Spyridon Pavlidis

Cho, M.-K., Song, I., Pavlidis, S., Fleetwood, Z. E., Buchner, S. P., McMorrow, D., … Cressler, J. D. (2018). An Electrostatic Discharge Protection Circuit Technique for the Mitigation of Single-Event Transients in SiGe BiCMOS Technology. IEEE Transactions on Nuclear Science, 65(1), 426–431. https://doi.org/10.1109/tns.2017.2778946

Pavlidis, S. (2018). RWW 2019-Five Colocated Conferences, Five Special Features. IEEE MICROWAVE MAGAZINE, 19(7), 29-. https://doi.org/10.1109/MMM.2018.2862598

Song, I., Cho, M.-K., Fleetwood, Z. E., Gong, Y., Pavlidis, S., Buchner, S. P., … Cressler, J. D. (2018). p-n-p-Based RF Switches for the Mitigation of Single-Event Transients in a Complementary SiGe BiCMOS Platform. IEEE Transactions on Nuclear Science, 65(1), 391–398. https://doi.org/10.1109/tns.2017.2780120

Pavlidis, S., Bayraktaroglu, B., Leedy, K., Henderson, W., Vogel, E., & Brand, O. (2017). ALD TiO x  as a top-gate dielectric and passivation layer for InGaZnO115 ISFETs. Semiconductor Science and Technology, 32(11), 114004. https://doi.org/10.1088/1361-6641/aa8b33

Pavlidis, G., Pavlidis, S., Heller, E. R., Moore, E. A., Vetury, R., & Graham, S. (2017). Characterization of AlGaN/GaN HEMTs Using Gate Resistance Thermometry. IEEE Transactions on Electron Devices, 64(1), 78–83. https://doi.org/10.1109/ted.2016.2625264

Tsai, M.-Y., Creedon, N., Brightbill, E., Pavlidis, S., Brown, B., Gray, D. W., … Vogel, E. M. (2017). Direct correlation between potentiometric and impedance biosensing of           antibody-antigen interactions using an integrated system. Applied Physics Letters, 111(7), 073701. https://doi.org/10.1063/1.4986190

Pavlidis, S., Alexopoulos, G., Ulusoy, A. C., Cho, M.-K., & Papapolymerou, J. (2017). Encapsulated Organic Package Technology for Wideband Integration of Heterogeneous MMICs. IEEE Transactions on Microwave Theory and Techniques, 65(2), 438–448. https://doi.org/10.1109/tmtt.2016.2630067

Kim, M.-gu, Alrowais, H., Pavlidis, S., & Brand, O. (2016). Size-Scalable and High-Density Liquid-Metal-Based Soft Electronic Passive Components and Circuits Using Soft Lithography. Advanced Functional Materials, 27(3), 1604466. https://doi.org/10.1002/adfm.201604466