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Chiplet Set For Artificial Intelligence
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.
By: J. Stevens n, T. Pan n, P. Ravichandiran n & P. Franzon n
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
By: P. Franzon n , W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Pan n, L. Baker n ...and 3 other authors, including 1 NC State author, J. Schabel n, S. Dey n & W. Li n