Steven Lipa

Works (9)

Updated: July 5th, 2023 16:00

2022 journal article

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 30(9), 1230–1243.

By: T. Nigussie *, J. Schabel *, S. Lipa n, L. McIlrath *, R. Patti * & P. Franzon n 

author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
topics (OpenAlex): Physical Unclonable Functions (PUFs) and Hardware Security; Integrated Circuits and Semiconductor Failure Analysis; Electrostatic Discharge in Electronics
TL;DR: The results show that it should take more than 10 years to reconstruct the netlist using a brute-force attack if an adversary obtains either the fabricated wafers or their GDS. (via Semantic Scholar)
Sources: Web Of Science, ORCID, NC State University Libraries, Crossref
Added: August 15, 2022

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.

By: T. Nigussie*, T. Pan n, S. Lipa n, W. Pitts n, J. DeLaCruz* & P. Franzon n 

author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; VLSI and FPGA Design Techniques
TL;DR: Electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $\mathrm{1.6}\ \mu \ mathrm{m}$ pad pitch are presented. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021

2021 article proceedings

Design for 3D Stacked Circuits

By: P. Franzon n , W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Pan  n, L. Baker n ...

topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Interconnection Networks and Systems
TL;DR: 2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries, Crossref
Added: July 11, 2022

2017 conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

2017 IEEE International Conference on Computer Design (ICCD), 145–152.

By: V. Srinivasan n, R. Chowdhury*, E. Forbes*, R. Widialaksono*, Z. Zhang *, J. Schabel  n, S. Ku*, S. Lipa n ...

topics (OpenAlex): Parallel Computing and Optimization Techniques; Interconnection Networks and Systems; Embedded Systems Design Techniques
TL;DR: The H3 chip is presented, that uses 3D die stacking and novel microarchitecture to implement a heterogeneous multi-core processor (HMP) with low-latency fast thread migration capabilities and can reduce power consumption of benchmarks by up to 26%. (via Semantic Scholar)
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7. Affordable and Clean Energy (OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n , S. Priyadarshi n, S. Lipa n, W. Davis n  & T. Thorolfsson*

topics (OpenAlex): 3D IC and TSV technologies; Additive Manufacturing and 3D Printing Technologies; VLSI and FPGA Design Techniques
TL;DR: This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 conference paper

A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration

2012 ieee custom integrated circuits conference (cicc).

By: T. Thorolfsson*, S. Lipa n & P. Franzon n 

topics (OpenAlex): 3D IC and TSV technologies; Advanced MEMS and NEMS Technologies; Photonic and Optical Devices
TL;DR: This paper shows how this technique was used to build the first fine-grain partitioned 3D integrated system to be demonstrated with silicon measurements in the literature, which is an ultra efficient floating-point synthetic aperture radar (SAR) DSP processing unit. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2007 article

Nanodiamond and onion-like carbon polymer nanocomposites

DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1213–1217.

By: O. Shenderova*, T. Tyler*, G. Cunningham, M. Ray, J. Walsh, M. Casulli, S. Hens, G. McGuire, V. Kuznetsov, S. Lipa n

author keywords: diamond crystal; nanoparticles; nanotechnology
topics (OpenAlex): Carbon Nanotubes in Composites; Thermal properties of materials; Diamond and Carbon-based Materials Research
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Source: Web Of Science
Added: August 6, 2018

2007 article

Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007)

Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007, September). DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1770–1770.

By: O. Shenderova, T. Tyler, G. Cunningham, M. Ray, J. Walsh, M. Casulli, S. Hens, G. McGuire, V. Kuznetsov, S. Lipa n

topics (OpenAlex): Diamond and Carbon-based Materials Research
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Source: Web Of Science
Added: August 6, 2018

2001 journal article

Rotary traveling-wave oscillator arrays: A new clock technology

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 36(11), 1654–1665.

By: J. Wood, T. Edwards & S. Lipa n

author keywords: clocks; MOSFET oscillators; phase-locked oscillators; phased arrays; synchronization; timing circuits; transmission line resonators; traveling-wave amplifiers
topics (OpenAlex): Advancements in PLL and VCO Technologies; Radio Frequency Integrated Circuit Design; Electromagnetic Compatibility and Noise Suppression
UN Sustainable Development Goals Color Wheel
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy (OpenAlex)
Source: Web Of Science
Added: August 6, 2018

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