Works (3)
Updated: April 11th, 2023 10:13
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; VLSI and FPGA Design Techniques
TL;DR:
Electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $\mathrm{1.6}\ \mu \ mathrm{m}$ pad pitch are presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021
2021 article proceedings
Design for 3D Stacked Circuits
topics (OpenAlex): 3D IC and TSV technologies; Semiconductor materials and devices; Interconnection Networks and Systems
TL;DR:
2.5D and 3D technologies can give rise to a node equivalent of scaling due to improved connectivity because of improved connectivity, but design issues that need to be addressed in pursuing such exploitations include thermal management, design for test and computer aided design.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: July 11, 2022
conference paper
RDL and interposer design for DiRAM4 interfaces
Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.
Source: NC State University Libraries
Added: August 6, 2018