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Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
By: P. Franzon, W. Davis, E. Rotenberg, J. Stevens, S. Lipa, T. Nigussie, H. Pan, L. Baker ...and 3 other authors, including 1 NC State author, J. Schabel, S. Dey & W. Li