and High Current Applications. 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 19th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Damage mechanics of microelectronics solder joints under high current densities. International Journal of Solids and Structures, 40(15), 4021–4032. https://doi.org/10.1016/s0020-7683(03)00175-6

Ye, H., Basaran, C., Hopkins, D. C., Liu, H., & Cartright, A. (2003). Flip Chip and BGA Solder Joint Reliability. Advanced Packaging, 12(5), 17–19.

Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of Electrical Current Density Effects in Solder Joints. Advancing Microelectronics, 30(5).

Ye, H., Hopkins, D. C., & Basaran, C. (2003). Measurement of high electrical current density effects in solder joints. Microelectronics Reliability, 43(12), 2021–2029. https://doi.org/10.1016/s0026-2714(03)00131-8

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Measuring Joint Reliability: Applying the Moire Interferometry Technique. Advanced Microelectronics Magazine, 12(5), 17–20.

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Mechanical degradation of microelectronics solder joints under current stressing. International Journal of Solids and Structures, 40(26), 7269–7284. https://doi.org/10.1016/j.ijsolstr.2003.08.019

Ye, H., Basaran, C., & Hopkins, D. C. (2003). Numerical simulation of stress evolution during electromigration in IC interconnect lines. IEEE Transactions on Components and Packaging Technologies, 26(3), 673–681. https://doi.org/10.1109/tcapt.2003.817877

Hopkins, D. C., & Moronski, J. (2003). Partitioning digitally programmable power-control for applications to ballasts. APEC. Seventeenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.02CH37335). Presented at the APEC 2002 - Applied Power Electronics Conference and Exposition, Dallas, TX. https://doi.org/10.1109/apec.2002.989356

Hopkins, D. C. (2003). Power Packaging Techniques with Emphasis on High Current Applications. 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 18th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Miami Beach, FL.

Ye, H., Basaran, C., Hopkins, D., & Cartwright, A. (2003). Reliability of solder joints under electrical stressing - strain evolution of solder joints. ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258). Presented at the ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA. https://doi.org/10.1109/itherm.2002.1012558

Ye, H., Basaran, C., & Hopkins, D. (2003). Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing. Applied Physics Letters, 82(7), 1045–1047. https://doi.org/10.1063/1.1554775

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345). (2002). 52nd Electronic Components and Technology Conference 2002 (Cat No 02CH37345) ECTC-02. Presented at the Proceedings of 52nd Electronic Components and Technology Conference. https://doi.org/10.1109/ECTC.2002.1008063

Hopkins, D. C., Mathuna, S. C. O., Alderman, A. N., & Flannery, J. (2002). A framework for developing power electronics packaging. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.647663

Craig, A. H., Hopkins, D. C., & Driscoll, J. C. (2002). A high speed pulser thyristor. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.653980

Hopkins, D. C., & Bowers, J. S. (2002). Characterization of advanced materials for high voltage/high temperature power electronics packaging. APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181). Presented at the 16th Annual Applied Power Electronics Conference - APEC 2001, Anaheim, CA. https://doi.org/10.1109/apec.2001.912498

Ye, H., Basaran, C., & Hopkins, D. (2002). Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement. SPIE proceedings series, 4828, 231–236. SPIE: Bellingham, Washington.

Ye, H., Hopkins, D. C., & Basaran, C. (2002). Measurement and Effects of High Electrical Current Stress in Solder Joints. Proceedings of the 35th International Symposium on Microelectronics, 427–432.

Ye, H., Basaran, C., & Hopkins, D. (2002). Mechanical Implications of High Current Densities in Flip Chip Solder Joints. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Presented at the ASME 2002 International Mechanical Engineering Congress and Exposition. https://doi.org/10.1115/imece2002-33650

Jacobsen, J. B., & Hopkins, D. C. (2002). Optimally selecting packaging technologies and circuit partitions based on cost and performance. APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058). Presented at the APEC 2000 - Applied Power Electronics Conference, New Orleans, LA. https://doi.org/10.1109/apec.2000.826079

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2002). Packaging issues for next generation high voltage, high temperature power electronic modules. Proceedings of APEC 97 - Applied Power Electronics Conference. Presented at the APEC 97 - Applied Power Electronics Conference, Atlanta, GA. https://doi.org/10.1109/apec.1997.581483

Hopkins, D. C., & Bowers, J. S. (2002). Power Packaging Techniques for Low and Higher Voltage Systems. 17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 17th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Dallas, Tx.

