Works (8)
Updated: July 5th, 2023 15:46
2014 conference paper
Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC
2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).
Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)
TL;DR:
A CAD flow and associated framework called Pathfinder3D is presented, which facilitates physically-aware system-level thermal simulation of 3DICs and facilitates early thermal evaluation of possible 3D design choices and thermal management techniques.
(via Semantic Scholar)
Sources: NC State University Libraries, Crossref, NC State University Libraries
Added: August 6, 2018
2014 journal article
Thermal Pathfinding for 3-D ICs
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.
author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
TL;DR:
A pathfinding flow that integrates SystemC transaction-level electrical and dynamic thermal simulations to pass complex physical constraints to system architects in a convenient form is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Exploring early design tradeoffs in 3DIC
2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.
Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013
TL;DR:
This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2013 conference paper
Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors
Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.
Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013
TL;DR:
This work proposes exploiting two complementary forms of heterogeneity to profitably exploit an immature technology for Chip Multiprocessors (CMP): 3D integration facilitates a technology alloy and application and microarchitectural heterogeneity is exploited to compensate for lower efficiency of old-technology cores.
(via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.
author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2012 journal article
Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.
TL;DR:
This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD).
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018
2012 journal article
Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
TL;DR:
A parallel delay-based iterative approach for interfacing delay-partitioned subcircuits is applied, which achieves the reasonable accuracy of nonparallel circuit simulation if both incorporate the same interblock delay.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
2011 journal article
SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation
IET CIRCUITS DEVICES & SYSTEMS, 5(6), 477–483.
TL;DR:
A comprehensive and accurate SPICE-compatible physical equation-based model of nanocrystal floating gate devices is developed based on uniform direct Tunnelling and Fowler-Nordheim tunnelling based on a Verilog-A module that captures the physical behaviours of programming and erasing the device.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
7. Affordable and Clean Energy
(OpenAlex)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018
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