Works (8)

2018 journal article

An Electrostatic Discharge Protection Circuit Technique for the Mitigation of Single-Event Transients in SiGe BiCMOS Technology

IEEE Transactions on Nuclear Science, 65(1), 426–431.

By: M. Cho, I. Song, S. Pavlidis, Z. Fleetwood, S. Buchner, D. McMorrow, P. Paki, J. Cressler

Source: Crossref
Added: July 20, 2019

2018 journal article

RWW 2019-Five Colocated Conferences, Five Special Features

IEEE MICROWAVE MAGAZINE, 19(7), 29-.

By: S. Pavlidis

Source: NC State University Libraries
Added: November 5, 2018

2018 journal article

p-n-p-Based RF Switches for the Mitigation of Single-Event Transients in a Complementary SiGe BiCMOS Platform

IEEE Transactions on Nuclear Science, 65(1), 391–398.

By: I. Song, M. Cho, Z. Fleetwood, Y. Gong, S. Pavlidis, S. Buchner, D. McMorrow, P. Paki, M. Kaynak, J. Cressler

Source: Crossref
Added: July 20, 2019

2017 journal article

ALD TiO x as a top-gate dielectric and passivation layer for InGaZnO115 ISFETs

Semiconductor Science and Technology, 32(11), 114004.

By: S. Pavlidis, B. Bayraktaroglu, K. Leedy, W. Henderson, E. Vogel & O. Brand

Source: Crossref
Added: July 20, 2019

2017 journal article

Characterization of AlGaN/GaN HEMTs Using Gate Resistance Thermometry

IEEE Transactions on Electron Devices, 64(1), 78–83.

By: G. Pavlidis, S. Pavlidis, E. Heller, E. Moore, R. Vetury & S. Graham

Source: Crossref
Added: July 20, 2019

2017 journal article

Direct correlation between potentiometric and impedance biosensing of antibody-antigen interactions using an integrated system

Applied Physics Letters, 111(7), 073701.

By: M. Tsai, N. Creedon, E. Brightbill, S. Pavlidis, B. Brown, D. Gray, N. Shields, R. Sayers ...

Source: Crossref
Added: July 20, 2019

2017 journal article

Encapsulated Organic Package Technology for Wideband Integration of Heterogeneous MMICs

IEEE Transactions on Microwave Theory and Techniques, 65(2), 438–448.

By: S. Pavlidis, G. Alexopoulos, A. Ulusoy, M. Cho & J. Papapolymerou

Source: Crossref
Added: July 20, 2019

2016 journal article

Size-Scalable and High-Density Liquid-Metal-Based Soft Electronic Passive Components and Circuits Using Soft Lithography

Advanced Functional Materials, 27(3), 1604466.

By: M. Kim, H. Alrowais, S. Pavlidis & O. Brand

Source: Crossref
Added: July 20, 2019