Tse-Han Pan
College of Engineering
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Works (3)
Updated: April 5th, 2024 14:37
2023 article proceedings
Chiplet Set For Artificial Intelligence
author keywords: ASIP; chiplet; AI accelerator; AIB
topics (OpenAlex): Advanced Memory and Neural Computing; Ferroelectric and Negative Capacitance Devices; VLSI and Analog Circuit Testing
TL;DR:
This paper presents a chipletized design used for Artificial Intelligence, which details a scalable AI chiplet set, along with Central Processing Units (CPUs), and focuses on phase one, which uses the United Semiconductor Japan Co. (USJC) 55 nm LP process to fabricate the design.
(via Semantic Scholar)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: August 14, 2023
2023 article proceedings
System Aware Floorplanning for Chip-Package Co-design
author keywords: Floorplanning; Chip-package co-design
topics (OpenAlex): VLSI and FPGA Design Techniques; VLSI and Analog Circuit Testing; Low-power high-performance VLSI design
TL;DR:
A new floorplanning solution based on a novel floorplan model that more closely depicts the design challenges imposed by modern SoC system constraints is presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
11. Sustainable Cities and Communities
(OpenAlex)
Sources: Web Of Science, NC State University Libraries, Crossref
Added: January 2, 2024
2021 article
Design Benefits of Hybrid Bonding for 3D Integration
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
topics (OpenAlex): 3D IC and TSV technologies; Electronic Packaging and Soldering Technologies; VLSI and FPGA Design Techniques
TL;DR:
Electrical and thermal analyses of 3D digital designs using hybrid bonding, specifically using the design rules, and other properties, for the XPERI DBI® technology at a $\mathrm{1.6}\ \mu \ mathrm{m}$ pad pitch are presented.
(via Semantic Scholar)
UN Sustainable Development Goal Categories
9. Industry, Innovation and Infrastructure
(Web of Science)
Sources: Web Of Science, NC State University Libraries
Added: November 1, 2021