Sourish Sankar Sinha

College of Engineering

Works (2)

Updated: September 9th, 2023 05:00

2023 conference paper

Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates

2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2596–2603.

By: S. Sinha n, T. Cheng n, K. Parmar n & D. Hopkins n

co-author countries: United States of America 🇺🇸

Event: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

author keywords: GaN power module; thin substrate; substrate current; Double Pulse Test; Full Bridge Converter
Sources: Web Of Science, Crossref, ORCID
Added: July 3, 2023

2023 conference paper

Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package

2023 IEEE International 3D Systems Integration Conference (3DIC). Presented at the 2023 IEEE International 3D Systems Integration Conference (3DIC).

By: P. Zaghari n, S. Sinha n, J. Ryu n, P. Franzon n & D. Hopkins n

co-author countries: United States of America 🇺🇸

Event: 2023 IEEE International 3D Systems Integration Conference (3DIC)

author keywords: GaN power module; thermal reliability; mechanical stress; fatigue life prediction; finite element analysis
Sources: Web Of Science, Crossref, ORCID
Added: July 3, 2023

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