2008 conference paper
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging, 31(4), 749–758.
2007 journal article
Fully integrated AC coupled interconnect using buried bumps
IEEE Transactions on Advanced Packaging, 30(2), 191–199.
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE Design & Test of Computers, 22(6), 498–510.
2004 journal article
AC coupled interconnect for dense 3-D ICs
IEEE Transactions on Nuclear Science, 51(5), 2156–2160.
2004 journal article
Buried bump and AC coupled interconnection technology
IEEE Transactions on Advanced Packaging, 27(1), 121–125.
2004 journal article
Causal reduced-order modeling of distributed structures in a transient circuit simulator
IEEE Transactions on Microwave Theory and Techniques, 52(9), 2207–2214.
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.