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2002). Power packaging of a 12 kV, 240°C passive electronic module. APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition. Presented at the APEC '98 Thirteenth Annual Applied Power Electronics Conference and Exposition, Anaheim, CA. https://doi.org/10.1109/apec.1998.647736

Hopkins, D. C., & Root, D. W. (2002). Synthesis of a new class of converters that utilize energy recirculation. Proceedings of 1994 Power Electronics Specialist Conference - PESC'94. Presented at the 1994 Power Electronics Specialist Conference - PESC'94, Taipei, Taiwan. https://doi.org/10.1109/pesc.1994.373830

Hopkins, D. C. (2001). Packaging and Smart Power Systems. In M. H. Rashid (Ed.), Power electronics handbook. San Diego, CA: Academic Press.

Hopkins, D. C., & Bowers, J. S. (2001). Power Packaging Techniques for Low and Higher Voltage Systems. 16th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 16th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Anaheim, CA.

Bowers, J. S., Hopkins, D. C., & Sarjeant, W. J. (2000, July). Packaging Factors for Next Generation High Voltage, High Temperature Power Electrons Modules. Presented at the High Temperature Electronics Conference, Albuquerque, New Mexico.

Hopkins, D. C. (1999). Power Electronics Packaging. 14th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 14th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Dallas, TX.

Hopkins, D. C., O’Mathuna, S. C., & Alderman, A. N. (1998). A Four-Dimensional Road-Mapping Framework for Power Packaging Technology. Proceedings of the 1998 IMAPS International Symposium on Microelectronics. Presented at the 1998 International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics, San Diego, CA.

Hopkins, D. C., Pitarressi, J. M., & Karker, J. A. (1998). Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package. International Journal on Microelectronics Reliability.

Hopkins, D. C., & Pitarressi, J. M. (1998). Thermal Impedance and Induced Stress in a Power Package Due to Variation in Layer Thickness. International Journal of Microcircuits and Electronic Packaging.

Hopkins, D. C. (1997). Power Electronics Packaging. Advancing Microelectronics Magazine, 24(1), 10.

Hopkins, D. C. (1997). Power Electronics Packaging - A Circuit Design Approach. 12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC). Presented at the 12th Annual IEEE Conference on Applied Power Electronics Conference and Exposition (APEC), Atlanta, GA.

Hopkins, D. C., Pitarressi, J. M., & Karker, J. A. (1997). Thermal Impedance and Stress in a Power Package Due to Variations in Layer Thickness. SPIE Proceedings Series, 3235, 72–77. SPIE: Bellingham, Washington.

Hopkins, D. C. (1996). High Temperature Capacitors [Final report]. Custom Electronics Inc.

Hopkins, D. C. (1996). Investigation of a Power Package Incorporating a Direct Attached Ceramic/AlSiC Structure [Final report]. BrushWellman Incorporated.

Hopkins, D. C., Pitarressi, J. M., Fridline, D. R., & Karker, J. A. (1996). System Design Considerations for using a Direct–Attached–Ceramic MMC Power Package. Proceedings of 32nd International Power Conversion Conference, 683–690.

Hopkins, D. C. (1995). Assessment of the Power Conversion Thrust Area [Final report]. Lawrence Livermore National Laboratory.

Hopkins, D. C. (1995). Cost Estimate for the ARM Electronic Circuit Cards [Final report]. Lawrence Livermore National Laboratory.

Hopkins, D., & Sarkar, M. (1994). A mathematical approach to minimize the total mass of a space based power system by using multivariable non-linear optimization. Intersociety Energy Conversion Engineering Conference. Presented at the Intersociety Energy Conversion Engineering Conference, Monterey, CA. https://doi.org/10.2514/6.1994-3807

Hopkins, D. C., & Revis, R. (1994). Development of a Three Dimensional Power Circuit Package for Aircraft Applications. 1994 Proceedings: International Symposium on Microelectronics, 124–128.

Hopkins, D. C., & Bhavnani, S. H. (1994). Optimizing Conductor Thickness in Power Hybrid Circuits. International Journal of Microcircuits and Electronic Packaging, (3rd Quarter), 293–301.

Hopkins, D. C., & Bhavnani, S. H. (1993). Determining Conductor Thickness in Power Circuits that Operate at Long Wavelength Frequencies. Proceedings of the 1993 ISHM Intternational Symposium on Microelectronics, 656–661.

Hopkins, D. C., Mosling, C. R., & Hung, S. T. (1993). Dynamic equalization during charging of serial energy storage elements. IEEE Transactions on Industry Applications, 29(2), 363–368. https://doi.org/10.1109/28.216545

Hopkins, D. C., Bhavnani, S. H., & Dalal, K. H. (1993). Effect of Metallization Thickness on Thermal Conductance of a First-Level Power Hybrid Structure. International Journal of Microcircuits and Electronic Packaging, (2nd Quarter), 189–193.

