Works (12)

2009 journal article

Flexible, durable printed electrical circuits

Journal of the Textile Institute, 100(1), 1–9.

By: B. Karaguzel, C. Merritt, T. Kang, J. Wilson, H. Nagle, E. Grant, B. Pourdeyhimi

Source: NC State University Libraries
Added: August 6, 2018

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

Source: NC State University Libraries
Added: August 6, 2018

2008 patent

Method and apparatus for a monodiameter wellbore, monodiameter casing, monobore, and/or monowell

Washington, DC: U.S. Patent and Trademark Office.

By: G. Wylie, F. Zamora, B. Mulari, B. Reddy, W. L. S., W. J. D., B. J. M., F. D., . R. M., A. Culotta

Source: NC State University Libraries
Added: August 6, 2018

2008 journal article

Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks

Journal of the Textile Institute, 99(1), 37–45.

By: B. Karaguzel, C. Merritt, T. Kang, J. Wilson, H. Nagle, E. Grant, B. Pourdeyhimi

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Fully integrated AC coupled interconnect using buried bumps

IEEE Transactions on Advanced Packaging, 30(2), 191–199.

By: J. Wilson, S. Mick, J. Xu, L. Luo, S. Bonafede, A. Huffman, R. LaBennett, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Voltage-mode driver preemphasis technique for on-chip global buses

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 15(2), 231–236.

By: L. Zhang, J. Wilson, R. Bashirullah, L. Luo, J. Xu & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2006 journal article

3 Gb/s AC, coupled chip-to-chip communication using a low swing pulse receiver

IEEE Journal of Solid-State Circuits, 41(1), 287–296.

By: L. Luo, J. Wilson, S. Mick, J. Xu, L. Zhang & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE Design & Test of Computers, 22(6), 498–510.

By: W. Davis, J. Wilson, S. Mick, M. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science, 51(5), 2156–2160.

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

Buried bump and AC coupled interconnection technology

IEEE Transactions on Advanced Packaging, 27(1), 121–125.

By: S. Mick, L. Luo, J. Wilson & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018