Keith Markham

Works (4)

Updated: January 5th, 2026 12:55

2025 article

Compound semiconductor direct wafer bonding by crystal heterogeneous integration

Markham, K., Melkun, J. F., Rabbani, M., Winkler, C. R., Little, B., DeFevere, D. C., … Kish, F. (2025, December 22). Applied Physics Letters.

topics (OpenAlex): 3D IC and TSV technologies; GaN-based semiconductor devices and materials; Silicon Carbide Semiconductor Technologies
Source: NC State University Libraries
Added: December 24, 2025

2025 article

Visible-spectrum (405–505 nm) low-temperature-deposited deuterated (D) SiNx-SiOy waveguides

Markham, K., Rabbani, M., Hsiao, F.-C., Wierer, J., & Kish, F. (2025, January 27). Applied Physics Letters, Vol. 126.

By: K. Markham n, M. Rabbani n, F. Hsiao n, J. Wierer n & F. Kish n

topics (OpenAlex): Photonic and Optical Devices; Silicon Nanostructures and Photoluminescence; Semiconductor materials and devices
Sources: Web Of Science, ORCID
Added: January 27, 2025

2024 article

Wafer-bonded In0.53Ga0.47As/GaN p–n diodes with near-unity ideality factor

Sengupta, R., Little, B., Mita, S., Markham, K., Dycus, J. H., Stein, S., … Pavlidis, S. (2024, August 5). Applied Physics Letters.

topics (OpenAlex): GaN-based semiconductor devices and materials; Semiconductor Quantum Structures and Devices; Semiconductor materials and devices
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7. Affordable and Clean Energy (OpenAlex)
Source: Web Of Science
Added: August 26, 2024

2020 article

Prediction of relative globularization rates in α + β titanium alloys as a function of initial crystal orientation

Begley, B. A., Markham, K., Mizak, M., Pilchak, A. L., & Miller, V. M. (2020, March 17). Journal of Materials Research/Pratt's Guide to Venture Capital Sources.

By: B. Begley*, K. Markham n, M. Mizak n, A. Pilchak* & V. Miller*

author keywords: Ti; simulation; microstructure
topics (OpenAlex): Titanium Alloys Microstructure and Properties; Intermetallics and Advanced Alloy Properties; Aluminum Alloy Microstructure Properties
Source: Web Of Science
Added: May 18, 2020

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