Hung, S. T., Hopkins, D. C., & Mosling, C. R. (1993). Extension of battery life via charge equalization control. IEEE Transactions on Industrial Electronics, 40(1), 96–104. https://doi.org/10.1109/41.184826

Hopkins, D. C. (1993). High Density Shunt Regulator Development [Final report]. Martin Marietta Corporation.

Hopkins, D. C. (1993). Investigation of High Frequency Resonant Effects in Batteries [Final report]. NASA Lewis Research Center.

Hopkins, D. C. (1993). Systems Engineering of Shared Resources: Decision Support System for the Concept Definition Phases. In NASA-OAI Collaborative Aerospace Research and Fellowship Program at Lewis Research Center (pp. 25–26) [Final report]. Lewis Research Center.

NASA Lewis Research Center. (1993). Systems Engineering of Shared Resources: Decision Support for the Concept Design Phase – Modeling Development [Interim Report].

Hopkins, D. C. (1992). Materials Support for the Investigation of Charge Equalization in Serial Batteries (Final Report for NASA Contract No. NAG8-123; pp. VII–1 – VII-21).

Hopkins, D. C., Bhavnani, S. H., & Dalal, K. H. (1992). Numerical Modeling and Experimental Comparison of Copper Bonded AlN, Al2O3 and BeO Power Hybrid Structures. Proceedings of the 1992 International Electronics Packaging Conference. Presented at the 1992 International Electronics Packaging Conference, Austin, TX.

Hopkins, D. C. (1992). Power Measurement in Converters [Final Report]. NASA Lewis Research Center.

Hopkins, D. C., Bhavnani, S. H., & Dalal, K. H. (1992). Thermal Performance Comparison and Metallurgy of Direct Copper Bonded AlN, Al2O3 and BeO Assemblies. Proceedings of the 1992 ISHM International Symposium on Microelectronics, 577–583.

Hopkins, D. C. (1991). Optimum Operating Temperature for a Minimum Mass Space Power System [Final Report]. NASA Lewis Research Center.

Hopkins, D. C., Mosling, C. R., & Hung, S. T. (1991). The use of equalizing converters for serial charging of long battery strings. [Proceedings] APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition. Presented at the APEC '91: Sixth Annual Applied Power Electronics Conference and Exhibition, Dallas, TX. https://doi.org/10.1109/apec.1991.146221

Hopkins, D. C. (1990). Current Limiting Remote Power Control Module (Final Report No. NGT-01-002-009). NASA Marshal Space Flight Center.

Hopkins, D. C. (1989). Designing Hybrid Power Supplies. Powertechnics Magazine, 5(6), 31–34.

Jovanovic, M. M., Hopkins, D. C., & Lee, F. C. Y. (1989). Evaluation and design of megahertz-frequency off-line zero-current-switched quasi-resonant converters. IEEE Transactions on Power Electronics, 4(1), 136–146. https://doi.org/10.1109/63.21882

Hopkins, D. C. (1989). High Density Power Transformer. Unisys Corporation.

Hopkins, D. C., & Lee, F. C. (1989). High-Performance, High-Frequency, Distributed, Computer Power Supply Technology. Digital Equipment Corporation.

Hopkins, D. C., Jovanovic, M. M., Lee, F. C. Y., & Stephenson, F. W. (1989). Hybridized off-line 2-MHz zero-current-switched quasi-resonant converter. IEEE Transactions on Power Electronics, 4(1), 147–154. https://doi.org/10.1109/63.21883

Johnson, R. W., Weeks, R., Hopkins, D. C., Muir, J., & Williams, J. R. (1989). Plated copper on ceramic substrates for power hybrid circuits. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 12(4), 530–536. https://doi.org/10.1109/33.49011

Hopkins, D. C., Jovanovic, M. M., Lee, F. C., & Stephenson, F. W. (1989). Power-Hybrid Design of a High-Frequency ZCS-QRC. Proceedings of the Fourth Annual High Frequency Power Conversion Conference, 304–317.

Hopkins, D. C. (1989). Testing of High Power Devices (Final Report No. LABCOM-ETDL, DAAL03-86-D-001, DO 1576). U.S. Army.

Hopkins, D. C. (1989). The Effects of Power Hybridization on Power Electronic Circuits. ISHM International Symposium on Microelectronics Proceedings, 647–654.

Johnson, R. W., Hopkins, D. C., & Jaeger, R. C. (1989). The Microelectronics Program at Auburn University. ISHM International Symposium on Microelectronics Proceedings, 367–375.

Hopkins, D. C. (1989). Thick-Film Technique Helps Hybridized, 2 MHz ZC-QR Converter Achieve 78% Efficiency. Power Conversion & Intelligent Motion, 15(7), 57–66.

