2008 conference paper
Inductively coupled connectors and sockets for multi-Gb/s pulse signaling
IEEE Transactions on Advanced Packaging, 31(4), 749β758.
2007 article
Fully integrated AC coupled interconnect using buried bumps
Wilson, J., Mick, S., Xu, J., Luo, L., Bonafede, S., Huffman, A., β¦ Franzon, P. D. (2007, May). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 30, pp. 191β199.
2005 journal article
Demystifying 3D ICs: The procs and cons of going vertical
IEEE DESIGN & TEST OF COMPUTERS, 22(6), 498β510.
2004 article
AC coupled interconnect for dense 3-D ICs
Xu, J., Mick, S., Wilson, J., Luo, L., Chandrasekar, K., Erickson, E., & Franzon, P. D. (2004, October). IEEE TRANSACTIONS ON NUCLEAR SCIENCE, Vol. 51, pp. 2156β2160.
2004 article
Buried bump and AC coupled interconnection technology
Mick, S., Luo, L., Wilson, J., & Franzon, P. (2004, February). IEEE TRANSACTIONS ON ADVANCED PACKAGING, Vol. 27, pp. 121β125.
2004 journal article
Causal reduced-order modeling of distributed structures in a transient circuit simulator
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 52(9), 2207β2214.
patent
Buried solder bumps for AC-coupled microelectronic interconnects
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.
patent
Inductively coupled electrical connectors
Franzon, P. D., Mick, S. E., & Wilson, J. M. Washington, DC: U.S. Patent and Trademark Office.