@article{stevens_mousa_parsons_2018, title={Thermal atomic layer deposition of Sn metal using SnCl4 and a vapor phase silyl dihydropyrazine reducing agent}, volume={36}, ISSN={["1520-8559"]}, DOI={10.1116/1.5055212}, abstractNote={This work explores a novel, thermal atomic layer deposition (ALD) process to deposit tin metal at a low temperature. The authors employ 1,4-bis(trimethylsilyl)-1,4-dihydropyrazine (DHP) to reduce SnCl4 on silicon substrates. The authors explored a range of temperatures between 130 and 210 °C to determine the ALD window, which was found to be 170–210 °C. The authors show that this process yields a growth rate of ∼0.3 Å per cycle at 190 °C. Furthermore, X-ray photoelectron spectroscopy results showed that the film impurities are reduced for depositions within the ALD window. The reaction mechanism was explored using in situ mass spectrometry and in situ quartz crystal microbalance (QCM). Within the ALD temperature window, the QCM results showed a saturated mass gain during the SnCl4 exposure and a net mass loss during the DHP dose. Consistent with the QCM results, in situ mass spectroscopy data indicate that the DHP exposure step removes surface Cl via formation of volatile trimethylsilyl chloride and pyrazine by-products, effectively reducing the oxidation state of surface-bound Sn. This work is the first thermal Sn metal ALD process to be reported in literature and the oxidation/reduction chemistry presented here may be applied to other metal precursors, increasing the applicability of metal ALD use in industry.}, number={6}, journal={JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A}, author={Stevens, Eric C. and Mousa, Moataz Bellah M. and Parsons, Gregory N.}, year={2018}, month={Nov} }
 @inproceedings{ives_collins_oldham_stevens_williams_mantini_parsons_2016, title={Corrosion mitigation coatings for RF sources and components}, DOI={10.1109/ivec.2016.7561851}, abstractNote={Most all high power RF sources and components require liquid cooling, usually high purity water. Copper and associated braze alloys are susceptible to corrosion if the water contains impurities or modest levels of oxygen. Unfortunately, high purity water is not readily available in many locations, including developing countries, remote sites, and naval vessels. The U.S. Navy is funding development of protective coatings to reduce or eliminate corrosion in copper coolant channels in RF sources and solenoids. This presentation will describe procedures for applying corrosion mitigation coatings in RF sources and associated components and equipment.}, booktitle={2016 ieee international vacuum electronics conference (ivec)}, author={Ives, R. L. and Collins, G. and Oldham, C. J. and Stevens, E. C. and Williams, P. S. and Mantini, M. J. and Parsons, G. N.}, year={2016} }
 @article{zhao_gong_nunn_lemaire_stevens_sidi_williams_oldham_walls_shepherd_et al._2015, title={Conformal and highly adsorptive metal-organic framework thin films via layer-by-layer growth on ALD-coated fiber mats}, volume={3}, ISSN={["2050-7496"]}, url={http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000346906100014&KeyUID=WOS:000346906100014}, DOI={10.1039/c4ta05501b}, abstractNote={Fiber@ALD@MOF structures fabricated via ALD and layer-by-layer MOF synthesis show good conformality and high adsorption capacity.}, number={4}, journal={JOURNAL OF MATERIALS CHEMISTRY A}, author={Zhao, Junjie and Gong, Bo and Nunn, William T. and Lemaire, Paul C. and Stevens, Eric C. and Sidi, Fahim I. and Williams, Philip S. and Oldham, Christopher J. and Walls, Howard J. and Shepherd, Sarah D. and et al.}, year={2015}, pages={1458–1464} }