Hantang Qin Qin, H., Dong, J., & Lee, Y.-S. (2017). AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates. ROBOTICS AND COMPUTER-INTEGRATED MANUFACTURING, 43, 179–187. https://doi.org/10.1016/j.rcim.2015.09.010 Qin, H., Wei, C., Dong, J., & Lee, Y.-S. (2017). Direct Printing and Electrical Characterization of Conductive Micro-Silver Tracks by Alternating Current-Pulse Modulated Electrohydrodynamic Jet Printing. JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 139(2). https://doi.org/10.1115/1.4033903 Qin, H. T., Cai, Y., Dong, J., & Lee, Y.-S. (2016). Direct printing of capacitive touch sensors on flexible substrates by additive e-jet printing with silver nanoinks. Proceedings of the ASME 11th International Manufacturing Science and Engineering Conference, 2016, vol 1, 139(3). https://doi.org/10.1115/msec2016-8740 Wei, C., Qin, H., Chiu, C.-P., Lee, Y.-S., & Dong, J. (2015). Drop-on-demand E-jet printing of continuous interconnects with AC-pulse modulation on highly insulating substrates. JOURNAL OF MANUFACTURING SYSTEMS, 37, 505–510. https://doi.org/10.1016/j.jmsy.2014.07.005 Qin, H., Dong, J., & Lee, Y.-S. (2015). ELECTROHYDRODYNAMIC JET PRINTING OF SILVER SEEDS: MICRO SCALE PATTERNING BY ELECTROLESS COPPER DEPOSITION. PROCEEDINGS OF THE ASME 10TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, 2015, VOL 1. https://doi.org/10.1115/msec2015-9487 Qin, H., Wei, C., Dong, J., & Lee, Y.-S. (2014). DIRECT FABRICATION OF HIGHLY CONDUCTIVE MICRO SILVER TRACKS USING ELECTROHYDRODYNAMIC JET PRINTING FOR SUB-20 mu M MICRO-MANUFACTURING. PROCEEDINGS OF THE ASME 9TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, 2014, VOL 2, Vol. 2. https://doi.org/10.1115/msec2014-4163 Wei, C., Qin, H., Ramirez-Iglesias, N. A., Chiu, C.-P., Lee, Y.-shin, & Dong, J. (2014). High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 24(4). https://doi.org/10.1088/0960-1317/24/4/045010