Pouria Zaghari

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

IEEE Transactions on Components, Packaging and Manufacturing Technology.

A 400W, 250kHz (2kW Peak) Integrated GaN Half Bridge Power Module in a Non-Isolated Buck Converter

2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, pp. 168–174.

Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors

APPLIED ARTIFICIAL INTELLIGENCE, 38(1).

Fabrication and anti-fouling performance assessment of micro-textured CNT-PDMS nanocomposites through the scalable roll-coating process

BIOFOULING, 40(10), 1012–1025.

Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 14(12), 2258–2270.

Microstructural behavior of CNT-PDMS thin-films for multifunctional systems

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 187.

Sol-gel fabricated one-dimensional LiFePO₄ microstructures for carbon nanotube-based nanocomposite freestanding sheet as cathode material for Li ion batteries

Al Shibli, H., Chaturvedi, P., Kanagaraj, A. B., Zaghari, P., Choi, D. S., & Ryu, J. E. (2024, January 2). JOURNAL OF COMPOSITE MATERIALS, Vol. 1.

Finite Element Analysis and Fatigue Life Prediction of a Laterally Conducting GaN-Based Power Package Under Thermal Cycling

Volume 12: Micro- and Nano-Systems Engineering and Packaging, Volume 12: Micro- and Nano-Systems Engineering and Packaging, V012T13A021.

Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package

2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC).

Design and fabrication of catalytic infrared fruit dryer to evaluate its performance in the bananas drying process

Journal of Food Processing and Preservation.