Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
RDL and interposer design for DiRAM4 interfaces
Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.