Stephen Mick

Works (8)

Updated: July 5th, 2023 15:58

2008 article

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, K., Wilson, J., Erickson, E., Feng, Z., Xu, J., Mick, S., & Franzon, P. (2008, November 1). IEEE Transactions on Advanced Packaging, Vol. 31, pp. 749–758.

By: K. Chandrasekar n, J. Wilson n, E. Erickson n, Z. Feng n, J. Xu n, S. Mick n, P. Franzon n 

topics (OpenAlex): Semiconductor Lasers and Optical Devices; 3D IC and TSV technologies; Advancements in PLL and VCO Technologies
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2007 article

Fully Integrated AC Coupled Interconnect Using Buried Bumps

Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May 1). IEEE Transactions on Advanced Packaging, Vol. 30, pp. 191–199.

By: J. Wilson n, S. Mick n, J. Xu n, L. Luo n, S. Bonafede*, A. Huffman*, R. LaBennett*, P. Franzon n 

author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
topics (OpenAlex): Advancements in PLL and VCO Technologies; Semiconductor materials and devices; 3D IC and TSV technologies
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2005 article

Demystifying 3D ICs: The Pros and Cons of Going Vertical

Davis, W. R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., … Franzon, P. D. (2005, June 1). IEEE Design & Test of Computers, Vol. 22, pp. 498–510.

By: W. Davis n , J. Wilson n, S. Mick n, J. Xu  n, H. Hua n, C. Mineo n, A. Sule n, M. Steer n, P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; VLSI and FPGA Design Techniques; Semiconductor materials and devices
TL;DR: A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2004 article

AC coupled interconnect for dense 3-D ICs

Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October 1). IEEE Transactions on Nuclear Science, Vol. 51, pp. 2156–2160.

By: J. Xu n, S. Mick n, J. Wilson n, L. Luo n, K. Chandrasekar n, E. Erickson n, P. Franzon n 

author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor Lasers and Optical Devices; Photonic and Optical Devices
TL;DR: This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs. (via Semantic Scholar)
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2004 article

Buried Bump and AC Coupled Interconnection Technology

Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February 1). IEEE Transactions on Advanced Packaging, Vol. 27, pp. 121–125.

By: S. Mick n, L. Luo n, J. Wilson n & P. Franzon n 

author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
topics (OpenAlex): Electronic Packaging and Soldering Technologies; 3D IC and TSV technologies; Integrated Circuits and Semiconductor Failure Analysis
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2004 article

Causal Reduced-Order Modeling of Distributed Structures in a Transient Circuit Simulator

Mohan, R., Choi, M. J., Mick, S. E., Hart, F. P., Chandrasekar, K., Cangellaris, A. C., … Steer, M. B. (2004, September 1). IEEE Transactions on Microwave Theory and Techniques, Vol. 52, pp. 2207–2214.

By: R. Mohan n, M. Choi*, S. Mick n, F. Hart n, K. Chandrasekar n, A. Cangellaris*, P. Franzon n , M. Steer n

author keywords: Foster's canonical model; transient circuit simulation
topics (OpenAlex): Electrostatic Discharge in Electronics; Lightning and Electromagnetic Phenomena; Electromagnetic Compatibility and Noise Suppression
TL;DR: The implementation of the Foster's model in the fREEDA circuit simulator is reported and the modeling of a two-port coupled inductor is presented as an example. (via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

patent

Buried solder bumps for AC-coupled microelectronic interconnects

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

patent

Inductively coupled electrical connectors

Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.

By: P. Franzon , S. Mick & J. Wilson

Source: NC State University Libraries
Added: August 6, 2018

Citation Index includes data from a number of different sources. If you have questions about the sources of data in the Citation Index or need a set of data which is free to re-distribute, please contact us.

Certain data included herein are derived from the Web of Science© and InCites© (2026) of Clarivate Analytics. All rights reserved. You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.