Stephen Mick

Works (8)

Updated: July 5th, 2023 15:58
Download BibTeX Download Plain Text View JSON

2008 conference paper

Inductively coupled connectors and sockets for multi-Gb/s pulse signaling

IEEE Transactions on Advanced Packaging, 31(4), 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 article

Fully integrated AC coupled interconnect using buried bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede n, A. Huffman n, R. LaBennett n, P. Franzon n 

co-author countries: United States of America 🇺🇸
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
Sources: Web Of Science, ORCID
Added: August 6, 2018

2005 journal article

Demystifying 3D ICs: The procs and cons of going vertical

IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, M. Xu*, H. Hua*, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

co-author countries: United States of America 🇺🇸
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 article

Buried bump and AC coupled interconnection technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.

By: S. Mick n, L. Luo n, J. Wilson n & P. Franzon n 

co-author countries: United States of America 🇺🇸
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
Sources: Web Of Science, ORCID
Added: August 6, 2018

2004 journal article

Causal reduced-order modeling of distributed structures in a transient circuit simulator

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207–2214.

By: R. Mohan n, M. Choi*, S. Mick n, F. Hart n, K. Chandrasekar n, A. Cangellaris*, P. Franzon n , M. Steer n

co-author countries: United States of America 🇺🇸
author keywords: Foster's canonical model; transient circuit simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018