John M. Wilson
Works (12)
Updated: July 5th, 2023 15:58
2009 journal article
Flexible, durable printed electrical circuits
JOURNAL OF THE TEXTILE INSTITUTE, 100(1), 1–9.
author keywords: nonwovens; washability; electrical circuits; wearable electronics
Sources: Web Of Science, ORCID
Added: August 6, 2018
2008 conference paper
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging, 31(4), 749–758.
Sources: NC State University Libraries, ORCID
Added: August 6, 2018
2008 patent
Method and apparatus for a monodiameter wellbore, monodiameter casing, monobore, and/or monowell
Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
2008 journal article
Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks
JOURNAL OF THE TEXTILE INSTITUTE, 99(1), 37–45.
author keywords: conductive inks; electrical circuits; nonwovens; printing
Sources: Web Of Science, ORCID
Added: August 6, 2018
2007 article
Fully integrated AC coupled interconnect using buried bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
citeseerx.ist.psu.edu (repository)
Sources: Web Of Science, ORCID
Added: August 6, 2018
2007 journal article
Voltage-mode driver preemphasis technique for on-chip global buses
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 15(2), 231–236.
author keywords: global buses; low-power; on-chip; preemphasis; repeater insertion
Sources: Web Of Science, ORCID
Added: August 6, 2018
2006 journal article
3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver
IEEE Journal of Solid-State Circuits, 41(1), 287–296.
author keywords: AC coupled interconnect; bandlimited communications; buried bump technology; capacitive coupling; multichip modules; pulse receiver; pulse signaling
Sources: Web Of Science, Crossref, ORCID
Added: August 6, 2018
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.
Sources: Web Of Science, ORCID
Added: August 6, 2018
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018
2004 article
Buried bump and AC coupled interconnection technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
