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2022 journal article
SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY.
By: T. Liu, H. Zhang, S. Isukapati, E. Ashik, A. Morgan, B. Lee, W. Sung, A. Fayed, M. White, A. Agarwal
Development of Isolated CMOS and HV MOSFET on an N- epi/P- epi/4H-SiC N+ Substrate for Power IC Applications
2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA).
By: S. Isukapati, A. Morgan, W. Sung, H. Zhang, T. Liu, A. Fayed, A. Agarwal, E. Ashik, B. Lee
SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology
2021 IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS).
By: T. Liu, H. Zhang, S. Isukapati, E. Ashik, A. Morgan, B. Lee, W. Sung, M. White, A. Fayed, A. Agarwal