Josh Stevens

College of Engineering

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon, W. Davis, E. Rotenberg, J. Stevens, S. Lipa, T. Nigussie, H. Pan, L. Baker ...

Source: Web Of Science
Added: July 11, 2022