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2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021).
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 ieee international symposium on circuits and systems (iscas), 545–549.
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
2007 journal article
Nanodiamond and onion-like carbon polymer nanocomposites
Diamond and Related Materials, 16(4-7), 1213–1217.
2007 article
Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007)
Diamond and Related Materials, Vol. 16, pp. 1770–1770.
2001 journal article
Rotary traveling-wave oscillator arrays: A new clock technology
IEEE Journal of Solid-State Circuits, 36(11), 1654–1665.
conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
Srinivasan, V., Chowdhury, R. B. R., Forbes, E., Widialaksono, R., Zhang, Z. Q., Schabel, J., … Franzon, P. D. 2017 ieee 35th international conference on computer design (iccd), 145–152.
