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Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021).
By: T. Nigussie, T. Pan, S. Lipa, W. Pitts, J. DeLaCruz & P. Franzon
Design for 3D Stacked Circuits
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).
By: P. Franzon, W. Davis, E. Rotenberg, J. Stevens, S. Lipa, T. Nigussie, H. Pan, L. Baker ...and 3 other authors, including 1 NC State author, J. Schabel, S. Dey & W. Li
RDL and interposer design for DiRAM4 interfaces
Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.
By: T. Nigussie & P. Franzon