Theodros Nigussie

Nigussie, T., Pan, T.-H., Lipa, S., Pitts, W. S., DeLaCruz, J., & Franzon, P. (2021). Design Benefits of Hybrid Bonding for 3D Integration. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881. https://doi.org/10.1109/ECTC32696.2021.00296

Franzon, P., Davis, W., Rotenberg, E., Stevens, J., Lipa, S., Nigussie, T., … Li, W. (2021). Design for 3D Stacked Circuits. 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM). https://doi.org/10.1109/IEDM19574.2021.9720553

Nigussie, T., & Franzon, P. D. RDL and interposer design for DiRAM4 interfaces. Ieee conference on electrical performance of electronic packaging and, 17–19.