Hantang Qin

Qin, H. T., Dong, J., & Lee, Y.-S. (2017). AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates. Robotics and Computer-Integrated Manufacturing, 43, 179–187. https://doi.org/10.1016/j.rcim.2015.09.010

Qin, H. T., Wei, C., Dong, J., & Lee, Y.-S. (2017). Direct printing and electrical characterization of conductive micro-silver tracks by alternating current-pulse modulated electrohydrodynamic jet printing. Journal of Manufacturing Science and Engineering, 139(2). https://doi.org/10.1115/1.4033903

Qin, H. T., Cai, Y., Dong, J., & Lee, Y.-S. (2016). Direct printing of capacitive touch sensors on flexible substrates by additive e-jet printing with silver nanoinks. Proceedings of the ASME 11th International Manufacturing Science and Engineering Conference, 2016, vol 1, 139(3). https://doi.org/10.1115/msec2016-8740

Wei, C., Qin, H. T., Chiu, C. P., Lee, Y.-S., & Dong, J. (2015). Drop-on-demand E-jet printing of continuous interconnects with AC-pulse modulation on highly insulating substrates. Journal of Manufacturing Systems, 37, 505–510. https://doi.org/10.1016/j.jmsy.2014.07.005

Qin, H. T., Dong, J., & Lee, Y.-S. (2015). Electrohydrodynamic jet printing of silver seeds: Micro scale patterning by electroless copper deposition. Proceedings of the ASME 10th International Manufacturing Science and Engineering Conference, 2015, vol 1. https://doi.org/10.1115/msec2015-9487

Qin, H. T., Wei, C., Dong, J., & Lee, Y.-S. (2014). Direct fabrication of highly conductive micro silver tracks using electrohydrodynamic jet printing for sub-20 mu m micro-manufacturing. Proceedings of the ASME 9th International Manufacturing Science and Engineering Conference, 2014, vol 2, 2. https://doi.org/10.1115/msec2014-4163

Wei, C., Qin, H. T., Ramirez-Iglesias, N. A., Chiu, C. P., Lee, Y.-S., & Dong, J. (2014). High-resolution AC-pulse modulated electrohydrodynamic jet printing on highly insulating substrates. Journal of Micromechanics and Microengineering, 24(4). https://doi.org/10.1088/0960-1317/24/4/045010