Shivam Priyadarshi

Works (8)

Updated: July 5th, 2023 15:46

2014 conference paper

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC

2014 IEEE International Conference on IC Design & Technology. Presented at the 2014 IEEE International Conference on IC Design & Technology (ICICDT).

By: S. Priyadarshi n, W. Davis  n & P. Franzon n 

Event: 2014 IEEE International Conference on IC Design & Technology (ICICDT)

TL;DR: A CAD flow and associated framework called Pathfinder3D is presented, which facilitates physically-aware system-level thermal simulation of 3DICs and facilitates early thermal evaluation of possible 3D design choices and thermal management techniques. (via Semantic Scholar)
Sources: NC State University Libraries, Crossref, NC State University Libraries
Added: August 6, 2018

2014 journal article

Thermal Pathfinding for 3-D ICs

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 4(7), 1159–1168.

By: S. Priyadarshi n, W. Davis  n, M. Steer n & P. Franzon n 

author keywords: 3-D IC; electronic system-level (ESL); electrothermal simulation; pathfinding; through-silicon via (TSV); transaction-level simulation
TL;DR: A pathfinding flow that integrates SystemC transaction-level electrical and dynamic thermal simulations to pass complex physical constraints to system architects in a convenient form is presented. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2013 conference paper

Exploring early design tradeoffs in 3DIC

2013 IEEE International Symposium on Circuits and Systems (ISCAS), 545–549.

By: P. Franzon n , S. Priyadarshi n, S. Lipa n, W. Davis n  & T. Thorolfsson*

TL;DR: This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that exploration, together with early results from a thermal pathfinding tool. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2013 conference paper

Hetero(2) 3d integration: A scheme for optimizing efficiency/cost of chip multiprocessors

Proceedings of the fourteenth international symposium on quality electronic design (ISQED 2013), 1–7.

By: S. Priyadarshi n, N. Choudhary n, B. Dwiel n, A. Upreti n, E. Rotenberg n, R. Davis  n, P. Franzon n 

Event: International Symposium on Quality Electronic Design (ISQED) at Santa Clara, CA on March 4-6, 2013

TL;DR: This work proposes exploiting two complementary forms of heterogeneity to profitably exploit an immature technology for Chip Multiprocessors (CMP): 3D integration facilitates a technology alloy and application and microarchitectural heterogeneity is exploited to compensate for lower efficiency of old-technology cores. (via Semantic Scholar)
Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 journal article

A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2(4), 660–667.

By: T. Harris n, S. Priyadarshi n, S. Melamed n, C. Ortega*, R. Manohar *, S. Dooley*, N. Kriplani n, W. Davis n  ...

author keywords: 3DIC; electrothermal effects; thermal management; transient analysis
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2012 journal article

Junction-level thermal analysis of 3-D integrated circuits using high definition power blurring

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 31(5), 676–689.

By: S. Melamed*, T. Thorolfsson*, T. Harris*, S. Priyadarshi n, P. Franzon n , M. Steer n, W. Davis n 

TL;DR: This paper presents a resistive mesh-based approach that improves on the fidelity of prior approaches by constructing a thermal model of the full structure of 3DICs, including the interconnect, and introduces a method for dividing the thermal response caused by a heat load into a high fidelity “near response” and a lower fidelity” in order to implement Power Blurring high definition (HD). (via Semantic Scholar)
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Sources: NC State University Libraries, NC State University Libraries
Added: August 6, 2018

2012 journal article

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 31(10), 1522–1535.

By: S. Priyadarshi n, C. Saunders*, N. Kriplani n, H. Demircioglu n, W. Davis  n, P. Franzon n , M. Steer n

author keywords: Delay element; electrothermal simulation; multicore; multiphysics; parallel simulation; parallelization; transient simulation
TL;DR: A parallel delay-based iterative approach for interfacing delay-partitioned subcircuits is applied, which achieves the reasonable accuracy of nonparallel circuit simulation if both incorporate the same interblock delay. (via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

2011 journal article

SPICE-compatible physical model of nanocrystal floating gate devices for circuit simulation

IET CIRCUITS DEVICES & SYSTEMS, 5(6), 477–483.

By: D. Schinke n, S. Priyadarshi n, W. Pitts n, N. Di Spigna n & P. Franzon n 

TL;DR: A comprehensive and accurate SPICE-compatible physical equation-based model of nanocrystal floating gate devices is developed based on uniform direct Tunnelling and Fowler-Nordheim tunnelling based on a Verilog-A module that captures the physical behaviours of programming and erasing the device. (via Semantic Scholar)
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Sources: Web Of Science, NC State University Libraries
Added: August 6, 2018

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