Stephen Mick

Works (8)

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2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

By: K. Chandrasekar, J. Wilson, E. Erickson, Z. Feng, J. Xu, S. Mick, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2007 journal article

Fully integrated AC coupled interconnect using buried bumps

IEEE Transactions on Advanced Packaging, 30(2), 191–199.

By: J. Wilson, S. Mick, J. Xu, L. Luo, S. Bonafede, A. Huffman, R. LaBennett, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE Design & Test of Computers, 22(6), 498–510.

By: W. Davis, J. Wilson, S. Mick, M. Xu, H. Hua, C. Mineo, A. Sule, M. Steer, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

AC coupled interconnect for dense 3-D ICs

IEEE Transactions on Nuclear Science, 51(5), 2156–2160.

By: J. Xu, S. Mick, J. Wilson, L. Luo, K. Chandrasekar, E. Erickson, P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

Buried bump and AC coupled interconnection technology

IEEE Transactions on Advanced Packaging, 27(1), 121–125.

By: S. Mick, L. Luo, J. Wilson & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

2004 journal article

Causal reduced-order modeling of distributed structures in a transient circuit simulator

IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207–2214.

By: R. Mohan, M. Choi, S. Mick, F. Hart, K. Chandrasekar, A. Cangellaris, P. Franzon, M. Steer

Source: NC State University Libraries
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon, S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018