2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).

By: S. Priyadarshi n, W. Davis n & P. Franzon n

Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

Sources: NC State University Libraries, Crossref, ORCID
Added: August 6, 2018

2014 journal article

Thermal Pathfinding for 3-D ICs

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.

By: S. Priyadarshi n, W. Davis n, M. Steer n & P. Franzon n

author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n, S. Priyadarshi n, S. Lipa n, W. Davis n & T. Thorolfsson*

Event: 2013 IEEE International Symposium on Circuits and Systems (ISCAS) at Beijing, China on May 19-23, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.

By: S. Priyadarshi n, N. Choudhary n, B. Dwiel n, A. Upreti n, E. Rotenberg n, R. Davis n, P. Franzon n

Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013

Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar*, S. Dooley*, N. Kriplani n, W. Davis n ...

author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
Sources: Web Of Science, ORCID
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n, M. Steer n, W. Davis n

co-author countries: Japan 🇯🇵
Sources: NC State University Libraries, ORCID
Added: August 6, 2018

2012 journal article

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.

By: S. Priyadarshi n, C. Saunders*, N. Kriplani n, H. Demircioglu n, W. Davis n, P. Franzon n, M. Steer n

co-author countries: Sweden 🇸🇪
author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
Sources: Web Of Science, ORCID
Added: August 6, 2018

2011 journal article

SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation

IET CIRCUITS DEVICES & SYSTEMS, 5(6), 477–483.

By: D. Schinke n, S. Priyadarshi n, W. Pitts n, N. Di Spigna n & P. Franzon n

Sources: Web Of Science, ORCID
Added: August 6, 2018

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