Josh Stevens

Stevens, J. A., Pan, T.-H., Ravichandiran, P. P., & Franzon, P. D. (2023). Chiplet Set For Artificial Intelligence. 2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC. https://doi.org/10.1109/3DIC57175.2023.10154953

Franzon, P., Davis, W., Rotenberg, E., Stevens, J., Lipa, S., Nigussie, T., … Li, W. (2021). Design for 3D Stacked Circuits. 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM). https://doi.org/10.1109/IEDM19574.2021.9720553