Fan Zhang

Works (3)

Updated: April 11th, 2023 10:13
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2012 journal article

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 28(1), 27–38.

By: Y. Lou, Z. Yan n, F. Zhang & P. Franzon 

author keywords: TSV; 3D stacking yield; On-chip capacitor bridge; Test-before-stacking
Sources: Web Of Science, ORCID
Added: August 6, 2018

1997 journal article

A defective signal peptide tethers the floury-2 zein to the endoplasmic reticulum membrane

PLANT PHYSIOLOGY, 114(1), 345–352.

By: J. Gillikin, F. Zhang, C. Coleman n, H. Bass n, B. Larkins n & R. Boston

Source: Web Of Science
Added: August 6, 2018

1997 journal article

Molecular chaperone activity of er-resident proteins in seeds

Current Topics in Plant Biochemistry and Physiology, 16(1997), 3–4.

By: R. Boston, J. Gillikin, R. Wrobel & F. Zhang

Source: NC State University Libraries
Added: August 6, 2018