Tse-Han Pan

College of Engineering

Works (2)

Updated: August 18th, 2023 05:00

2023 article

Chiplet Set For Artificial Intelligence

2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC.

By: J. Stevens n, T. Pan n, P. Ravichandiran n & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: ASIP; chiplet; AI accelerator; AIB
Sources: Web Of Science, ORCID
Added: August 14, 2023

2021 article

Design Benefits of Hybrid Bonding for 3D Integration

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881.

By: T. Nigussie*, T. Pan n, S. Lipa n, W. Pitts n, J. DeLaCruz* & P. Franzon n 

co-author countries: United States of America πŸ‡ΊπŸ‡Έ
author keywords: 3DIC; Hybrid bonding; DBI; Thermo-Compression Bonding; Partitioning; 3D design flow
Sources: Web Of Science, ORCID
Added: November 1, 2021