Tse-Han Pan

Nigussie, T., Pan, T.-H., Lipa, S., Pitts, W. S., DeLaCruz, J., & Franzon, P. (2021). Design Benefits of Hybrid Bonding for 3D Integration. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1876–1881. https://doi.org/10.1109/ECTC32696.2021.00296