2019 journal article
Insight on the Sequential Vapor Infiltration Mechanisms of Trimethylaluminum with Poly(methyl methacrylate), Poly(vinylpyrrolidone), and Poly(acrylic acid)
JOURNAL OF PHYSICAL CHEMISTRY C, 123(26), 16146–16152.
2017 journal article
Corrosion Protection of Copper Using Al2O3, TiO2, ZnO, HfO2, and ZrO2 Atomic Layer Deposition
ACS APPLIED MATERIALS & INTERFACES, 9(4), 4192–4201.
2016 journal article
Copper Benzenetricarboxylate Metal-Organic Framework Nucleation Mechanisms on Metal Oxide Powders and Thin Films formed by Atomic Layer Deposition
ACS APPLIED MATERIALS & INTERFACES, 8(14), 9514–9522.
Contributors: P. Lemaire n, J. Zhao n, n, H. Walls *, S. Shepherd*, M. Losego n, G. Peterson, G. Parsons n
2016 conference paper
Corrosion mitigation coatings for RF sources and components
2016 ieee international vacuum electronics conference (ivec).
2014 journal article
Conformal and highly adsorptive metal-organic framework thin films via layer-by-layer growth on ALD-coated fiber mats
JOURNAL OF MATERIALS CHEMISTRY A, 3(4), 1458–1464.
Contributors: J. Zhao n, B. Gong n, W. Nunn n, P. Lemaire n, E. Stevens n, F. Sidi n, n, C. Oldham n
2014 journal article
Highly Conductive and Conformal Poly(3,4-ethylenedioxythiophene) (PEDOT) Thin Films via Oxidative Molecular Layer Deposition
CHEMISTRY OF MATERIALS, 26(11), 3471–3478.
Contributors: S. Atanasov n, M. Losego n, B. Gong n, E. Sachet n, J. Maria n, n, G. Parsons n
2014 journal article
Highly adsorptive, MOF-functionalized nonwoven fiber mats for hazardous gas capture enabled by atomic layer deposition
Advanced Materials Interfaces, 1(4).
2014 journal article
Temperature-dependent reaction between trimethylaluminum and poly(methyl methacrylate) during sequential vapor infiltration: experimental and ab initio analysis
JOURNAL OF MATERIALS CHEMISTRY C, 2(44), 9416–9424.
2013 review
Mechanisms and reactions during atomic layer deposition on polymers
[Review of ]. COORDINATION CHEMISTRY REVIEWS, 257(23-24), 3323–3331.
Contributors: G. Parsons n , S. Atanasov n, E. Dandley n, C. Devine n, B. Gong n, J. Jur n, K. Lee n, C. Oldham n
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