Works (12)

Updated: July 5th, 2023 15:58

2009 journal article

Flexible, durable printed electrical circuits

JOURNAL OF THE TEXTILE INSTITUTE, 100(1), 1–9.

By: B. Karaguzel n, C. Merritt n, T. Kang  n, J. Wilson n, H. Nagle n , E. Grant n, B. Pourdeyhimi n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: nonwovens; washability; electrical circuits; wearable electronics
Sources: Web Of Science, ORCID
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2008 patent

Method and apparatus for a monodiameter wellbore, monodiameter casing, monobore, and/or monowell

Washington, DC: U.S. Patent and Trademark Office.

By: G. Wylie, F. Zamora, B. Mulari, B. Reddy, W. L. S., W. J. D., B. J. M., F. D., . R. M., A. Culotta

Source: NC State University Libraries
Added: August 6, 2018

2008 journal article

Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks

JOURNAL OF THE TEXTILE INSTITUTE, 99(1), 37–45.

By: B. Karaguzel n, C. Merritt n, T. Kang  n, J. Wilson n, H. Nagle n , E. Grant n, B. Pourdeyhimi n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: conductive inks; electrical circuits; nonwovens; printing
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 article

Fully integrated AC coupled interconnect using buried bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede*, A. Huffman*, R. LaBennett*, P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
Sources: Web Of Science, ORCID
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.

By: L. Zhang  n, J. Wilson n, R. Bashirullah*, L. Luo n, J. Xu n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
Sources: Web Of Science, ORCID
Added: August 6, 2018

2006 journal article

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo n, J. Wilson n, S. Mick n, J. Xu  n, L. Zhang  n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, M. Xu*, H. Hua*, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

Buried bump and AC coupled interconnection technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.

By: S. Mick n, L. Luo n, J. Wilson n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

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