Josh Stevens
College of Engineering
Is this your profile?
Claim your Citation Index profile in order to display more information about you and gain access to Libraries services. Just create or connect your ORCID iD.
Create or connect your ORCID iD
Works (2)
Updated: April 5th, 2024 15:41
2023 article
Chiplet Set For Artificial Intelligence
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.
author keywords: ASIP; chiplet; AI accelerator; AIB
TL;DR:
This paper presents a chipletized design used for Artificial Intelligence, which details a scalable AI chiplet set, along with Central Processing Units (CPUs), and focuses on phase one, which uses the United Semiconductor Japan Co. (USJC) 55 nm LP process to fabricate the design.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 14, 2023
2021 article
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
TL;DR:
2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 11, 2022
Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.
Certain data included herein are derived from the Web of Science© and InCites© (2024) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.
