Works (9)

Updated: July 5th, 2023 16:00

2022 journal article

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning

IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 30(9), 1230–1243.

co-author countries: United States of America 🇺🇸
author keywords: Split-manufacturing; partitioning; design obfuscation; hybrid bonding; 3-D integrated circuit (3DIC)
Sources: Web Of Science, ORCID
Added: August 15, 2022

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.

By: T. Nigussie*, T. Pan n, S. Lipa n, W. Pitts n, J. DeLaCruz* & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
Sources: Web Of Science, ORCID
Added: November 1, 2021

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon n, W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Pan n, L. Baker n ...

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: July 11, 2022

2017 conference paper

H3 (heterogeneity in 3D): A logic-on-logic 3D-stacked heterogeneous multi-core processor

2017 IEEE International Conference on Computer Design (ICCD), 145–152.

By: V. Srinivasan n, R. Chowdhury*, E. Forbes*, R. Widialaksono*, Z. Zhang*, J. Schabel n, S. Ku*, S. Lipa n ...

co-author countries: United States of America 🇺🇸

Event: 2017 IEEE International Conference on Computer Design (ICCD) at Boston, MA on November 5-8, 2017

Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n, S. Priyadarshi n, S. Lipa n, W. Davis n & T. Thorolfsson*

co-author countries: United States of America 🇺🇸

Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 conference paper

A 10.35 mW/GFlop Stacked SAR DSP unit using fine-grain partitioned 3D integration

2012 ieee custom integrated circuits conference (cicc).

By: T. Thorolfsson n, S. Lipa n & P. Franzon n

co-author countries: United States of America 🇺🇸
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2007 article

Nanodiamond and onion-like carbon polymer nanocomposites

DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1213–1217.

By: O. Shenderova*, T. Tyler*, G. Cunningham, M. Ray, J. Walsh, M. Casulli, S. Hens, G. McGuire, V. Kuznetsov, S. Lipa n

co-author countries: Russian Federation 🇷🇺 United States of America 🇺🇸
author keywords: diamond crystal; nanoparticles; nanotechnology
Source: Web Of Science
Added: August 6, 2018

2007 article

Nanodiamond and onion-like carbon polymer nanocomposites (vol 16, pg 1213, 2007)

Shenderova, O., Tyler, T., Cunningham, G., Ray, M., Walsh, J., Casulli, M., … Lipa, S. (2007, September). DIAMOND AND RELATED MATERIALS, Vol. 16, pp. 1770–1770.

By: O. Shenderova, T. Tyler, G. Cunningham, M. Ray, J. Walsh, M. Casulli, S. Hens, G. McGuire, V. Kuznetsov, S. Lipa n

co-author countries: Russian Federation 🇷🇺 United States of America 🇺🇸
Source: Web Of Science
Added: August 6, 2018

2001 journal article

Rotary traveling-wave oscillator arrays: A new clock technology

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 36(11), 1654–1665.

By: J. Wood, T. Edwards* & S. Lipa n

co-author countries: United Kingdom of Great Britain and Northern Ireland 🇬🇧 United States of America 🇺🇸
author keywords: clocks; MOSFET oscillators; phase-locked oscillators; phased arrays; synchronization; timing circuits; transmission line resonators; traveling-wave amplifiers
Source: Web Of Science
Added: August 6, 2018