Josh Stevens
College of Engineering
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Works (2)
Updated: April 5th, 2024 15:41
2023 article proceedings
Chiplet Set For Artificial Intelligence
Event: 2023 IEEE International 3D Systems Integration Conference (3DIC)
author keywords: ASIP; chiplet; AI accelerator; AIB
topics (OpenAlex): Advanced Memory and Neural Computing; Ferroelectric and Negative Capacitance Devices; VLSI and Analog Circuit Testing
TL;DR:
This paper presents a chipletized design used for Artificial Intelligence, which details a scalable AI chiplet set, along with Central Processing Units (CPUs), and focuses on phase one, which uses the United Semiconductor Japan Co. (USJC) 55 nm LP process to fabricate the design.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: August 14, 2023
2021 article proceedings
Design for 3D Stacked Circuits
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Interconnection Networks and Systems
TL;DR:
2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: July 11, 2022