Hopkins, D. C. (1989). Thick-film power hybridization of switchmode power circuits. Proceedings, Fourth Annual IEEE Applied Power Electronics Conference and Exposition. Presented at the Fourth Annual IEEE Applied Power Electronics Conference and Exposition, Baltimore, MD. https://doi.org/10.1109/apec.1989.36977

Hopkins, D. C., Stephenson, F. W., & Lee, F. C. (1988). Determination of Conductor Thickness and Width for Power-Hybrid Circuits. Proceedings of the Sixth Annual Power Electronics Seminar, 71–83.

Hopkins, D. C. (1988). Development of a High-Density, Off-Line, Quasi-Resonant Converter Using Hybrid Techniques (Ph.D. Dissertation). Virginia Polytechnic Institute and State University.

Hopkins, D. C., & Lee, F. C. (1988). High-Performance, High-Frequency, Distributed, Computer Power Supply Technology. Digital Equipment Corporation.

Hopkins, D. C., Stephenson, F. W., & Lee, F. C. (1988). Off-Line ZCS-QRC Thick-Film Hybrid Circuit. Proceedings of the Sixth Annual Power Electronics Seminar, 71–83.

Hopkins, D. C., Stephenson, F. W., & Lee, F. C. (1988). Printing of Thick Thick-Film Conductors for Power Hybrid Circuits. ISHM International Symposium on Microelectronics Proceedings, 95–101.

Jovanovic, M. M., Hopkins, D. C., & Lee, F. C. (1987). Design Aspects for High-Frequency Off-Line Quasi-Resonant Converter. Proceedings of the Second Annual High Frequency Power Conversion Conference, 83–97.

Hopkins, D. C., & Lee, F. C. (1987). High-Performance, High-Frequency, Distributed, Computer Power Supply Technology. Digital Equipment Corporation.

Hopkins, D. C., Jovanovicm, M. M., Lee, F. C., & Stephenson, F. W. (1987). Two-megahertz off-line hybridized quasi-resonant converter. 1987 IEEE Applied Power Electronics conference and Exposition. Presented at the IEEE Applied Power Conference and Exposition, San Diego, CA. https://doi.org/10.1109/apec.1987.7067139

Hopkins, D. C., Jovanovic, M. M., Stephenson, F. W., & Lee, F. C. (1986). One-Megahertz, Off-Line Converter Hybridization. Proceedings of the Fourth Annual Power Electronics Seminar, 134–148.

Hopkins, D. C., & Lee, F. C. (1985). Evaluation of Semiconductor Devices for Electric and Hybrid Vehicles (EHV) AC-Drive Applications, (No. JPL9950-1038). Department of Energy and Jet Propulsion Laboratory.

Hopkins, D. C., & Lee, F. C. (1985). Very High Frequency Quasi-Resonant Converters for Use in High Density Power Supplies for Military Applications. Texas Instruments Inc.

Hopkins, D. C. (1984). Status of Power Devices, IC's and Support Chips. Proceedings of the Second Annual Power Electronics Seminar, 2–9.

Hopkins, D. C. (1983). Status of Semiconductor Power Switching Devices. Proceedings of the First Annual Power Electronics Seminar, 82–91.

Steigerwald, R. L., & Hopkins, D. C. (1981). Characteristic Input Harmonics of DC-DC Converters and their Effect on Input Filter Design. IEEE Transactions on Industrial Electronics and Control Instrumentation, IECI-28(2), 73–82. https://doi.org/10.1109/tieci.1981.351029

Weeks, R., Johnson, R. W., Hopkins, D., Muir, J., & Williams, J. R. (1969). Plated copper on ceramic for power hybrid applications. Proceedings., 39th Electronic Components Conference. Presented at the 39th Electronic Components Conference, Houston, TX. https://doi.org/10.1109/ecc.1989.77803

Ye, H., Basaran, C., & Hopkins, D. C. Experimental Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation, Atomic Flux Measurement. IMAPS International Conference on Advanced Packaging Systems. Presented at the IMAPS International Conference on Advanced Packaging Systems, Reno, NV.

Hopkins, D. C. Introduction to 3D Power Electronics & Post-Silicon Device Packaging. 46th Symposium on Microelectronics (IMAPS 2013). Presented at the 46th Symposium on Microelectronics (IMAPS 2013), Orlando, FL. Retrieved from https://meridian.allenpress.com/imaps-am/article-pdf/40/4/1/2068365/amim-40-4.pdf

Ye, H., Basaran, C., & Hopkins, D. C. Pb Phase Growth in Eutectic Pb/Sn Flip Chip Solder Joint under Current Stressing.” Proceedings of 2003 Mechanics and Materials Conference. Presented at the 2003 Mechanics and Materials Conference, Scottsdale, AZ.