Pouria Zaghari

College of Engineering

Works (1)

Updated: August 18th, 2023 05:00

2023 conference paper

Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package

2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Zaghari n, S. Sinha n, J. Ryu n , P. Franzon n  & D. Hopkins n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ

Event: 2023 IEEE International 3D Systems Integration Conference (3DIC)

author keywords: GaN power module; thermal reliability; mechanical stress; fatigue life prediction; finite element analysis
Sources: Web Of Science, Crossref, ORCID
Added: July 3, 2023