@inproceedings{zhao_gadfort_erickson_franzon_2013, title={A compact inductively coupled connector for mobile devices}, DOI={10.1109/ectc.2013.6575919}, abstractNote={A nested inductive connector, consisting of a single power channel and one or more data channels, is proposed as replacement for legacy conductive connectors in mobile devices. Advantages include minimized space in the mobile device, waterproofing, orientation independence, and resistance to stress through a breakaway mechanism. A simulation and analysis of relevant parameters, such as the transfer coefficients for both the power and data channels as well as crosstalk, of the connector design for a simple 2-layer PCB is presented. As an example, the proposed connector is utilized as a replacement for a standard TRS headphone jack found on many mobile devices. The connect or features an AC to DC rectifier, data transmitting circuits, as well as a Class-D power amplifier to drive a pair of headphones.}, booktitle={2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)}, author={Zhao, W. X. and Gadfort, P. and Erickson, E. and Franzon, Paul}, year={2013}, pages={2385–2390} }
 @inproceedings{erickson_wilson_chandrasekar_franzon_2009, title={Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors}, DOI={10.1109/epeps.2009.5338463}, abstractNote={Multi-bit fractional equalization at the driver side allows for multi-Gb/s signaling across transformers which suffer from excessive ISI in inductively coupled connectors and backplanes. When an inductively coupled element is place in a transmission line or the gap between inductors in a transformer increases, the amplitude of the coupled pulse is decreased while the natural decay of the pulse is maintained. By removing the effects of the natural decaying tail of the pulse created by coupling an NRZ signal across a transformer, high-speed inductive coupling can be achieved over the larger transformers required by connectors and backplanes.}, booktitle={Electrical Performance of Electronic Packaging and Systems}, author={Erickson, E. and Wilson, J. and Chandrasekar, K. and Franzon, Paul}, year={2009}, pages={121–124} }
 @inproceedings{chandrasekar_wilson_erickson_feng_xu_mick_franzon_2008, title={Inductively coupled connectors and sockets for multi-Gb/s pulse signaling}, volume={31}, DOI={10.1109/tadvp.2008.2005465}, abstractNote={Multi-Gb/s pulse signaling is demonstrated with inductively coupled interconnects across packaging interfaces. This has application in realizing submillimeter pitch, true zero insertion force (ZIF) surface mount connectors, and sockets. The signaling data rate achieved in this system is from 1 to 8.5 Gbps, which depends on the 3-dB coupling frequency of the composite channel consisting of the inductive interconnections and the transmission lines. This paper presents the results of a set of experiments demonstrating this capability and describes the principles behind the design of inductively coupled sockets and connectors.}, number={4}, booktitle={IEEE Transactions on Advanced Packaging}, author={Chandrasekar, K. and Wilson, J. and Erickson, E. and Feng, Z. P. and Xu, J. and Mick, S. and Franzon, Paul}, year={2008}, pages={749–758} }
 @article{xu_mick_wilson_luo_chandrasekar_erickson_franzon_2004, title={AC coupled interconnect for dense 3-D ICs}, volume={51}, ISSN={["1558-1578"]}, DOI={10.1109/TNS.2004.834712}, abstractNote={This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs). The concept of inductive ACCI for 3-D ICs has been proposed. Combined with the "through vias" technology, inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. Transformer modeling and transceiver circuit design have also been investigated. Simulations predict that, for 20 /spl mu/m thinned die stacks coupled by a 100 /spl mu/m diameter transformer, the transceiver circuit fed with a 5 Gbps data stream consumes 14.5 mW power.}, number={5}, journal={IEEE TRANSACTIONS ON NUCLEAR SCIENCE}, author={Xu, J and Mick, S and Wilson, J and Luo, L and Chandrasekar, K and Erickson, E and Franzon, PD}, year={2004}, month={Oct}, pages={2156–2160} }