@article{charles_franzon_2015, title={A multitier study on various stacking topologies of TSV-based PDN systems using on-chip decoupling capacitor models}, volume={5}, DOI={10.1109/tcpmt.2015.2416196}, number={4}, journal={IEEE transactions on Components Packaging and Manufacturing Technology}, author={Charles, G. and Franzon, Paul}, year={2015}, pages={541–550} }
 @inproceedings{charles_franzon_2012, title={Comparison of TSV-based PDN-design effects using various stacking topology methods}, DOI={10.1109/epeps.2012.6457848}, booktitle={Ieee conference on electrical performance of electronic packaging and}, author={Charles, G. and Franzon, Paul}, year={2012}, pages={83–86} }
 @inproceedings{charles_franzon_kim_levin_2011, title={Analysis and approach of TSV-based hierarchical power distribution networks for estimating 1st-droop and resonant noise in 3DIC}, DOI={10.1109/epeps.2011.6100243}, booktitle={Ieee conference on electrical performance of electronic packaging and}, author={Charles, G. and Franzon, Paul and Kim, J. and Levin, A.}, year={2011}, pages={267–270} }