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2022 journal article
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230–1243.
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
2021 article
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
2017 conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
2017 IEEE International Conference on Computer Design (ICCD), 145–152.
Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
2007 article
Nanodiamond and onion-like carbon polymer nanocomposites
DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1213–1217.
2007 article
Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007)
Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007, September). DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1770–1770.
2001 journal article
Rotary traveling-wave oscillator arrays: A new clock technology
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 36(11), 1654–1665.
