Works (9)
Updated: July 5th, 2023 16:00
2022 journal article
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230–1243.
author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
TL;DR:
The results show that it should take more than 10 years to reconstruct the netlist using a brute-force attack if an adversary obtains either the fabricated wafers or their GDS.
(via Semantic Scholar)
Sources: Web Of Science, ORCID, NC State University Libraries
Added: August 15, 2022
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
TL;DR:
Electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $\mathrm{1.6}\ \mu \ mathrm{m}$ pad pitch are presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021
2021 article
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
TL;DR:
2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: July 11, 2022
2017 conference paper
H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor
2017 IEEE International Conference on Computer Design (ICCD), 145–152.
Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017
TL;DR:
The H3 chip is presented, that uses 3D die stacking and novel microarchitecture to implement a heterogeneous multi-core processor (HMP) with low-latency fast thread migration capabilities and can reduce power consumption of benchmarks by up to 26%.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
TL;DR:
This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 conference paper
A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration
2012 ieee custom integrated circuits conference (cicc).
TL;DR:
This paper shows how this technique was used to build the first fine-grain partitioned 3D integrated system to be demonstrated with silicon measurements in the literature, which is an ultra efficient floating-point synthetic aperture radar (SAR) DSP processing unit.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2007 article
Nanodiamond and onion-like carbon polymer nanocomposites
DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1213–1217.
author keywords: diamond crystal; nanoparticles; nanotechnology
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Source: Web Of Science
Added: August 6, 2018
2007 article
Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007)
Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007, September). DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1770–1770.
UN Sustainable Development Goal Categories
3. Good Health and Well-being
(Web of Science)
Source: Web Of Science
Added: August 6, 2018
2001 journal article
Rotary traveling-wave oscillator arrays: A new clock technology
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 36(11), 1654–1665.
author keywords: clocks; MOSFET oscillators; phase-locked oscillators; phased arrays; synchronization; timing circuits; transmission line resonators; traveling-wave amplifiers
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Source: Web Of Science
Added: August 6, 2018
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