Stephen Mick

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

Fully integrated AC coupled interconnect using buried bumps

IEEE Transactions on Advanced Packaging, 30(2), 191–199.

Demystifying 3D ICs: The procs and cons of going vertical

IEEE Design & Test of Computers, 22(6), 498–510.

AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science, 51(5), 2156–2160.

Buried bump and AC coupled interconnection technology

IEEE Transactions on Advanced Packaging, 27(1), 121–125.

Causal reduced-order modeling of distributed structures in a transient circuit simulator

IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207–2214.

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.