Works (3)

Updated: April 11th, 2023 10:13

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.

By: T. Nigussie*, T. Pan n, S. Lipa n, W. Pitts n, J. DeLaCruz* & P. Franzon n

co-author countries: United States of America 🇺🇸
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
Sources: Web Of Science, ORCID
Added: November 1, 2021

2021 article

Design for 3D Stacked Circuits

2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM).

By: P. Franzon n, W. Davis n, E. Rotenberg n, J. Stevens n, S. Lipa n, T. Nigussie n, H. Pan n, L. Baker n ...

co-author countries: United States of America 🇺🇸
Sources: Web Of Science, ORCID
Added: July 11, 2022

conference paper

RDL and interposer design for DiRAM4 interfaces

Nigussie, T., & Franzon, P. D. Ieee conference on electrical performance of electronic packaging and, 17–19.

By: T. Nigussie & P. Franzon

Source: NC State University Libraries
Added: August 6, 2018

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