Tse-Han Pan

College of Engineering

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021).

By: T. Nigussie, T. Pan, S. Lipa, W. Pitts, J. DeLaCruz & P. Franzon

Source: Web Of Science
Added: November 1, 2021