Works (8)
Updated: July 5th, 2023 15:58
2008 conference paper
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging, 31(4), 749–758.
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2007 article
Fully integrated AC coupled interconnect using buried bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., … Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191–199.
author keywords: AC coupled interconnect (ACCI); buried bumps; capacitive coupling; MCM; pulse signaling; noncontacting I/O; chip and package co-design
open access via citeseerx.ist.psu.edu (repository)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498–510.
TL;DR:
A practical introduction to the design trade-offs of the currently available 3D IC technology options is provided, with an analysis relating the number of transistors on a chip to the vertical interconnect density using estimates based on Rent's rule.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156–2160.
author keywords: AC coupled; inductive coupling; spiral inductor; three-dimensional integrated circuits (3-D ICs); through vias; vertical interconnect
TL;DR:
This paper presents the potential application of AC coupled interconnect (ACCI) for dense three-dimensional (3-D) integrated circuits (ICs) and concludes that inductive ACCI can provide small pitch vertical interconnects, as well as an excellent thermal solution for dense 3-D ICs.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 article
Buried bump and AC coupled interconnection technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121–125.
author keywords: capacity-coupled circuits; coupled interconnections; integrated circuits; I/O; solder bumps
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2004 journal article
Causal reduced-order modeling of distributed structures in a transient circuit simulator
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207–2214.
author keywords: Foster's canonical model; transient circuit simulation
TL;DR:
The implementation of the Foster's model in the fREEDA circuit simulator is reported and the modeling of a two-port coupled inductor is presented as an example.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
Source: NC State University Libraries
Added: August 6, 2018
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