2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021).

By: T. Nigussie, T. Pan, S. Lipa, W. Pitts, J. DeLaCruz & P. Franzon

Source: Web Of Science
Added: November 1, 2021

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon, W. Davis, E. Rotenberg, J. Stevens, S. Lipa, T. Nigussie, H. Pan, L. Baker ...

Source: Web Of Science
Added: July 11, 2022

conference paper

RDL and interposer design for DiRAM4 interfaces

Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.

By: T. Nigussie & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018