Works (5)

Updated: July 5th, 2023 15:41

2014 journal article

Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(10), 1574โ€“1581.

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
author keywords: Coils; electronics packaging; inductive power transmission; omnidirectional antennas; planar arrays; three-dimensional integrated packaging
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 conference paper

A compact inductively coupled connector for mobile devices

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2385โ€“2390.

By: W. Zhao n, P. Gadfort n, E. Erickson n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies

2012 IEEE subthreshold microelectronics conference (SUBVT).

By: J. Ledford n, P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Design, modeling, and fabrication of mm(3) three-dimensional integrated antennas

2012 IEEE 62nd Electronic Components and Technology Conference (ECTC), 1794โ€“1799.

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

Near threshold RF-only analog to digital converter

2012 IEEE subthreshold microelectronics conference (SUBVT).

By: P. Gadfort n & P. Franzon nโ€‰

co-author countries: United States of America ๐Ÿ‡บ๐Ÿ‡ธ
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

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