John M. Wilson

Works (12)

Updated: July 5th, 2023 15:58

2009 article

Flexible, durable printed electrical circuits

Karaguzel, B., Merritt, C. R., Kang, T., Wilson, J. M., Nagle, H. T., Grant, E., & Pourdeyhimi, B. (2009, March 2). Journal of the Textile Institute, Vol. 100, pp. 1–9.

By: B. Karaguzel n, C. Merritt n, T. Kang n, J. Wilson n, H. Nagle n , E. Grant n, B. Pourdeyhimi n 

author keywords: nonwovens; washability; electrical circuits; wearable electronics
topics (OpenAlex): Advanced Sensor and Energy Harvesting Materials; Nanomaterials and Printing Technologies; Additive Manufacturing and 3D Printing Technologies; Textile materials and evaluations
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2008 article

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z., Xu, J., Mick, S., & Franzon, P. (2008, November 1). IEEE Transactions on Advanced Packaging, Vol. 31, pp. 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

topics (OpenAlex): Semiconductor Lasers and Optical Devices; 3D IC and TSV technologies; Advancements in PLL and VCO Technologies
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2008 patent

Method and apparatus for a monodiameter wellbore, monodiameter casing, monobore, and/or monowell

Washington, DC: U.S. Patent and Trademark Office.

By: G. Wylie, F. Zamora, B. Mulari, B. Reddy, W. L. S., W. J. D., B. J. M., F. D., . R. M., A. Culotta

Source: NC State University Libraries
Added: August 6, 2018

2008 article

Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks

Karaguzel, B., Merritt, C. R., Kang, T., Wilson, J. M., Nagle, H. T., Grant, E., & Pourdeyhimi, B. (2008, January 1). Journal of the Textile Institute, Vol. 99, pp. 37–45.

By: B. Karaguzel n, C. Merritt n, T. Kang  n, J. Wilson n, H. Nagle n , E. Grant n, B. Pourdeyhimi n 

author keywords: conductive inks; electrical circuits; nonwovens; printing
topics (OpenAlex): Advanced Sensor and Energy Harvesting Materials; Nanomaterials and Printing Technologies; Dielectric materials and actuators
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2007 article

Fully Integrated AC Coupled Interconnect Using Buried Bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May 1). IEEE Transactions on Advanced Packaging, Vol. 30, pp. 191–199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede*, A. Huffman*, R. LaBennett*, P. Franzon n 

author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
topics (OpenAlex): Advancements in PLL and VCO Technologies; Semiconductor materials and devices; 3D IC and TSV technologies
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2007 article

Voltage-Mode Driver Preemphasis Technique For On-Chip Global Buses

Zhang, L., Wilson, J. M., Bashirullah, R., Luo, L., Xu, J., & Franzon, P. D. (2007, February 1). IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Vol. 15, pp. 231–236.

By: L. Zhang  n, J. Wilson n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon n 

author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
topics (OpenAlex): Interconnection Networks and Systems; Low-power high-performance VLSI design; VLSI and FPGA Design Techniques
TL;DR: This paper demonstrates that driver preemphasis technique can be used for on-chip global buses to increase signal channel bandwidth and reduces power consumption by 12%-39% for data activity factors above 0.1. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2005 journal article

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo n, J. Wilson n, S. Mick n, J. Xu  n, L. Zhang  n & P. Franzon n 

author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
topics (OpenAlex): Advancements in PLL and VCO Technologies; Radio Frequency Integrated Circuit Design; Semiconductor Lasers and Optical Devices
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, Crossref, NC State University Libraries
Added: August 6, 2018

2005 article

Demystifying 3D ICs: The Pros and Cons of Going Vertical

Davis, W. R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., … Franzon, P. D. (2005, June 1). IEEE Design & Test of Computers, Vol. 22, pp. 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, J. Xu  n, H. Hua n, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; VLSI and FPGA Design Techniques; Semiconductor materials and devices
TL;DR: A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October 1). IEEE Transactions on Nuclear Science, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor Lasers and Optical Devices; Photonic and Optical Devices
TL;DR: This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2004 article

Buried Bump and AC Coupled Interconnection Technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February 1). IEEE Transactions on Advanced Packaging, Vol. 27, pp. 121–125.

By: S. Mick n, L. Luo n, J. Wilson n & P. Franzon n 

author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
topics (OpenAlex): Electronic Packaging and Soldering Technologies; 3D IC and TSV technologies; Integrated Circuits and Semiconductor Failure Analysis
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

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