Josh Stevens

College of Engineering

Works (2)

Updated: March 2nd, 2024 22:09

2023 article

Chiplet Set For Artificial Intelligence

2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.

By: J. Stevens n, T. Pan n, P. Ravichandiran n & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: ASIP; chiplet; AI accelerator; AIB
Sources: Web Of Science, ORCID
Added: August 14, 2023

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon n, W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Pan n, L. Baker n ...

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: July 11, 2022

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